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International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Doubletree
Hotel
Scottsdale, Arizona USA
Device
Packaging General Chairs:
Ted Tessier, FlipChip International
Andrew Strandjord, FlipChip International
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Device
Packaging Technical Chairs:
Beth Keser, Freescale Semiconductor
Jon Aday, Amkor Technology Inc.
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Conference
and Technical Workshops
March 20-23, 2006
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Exhibition
and Technology Showcase
March 21-22, 2006
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Professional
Development Courses
March 20, 2006
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GBC
Spring Conference
March 19-20, 2006
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Exhibiting
Companies
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COMPANY
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BOOTH(S)
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AdTech Ceramics
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6
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Advanced Dicing Technologies
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59-60
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AkroMetrix, LLC
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41
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Alcatel Machining Systems
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31
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ALLVIA
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58
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Ansoft Corp.
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45
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Arizona State University
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36
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Asymtek
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34
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Azimuth Electronics, Inc.
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56
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CAD Design Software
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43
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CMC Interconnect Technologies
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26
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Cyber Technologies USA
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27
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DuPont Company
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19
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EKC Technology
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20
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ESEC USA, Inc.
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22
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Flip Chip International, LLC
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54
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Gel-Pak/Quik-Pak
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35
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GPD Global
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37
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Gryphics, Inc.
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21
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Heraeus-SMT
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44
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Hesse & Knipps,
Inc.
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28
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Indium Corporation of America
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35
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L. Gordon Packaging
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30
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MEPTEC
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Literature Table
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MicroFab Technologies, Inc.
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47
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NAMICS Technologies, Inc.
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32
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Natel Engineering ,Inc.
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23
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NorCom Systems, Inc.
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50
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NuSil Technology
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51
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Optical Metrology Innovations
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14
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Orthodyne Electronics
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48
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Pac Tech USA
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42
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Palomar Technologies, Inc.
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13
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Photonics Spectra Magazine/Laurin
Publishing
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15
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Sikama International, Inc.
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57
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Surface Technology Systems Ltd.
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40
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TDK Corporation of America
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16-17
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Teledyne Microelectronic Technologies
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46
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Utz Technologies, Inc.
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12
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West-Bond, Inc.
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49
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Xradia, Inc.
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29
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Zeland Software, Inc.
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55
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IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 |
E-mail: imaps@imaps.org |
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