IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community,
providing means of communicating, educating and interacting at all levels.

The International Microelectronics Assembly and Packaging Society is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. IMAPS produces numerous publications, workshops, international conferences, professional development courses, and exhibitions bringing together the entire microelectronics supply chain. Our events and products focus on those technologies critical to the present and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging,Thermal Management, Printed Electronics, Advanced Materials, Photonics, Modeling/Design and many others. (Read more about IMAPS)

Heraeus TFD

IMAPS 2014 - San Diego
Webinars (On-line Meetings)
Calendar of Events
Nano Devices 2014
April 29-30, 2014
HiTEC 2014 (High Temp.)
May 13-15, 2014
IMAPS 2014 (San Diego)
October 13-16, 2014
Thermal Management
October 28-30, 2014
Submit Abstracts
Author Information
Technical Program Archives

Featured CD-Roms & USB Drives:
IMAPS 2013 Orlando USB
HiTEN 2013 CD
Medical/Hi-Rel 2013 CD
Nano 2013 Workshop

Device Packaging 2013 USB
Wire Bonding 2013 CD

Thermal Management 2012 CD
IMAPS 2012 San Diego USB
Device Packaging 2012 USB

Featured Webinar Replay:
Jessica Sylvester

iKNOW Microelectronics
IMAPS On-line Library

Find Papers in iKNOW
Keyword(s): 
Author:
Year:

Advancing Microelectronics Magazine Advancing Microelectronics
2014 - Issue 1
DPC, Wafer Level Packaging, IPD
Journal of Microelectronics and Electronic Packaging (JMEP)

Journal of Microelectronics and Electronic Packaging
2014 - 1st Quarter

Subscribe to JMEP 2014

Q1 2014 JMEP Featured Papers:

Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding

LT-TLPS Die Attach for High Temperature Electronic Packaging

Redistribution Layers (RDLs) for 2.5D/3D IC Integration

Reliability of SiC Digital Telemetry Circuits on AlN Substrate

Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures

Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates

Ultra Low Weight Spacer for PCB to PCB Interconnections

Purchase CD-Roms, and Books
Advertising Opportunities

Log-in | Join/Renew | Why Join?

Members Only - "My IMAPS"
- My Profile
- My Orders
- My Chapters/Committees
- My Events
- Member Directory
- Company Directory

IMAPS Awards
About, Recipients, Nominations...

Global Business Council
Addressing the Business Side of Microelectronics!

GBC Corporate Spotlight
ALLVIA
GBC Corporate Spotlight: ALLVIA

Member Spotlight

Lee Smith, Plexus Corporation
Lee Smith


RGL Enterprises

MST

Palomar Technologies

   
EPP  

 

 

Metallix

Torrey Hills Technologies

Oneida Research Services

BIOSENSORS 2014

Petroferm

Master Bond

RGL Enterprises


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001