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4th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer
602-431-4764 |

Conference and Technical Workshops
March 17-20, 2008
Exhibition and Technology Showcase
March 18-19, 2008
Professional Development Courses
March 17, 2008
GBC Spring Conference
March 16-17, 2008

Announcement and Call for Abstracts
Advanced Technology Workshop on

3D Packaging

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline:  November 30, 2007

Technical Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
Troy, NY 12180
Phone: 518-276-2909
Technical Chair:
Christo Bojkov
Maxim-Dallas Semiconductor
Dallas, TX 75244
Phone: 972-371-6149
3D Packaging Organizing Committee:
Sitaram Arkalgud, SEMATECH
Flynn Carson, STATS ChipPAC, Inc.
Kuan-Neng Chen, IBM T.J. Watson Research Ctr.
Philip Garrou, Microelectronic Consultants of NC
Morihiro Kada, ASET - Association of Super-Advanced Electronic Technologies
Daniel D. Lu, Intel Corporation
Thorsten Matthias, EVGroup
Peter Ramm, Fraunhofer IZM, Munich
Leonard W. Schaper, University of Arkansas
Paul Siblerud, Semitool, Inc.; Program Director of EMC-3D Consortium
Lee Smith, Amkor Technology

Hotel Information | Speaker Information | Exhibit Information | Reserve Booth(s) |
Professional Development Courses (PDCs)

Workshops: 3D Packaging | Flip Chip Technologies | Electronic Packaging Issues for Medical Devices |
MEMS & Associated Microsystems
| Wafer Level Packaging/Embedded Packaging

The technical program is being finalized and will be available on-line the week of January 14, 2008.
Please check back at that time to view the technical program and to register for the conference.

3D Packaging Workshop Focus:
The objective of the 3D Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of 3D Packaging.  This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to 3D Packaging technologies, as well as to bridge the gap between the back-end wafer-level 3D integration and 3D packaging, covering wire-bonded chip stack, system-in-packaging (SiP), package-on-package (PoP), through-silicon-via (TSV) based die-to-die (or chip), die-to-wafer, and wafer-to-wafer 3D approaches.   

Attendees and presenters in the past have found that the 3D Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry.  If you are working in any area of electronics packaging or microelectronics, the Workshop on 3D packaging technologies would be well worth attending. Abstracts were requested on the following topics:

  • Stacked Die
  • Stacked Packages
  • PWB Embedded Device Technologies
  • Memory Cubes
  • Folded Flex
  • Through Silicon Vias
  • Vertical Interconnects
  • Thin Wafer Processing
  • Assembly Processes and Handling Issues
  • Testing and Probing Challenges
  • Failure Analysis and Reliability
  • Simulation and Modeling
  • Applications and System Requirements
  • Thermal Management

The 3D Packaging Workshop will also be organizing an evening Panel Session on “Roadmap of 3D Integration and Packaging” on Wednesday, March 19th, at 7pm.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of 3D Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference.


Interested in Exhibits? Contact Ann Bell -
Interested in helping organize the 2008 Conference? Contact Brian Schieman -

Hotel Reservation Deadline - February 12, 2008
Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
Rooms on hold March 15 – 20, 2008

For reservations, call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 12, 2008.

Speaker Dates/Information:

  • Abstracts due: November 30, 2007
  • Extended Abstract or Abstract Book Materials due: February 8, 2008
  • Hotel Reservation Deadline: February 12, 2008
  • Powerpoint/Presentation file for CD-Rom due not later than: March 20, 2008 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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