IMAPS - 3D IC & Packaging Workshop of Device Packaging 2011 Conference

Announcement and Call for Abstracts
Topical Workshop on
3D IC & Packaging
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This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline: December 3, 2010

Technical Chair: Paul Siblerud Applied Materials Kalispell, MT Phone: 406-758-7509 paul_siblerud@amat.com	Technical Chair: Ron Huemoeller Amkor Technology, Inc. Chandler, AZ Phone: 480-786-7755 ron.huemoeller@amkor.com

3D Packaging Organizing Committee: Rozalia Beica,Applied Materials Jeff Calvert, DOW Electronic Materials Flynn Carson, STATS ChipPAC, Inc. Kuan-Neng Chen, National Chiao Tung University Kathy Cook, Ziptronix Yann Guillou, ST-Ericsson James Lu, Rensselaer Polytechnic Institute Thorsten Matthias, EV Group Bob Patti, Tezzaron Semiconductor Peter Ramm, Fraunhofer IZM, Munich Nicolas Sillon, CEA LETI Lee Smith, Amkor Technology, Inc.

Workshops: 3D Packaging | Flip Chip Technologies | MEMS & Associated Microsystems |
Wafer Level Packaging | Emerging Technology (LEDs & Passive Integration)

3D IC & Packaging Workshop Focus:
The objective of the 3D Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of 3D Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to 3D Packaging technologies, as well as to bridge the gap between the back-end wafer-level 3D integration and 3D packaging, covering wire-bonded chip stack, system-in-packaging (SiP), package-on-package (PoP), through-silicon-via (TSV) based die-to-die (or chip), die-to-wafer, and wafer-to-wafer 3D approaches.

Attendees and presenters in the past have found that the 3D Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on 3D packaging technologies would be well worth attending.

Abstracts are being requested on the following topics:

Stacked Die
Stacked Packages
PWB Embedded Device Technologies
Memory Cubes
Folded Flex
Through Silicon Vias
Vertical Interconnects
Thin Wafer Processing
Assembly Processes and Handling Issues
Testing and Probing Challenges
Failure Analysis and Reliability
Simulation and Modeling
Applications and System Requirements
Thermal Management

The 3D Packaging Workshop will also be organizing an evening Panel Session on “Roadmap of 3D Integration and Packaging”.

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 3, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 28, 2011. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 7th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than December 3, 2010.

Interested in Exhibits? Contact Ann Bell - abell@imaps.org
Interested in helping organize the 2011 Conference? Contact Brian Schieman - bschieman@imaps.org

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.

HOUSING
Hotel Reservation Deadline - February 3, 2011

NOTE: There is a company by the name of Convention Housing Service attempting to contact our past attendees to book rooms through them. This is not a group IMAPS has authorized and we are looking into legal matters around this company. Please DO NOT provide them any personal or credit card information.

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300

Online Reservations:
http://www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP11&hotelCode=AZMCDOWE

Or use Promotional Code: IMAP11 from the hotel’s direct website: http://www.radisson.com/hotels/azmcdowe

**Working on special reservation process for government rate.

Speaker Dates/Information:

Abstracts Deadline: December 3, 2010
Hotel Reservation Deadline: February 3, 2011
Extended Abstract or Abstract Book Materials due: January 28, 2011
Early Registration Deadline: February 3, 2011
Powerpoint/Presentation file for CD-Rom due not later than: March 10, 2011 (Last day of Conference)
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)