9th International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
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Conference and Technical Workshops
March
12-14, 2013
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Exhibition and Technology Showcase
March
12-13, 2013 |
Professional
Development Courses
March 11, 2013 |
GBC
Spring Conference
March
10-11, 2013 |
In conjunction with
the Global Business Council (GBC) Spring
Conference, March 10-11
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Courtesy of Rensselaer Polytechnic Institute |
Courtesy of US Army RDEDCOM AMRDEC |
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General Chair:
James Lu
Rensselaer Polytechnic Institute
General Chair-elect (PDCs):
TBD
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Past General Chair (Panels):
Peter Elenius
E&G Technology Partners
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Abstract Deadline: November 16, 2012 |
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Submit Abstracts | Professional Development Courses (PDCs)
Exhibition Details | Floorplan | 2012 Exhibitors | 2013 Exhibitors
Global Business Council (GBC) Spring
Conference
Spring Golf Invitational | Texas Hold'em Tournament
Device Packaging 2012 was another great conference. The exhibit hall sold again for the 7th consecutive year. We saw an increase in attendance with more than 560 participating in 2012. The Conference USB of Technical Presentations is behind schedule but should be available/shipped the week of April 23. Planning is already under way for 2013. Abstracts will be accepted in the weeks ahead and pre-sales for booth space should begin in July.
2013 Conference Overview:
The ninth Annual Device Packaging Conference (DPC2013) will be held in Scottsdale, Arizona, on March 11-14, 2013. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
The 2013 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging:
- 2.5D & 3D IC & Packaging;
- Flip Chip & Wafer Level Packaging;
- MEMS & Associated Microsystems;
- High Brightness LEDs; and
- Passive Integration
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically IMMEDIATELY, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 25, 2013. A post-conference USB or CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.
The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. A maximum of 65 full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information (AVAILABLE SOON) or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 5th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 no later than November 16, 2012.
Student Competition sponsored by The Microelectronics Foundation:
The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student with "best presentation". The selected student must attend the event to present his or her work and receive the award. |
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Housing
Hotel Reservation Deadline - February 1, 2013
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
$155 single/double
Phone Reservations: (480) 789-5300
Online Reservations:
TBD
Speaker Dates/Information:
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Student Paper Competition
Sponsor:
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