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9th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 12-14, 2013
Exhibition and Technology Showcase
March 12-13, 2013
Professional Development Courses
March 11, 2013
GBC Spring Conference
March 10-11, 2013

In conjunction with the Global Business Council (GBC) Spring Conference, March 10-11

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

James Lu
Rensselaer Polytechnic Institute

General Chair-elect (PDCs):
Ron Huemoeller
Amkor Technology
Past General Chair (Panels):
Peter Elenius
E&G Technology Partners

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
LED Packaging for SSL
Topical Workshop
Technical Chair:
Rozalia Beica
Lam Research AG
Technical Chair:
Linda Bal
Freescale Semiconductor
Technical Chair:
Tracy Hudson
US Army
Technical Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT
Technical Co-Chair:
Luu Nguyen
Texas Instruments
Technical Co-Chair:
Russell Shumway
Amkor Technology
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

Abstracts Now Accepted Until: December 7, 2012

Submit Abstract(s)
Speaker Information
| Student Competition | Professional Development Courses (PDCs)
Exhibition |
Reserve Exhibits On-line |
Floorplan | 2013 Exhibitors | 2012 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational

Workshop Announcements: Advanced 3D Packaging | Flip Chip & Wafer Level Packaging | MEMS & Microsystems |
Packaging LEDs for SSL

Announcement and Call for Abstracts
Topical Workshop on

Advanced 3D Packaging

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Technical Chair:
Rozalia Beica
Lam Research AG
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich

Advanced 3D Packaging Organizing Committee:
Franck Murray, IPDIA
Harry Hedler, Siemens Munich
Jeff Calvert, DOW Electronic Materials
Keith Cooper, SET NA
Kuan-Neng Chen, National Chiao Tung University
Muhannad Bakir, Georgia Institute of Technology
Paul Siblerud, Applied Materials
Phil Garrou, Microelectronic Consultants of NC
Reinhard Pufall, Infineon Technologies
Subhash Shinde, Sandia National Laboratories
Thorsten Matthias, EV Group
Yann Guillou, SEMI Europe

Advanced 3D Packaging Workshop Focus:
The objective of this Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Advanced 3D Packaging. This workshop has been specifically organized to allow for the presentation and debate of some of the latest advancements in Advanced 3D technologies as well as to bridge the gap between the back-end wafer-level 3D integration and 3D packaging, covering wire-bonded chip stack, system-in-packaging (SiP), package-on-package (PoP), through-silicon-via (TSV) based die-to-die (or chip), die-to-wafer, and wafer-to-wafer 3D approaches.

Attendees and presenters in the past have found that the Advanced 3D Packaging Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, this Workshop would be well worth attending.

Abstracts are being requested on the following topics:

  • Advanced Stacked Dies Technology
  • Advanced Stacked Packages
  • PWB Embedded Device Technologies
  • Stacked Memories
  • Silicon Interposer
  • High Density Interposers & Integrated Passives
  • Folded Flex
  • Through Silicon Vias (TSV) Technologies
  • Vertical Interconnects
  • Advanced 3D Materials and Processes
  • Advanced 3D Testing and Probing Challenges
  • Failure Analysis and Reliability
  • Simulation and Modeling
  • Applications and System Requirements
  • Thermal Management
  • Thin Wafer Handling and Processing
  • Cost Considerations for 2.5 & 3D Packaging

The Advanced 3D Packaging Workshop will include an evening Panel Session on 3D Integration and Packaging - TBD.

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically IMMEDIATELY, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 25, 2013. A post-conference USB or CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at or by phone at 202-548-8715 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. A maximum of 65 full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Brian Schieman by email at or by phone at 202-548-8715.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 11th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Brian Schieman by email at or by phone at 202-548-8715 no later than November 16, 2012.


Interested in Exhibits? Contact Brian Schieman -
Interested in helping organize the 2013 Conference? Contact Brian Schieman -


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student with "best presentation". The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation

Hotel Reservation Deadline - February 1, 2013

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$155 single/double

Online Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone0

Hotel Scams Alert!
Beware of Hotel Scams! Exhibition Housing Services has been soliciting several exhibitors indicating that they are the official housing vendor for IMAPS Device Packaging 2013 Please note that they are NOT affiliated with the show at all and are not working in your best interest. Booking rooms through companies such as Exhibition Housing Services could result in false reservations and a loss of deposit money.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

Speaker Dates/Information:

  • Abstracts Deadline: December 7, 2012
  • Speaker Notification Emails: December 14, 2012
  • Extended Abstract or Abstract Book Materials due: January 25, 2013
  • Hotel Reservation Deadline: February 1, 2013
  • Early Registration Deadline: February 1, 2013
  • Powerpoint/Presentation file for CD-Rom due not later than: March 14, 2013 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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