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6th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 9-11, 2010
Exhibition and Technology Showcase
March 9-10, 2010
Professional Development Courses
March 8, 2010
GBC Spring Conference
March 7-8, 2010

In conjunction with the Global Business Council (GBC) Spring Conference, March 7-8

Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute

General Chair:

Phil Garrou
Microelectronic Consultants of NC

3D Packaging
Topical Workshop
Flip Chip Technologies
Topical Workshop
Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Emerging Tech (LEDs & Passives)
Topical Workshop
Technical Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Technical Co-Chair:
Ted Tessier
FlipChip International
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Frank Wall
Technical Co-Chair:
Lee Smith
Amkor Technology
Technical Co-Chair:
Lou Nicholls
Amkor Technology
Technical Co-Chair:
Andrew Strandjord
Pac Tech USA
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Robert Heistand

Announcement and Call for Abstracts
Topical Workshop on

3D Packaging

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline Extended To:  December 14, 2009

Technical Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
Troy, NY 12180
Phone: 518-276-2909
Technical Chair:
Lee Smith
Amkor Technology, Inc.
Chandler, AZ 85248
Phone: 480-821-2408

3D Packaging Organizing Committee:
Rozalia Beica, MAXIM Integrated Products, Inc.
Jeff Calvert, DOW Electronic Materials
Flynn Carson, STATS ChipPAC, Inc.
Kuan-Neng Chen, National Chiao Tung University
Kathy Cook, Alchimer S. A.
Yann Guillou, ST-Ericsson
Thorsten Matthias, EV Group
Bob Patti, Tezzaron Semiconductor
Peter Ramm, Fraunhofer IZM, Munich
Paul Siblerud, Semitool, Inc.
Nicolas Sillon, CEA LETI

Submit Abstract(s) | Student Competition
Hotel Information | Speaker Information | Exhibit Information | Reserve Booth(s) |
Professional Development Courses (PDCs)

Workshops: 3D Packaging | Flip Chip Technologies | MEMS & Associated Microsystems |
Wafer Level Packaging | Emerging Technology (LEDs & Passive Integration)

3D Packaging Workshop Focus:
The objective of the 3D Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of 3D Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to 3D Packaging technologies, as well as to bridge the gap between the back-end wafer-level 3D integration and 3D packaging, covering wire-bonded chip stack, system-in-packaging (SiP), package-on-package (PoP), through-silicon-via (TSV) based die-to-die (or chip), die-to-wafer, and wafer-to-wafer 3D approaches.  

Attendees and presenters in the past have found that the 3D Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on 3D packaging technologies would be well worth attending. Abstracts are being requested on the following topics:

  • Stacked Die
  • Stacked Packages
  • PWB Embedded Device Technologies
  • Memory Cubes
  • Folded Flex
  • Through Silicon Vias
  • Vertical Interconnects
  • Thin Wafer Processing
  • Assembly Processes and Handling Issues
  • Testing and Probing Challenges
  • Failure Analysis and Reliability
  • Simulation and Modeling
  • Applications and System Requirements
  • Thermal Management

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 14, 2009, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

The 3D Packaging Workshop will also be organizing an evening Panel Session on “Roadmap of 3D Integration and Packaging”.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at no later than December 14, 2009.


Interested in Exhibits? Contact Ann Bell -
Interested in helping organize the 2010 Conference? Contact Brian Schieman -

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

Hotel Reservation Deadline - February 2010

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Available Soon

Speaker Dates/Information:

  • Abstract Deadline: December 14, 2009
  • Extended Abstract or Abstract Book Materials due: January 29, 2010
  • Hotel Reservation/Early RegistrationDeadline: February 2010
  • Powerpoint/Presentation file for CD-Rom due not later than: March 11, 2010 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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