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IMAPS leads the Microelectronics Packaging,
Interconnect and Assembly Community, providing means of
communicating, educating and interacting at all levels.
The International Microelectronics And Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. Our Society offers chapters around the globe, creating global networks of more than 4,000 members in the United States and an additional 4,000 members throughout Europe and Asia.
Under its 4-tier technical model, IMAPS produces numerous publications, workshops, and international conferences and exhibitions that address everything in electronics between the chip and the system.
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Featured Event:
Device Packaging 2010
March 8-11, 2010
Radisson Ft. McDowell
Ft. Hills, Arizona
- 6 Technical Tracks: 3D, Flip Chip, MEMS, Wafer Level Pack., LEDs and Passives.
- 4 Keynote Speakers: Prismark, DARPA, Yole and Qualcomm
- 8 Prof. Dev. Courses (PDCs): 3D Int., Area Array, MEMS, Stacked Die, 3D, Chip Attach, Hermeticity, and Wire Bonding
- Device Packaging Exhibit Hall
- 3D Integration and Wafer Level Packaging Panel Discussions
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Co-located Global Business Council Conference on Emerging Markets
Hotel Deadline: Feb 4, 2010
Earyl Registration: Feb 19, 2010
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Email Bulletins - Sign Up
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| IMAPS Press Releases |
| Industry Press Coverage |
| Industry News
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IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 |
E-mail: imaps@imaps.org |
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