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International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Doubletree Hotel
Scottsdale, Arizona USA

Device Packaging General Chairs:
Ted Tessier, FlipChip International
Andrew Strandjord, FlipChip International


Device Packaging Technical Chairs:
Beth Keser, Freescale Semiconductor
Jon Aday, Amkor Technology Inc.

Conference and Technical Workshops
March 20-23, 2006
Exhibition and Technology Showcase
March 21-22, 2006
Professional Development Courses
March 20, 2006
GBC Spring Conference
March 19-20, 2006


Exhibiting Companies

COMPANY

BOOTH(S)

AdTech Ceramics

6

Advanced Dicing Technologies

59-60

AkroMetrix, LLC

41

Alcatel Machining Systems

31

ALLVIA

58

Ansoft Corp.

45

Arizona State University

36

Asymtek

34

Azimuth Electronics, Inc.

56

CAD Design Software

43

CMC Interconnect Technologies

26

Cyber Technologies USA

27

DuPont Company

19

EKC Technology

20

ESEC USA, Inc.

22

Flip Chip International, LLC

54

Gel-Pak/Quik-Pak

35

GPD Global

37

Gryphics, Inc.

21

Heraeus-SMT

44

Hesse & Knipps, Inc.

28

Indium Corporation of America

35

L. Gordon Packaging

30

MEPTEC

Literature Table

MicroFab Technologies, Inc.

47

NAMICS Technologies, Inc.

32

Natel Engineering ,Inc.

23

NorCom Systems, Inc.

50

NuSil Technology

51

Optical Metrology Innovations

14

Orthodyne Electronics

48

Pac Tech  USA

42

Palomar Technologies, Inc.

13

Photonics Spectra Magazine/Laurin Publishing

15

Sikama International, Inc.

57

Surface Technology Systems Ltd.

40

TDK Corporation of America

16-17

Teledyne Microelectronic Technologies

46

Utz Technologies, Inc.

12

West-Bond, Inc.

49

Xradia, Inc.

29

Zeland Software, Inc.

55

 

 


Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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