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First International Conference and Exhibition on
Device Packaging

Exhibition Information
download PDF of Exhibit Brochure

March 13 - 16, 2005
Hilton Scottsdale Resort & Villas
6333 North Scottsdale Road, Scottsdale, AZ 85250-5428
P: 480-948-7750
www.scottsdaleresort.hilton.com

Sponsored by:
International Microelectronics and Packaging Society (IMAPS)
"Everything in electronics between the chip and the system”

General Chair:
Dr. R. Wayne Johnson, Auburn University

Technical Co-Chairs:
Theodore Tessier, ST Assembly Test Services Inc.; Dr. Andrew Strandjord, IC Interconnect

Technical Committee
US: Anwar Mohammed, CREE; Dr. Ray Pearson, Lehigh University;
Dr. Ajay P. Malshe, University of Arkansas; Dr. David Tuckerman, Tessera; Jon Aday, Amkor Technology

Europe: Dr. Seán Cian Ó Mathúna, NMRC; Dr. Eric Beyne, IMEC

Asia: Dr. Yoshitaka Fukuoka, Worldwide Electronic Integrated Substrate Technology Inc.; Dr. Kaoru Hashimoto, Fujitsu Laboratories Ltd.


Building on the success of the IMAPS Topical and Advanced Technology Workshops on CSPs, 3-D Packaging, Opto Packaging, MEMS/Nano Packaging and Packaging of Copper/Low K, IMAPS is pleased to organize the International Conference on Device Packaging. This will be a focused conference dedicated to the challenges and technologies for packaging and devices of all types. The conference will provide a forum for the presentations of leading edge device packaging technologies and an opportunity to meet and exchange ideas with leading experts in all facets of device packaging.

The Exhibition will feature examples of products and services utilizing these technologies in packaging for a multitude of devices. The booths will be 10’ x 10’ to accommodate full-sized displays and will be assigned on a first come, first served basis.

Exhibit Hours:
Monday, March 14, 2005 - 10 AM - 7:00 PM
Lunch and a Reception will be held in the Exhibit Hall

Tuesday, March 15, 2005 - 9 AM - 5 PM
Lunch will be held in the Exhibit Hall

Installation Hours:
Sunday, March 13 - After 4:00 PM
Monday, March 14 - 8:00 AM - 10 AM

Dismantle Hours:
Tuesday, March 15 - 5:00 PM - 8 PM

Exhibit Registraton Fees:*


On/Before 2/1/05
After 2/1/05
IMAPS Corporate Member
$1,100
$1,300
Non-Corporate Member
$1,700
$1,900
* Includes one Full Year of an IMAPS Corporate Membership with each Non-Member Registration.

Included with your registration:

  • one (1) Full Conference Registration
  • one (1) Full Proceedings CD ROM
  • one (1) List of Attendees (on CD ROM)
  • Exhibit Hall Admission for two Booth Personnel

Additional booth personnel are welcome at an extra cost of $50 per person. Registrations for the full conference are not included, but are available at an additional cost.

Exhibitors on the Device Packaging 2005 Proceedings CD-Rom:
IMAPS will provide all exhibitors an opportunity to provide up to ten (10) pages of company products, services and contact information to be included on the Conference Proceedings CD-ROM. These CD-ROMs are provided to all technical conference attendees and are for sale through IMAPS to all industry professionals.

This unique feature will promote the Exhibitor’s products and abilities much longer than just the Conference.

There is a charge of $50 for this optional feature.

This equates to 10 pages of advertising for just $50.

These submissions must be no more than ten (10) pages long and must be sent, electronically, in Word or PDF format, to abell@imaps.org no later than February 18, 2005.

Reserve Exhibits On-line & Save




Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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