IMAPS - International Microelectronics And Packaging Society: Bringing together the entire microelectronics supply chain!


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3rd International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Doubletree Hotel
Scottsdale, Arizona USA


General Chair:
Andrew Strandjord
FlipChip International
andrew.strandjord@flipchip.com
Technical Co-Chair:
Beth Keser
Freescale Semiconductor
Beth.Keser@freescale.com
Technical Co-Chair:
Jon Aday
Amkor Technology Inc.
jaday@amkor.com
Conference and Technical Workshops
March 19-22, 2007
Exhibition and Technology Showcase
March 20-21, 2007
Professional Development Courses
March 19, 2007
GBC Spring Conference
March 18-19, 2007

Exhibiting Companies

Exhibit Brochure | Floorplan | 2006 Exhibitors

Reserve your booth online before it's too late

Device Packaging 2007 will feature one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006 exhibition was sold out early and we expect continued growth for 2007 so reserve your booth early.

Here are the companies that have already reserved exhibit space:

COMPANY BOOTH NUMBER(S)
AdTech Ceramics 43 
Advanced Chemical Etching, Ltd. 46 
AI Technology, Inc. 30 
AkroMetrix, LLC 10 
ALLVIA 11 
Amkor Technology, Inc. 27 
Arizona State University 28 
Asymtek 44 
AZ Electronic Materials USA Corp. 40 
BE Semiconductor Industries NV (DATACON)
Bennington Microtechnology Center 20 
Boschman Technologies 55 
Centrotherm Technologies 49 
Chalman Technologies 54 
Chip Supply, Inc. 50 
CMC Interconnect Technologies
Compunetics 36 
Cyber Technologies USA 16 
DuPont Electronic Technologies 15 & 14 
E-Globaledge America, Inc. 23 
EKC Technology 15 
EV Group
F&K Delvotec, Inc. 53 
Finetech, Inc. 33 
Geib Refining Corporation 26 
GPD Global 13 
HEI, Inc. 32 
Hesse & Knipps, Inc. 59 & 60 
IMAPS Arizona Chapter (c/o Intel) 58 
Interconnect Systems, Inc. 39 
L. Gordon Packaging
Lambda Technologies, Inc. 48 
MicroChem Corp.
MicroConnex Corporation 21 
MicroFab Technologies, Inc. 37 
Miyachi Unitek Corp 51 
MJS Designs 38 
NAMICS Technologies, Inc. 31 
National Nuclear Security Administrations Kansis City Plant 41 
Orthodyne Electronics 25 
PacTech USA - Packaging Technologies, Inc.
Palomar Technologies, Inc. 27 
Panasonic Factory Solutions Company 47 
Photonics Spectra Magazine/Laurin Publishing 18 
Precision Process Equipment Inc. 52 
Protavic America, Inc.
Quantum Leap 34 
Sertek
Sikama International, Inc. 22 
Starfire Systems 56 
Struers 24 
Surfect Technologies, Inc. 19 
SUSS MicroTec 45 
Task Microelectronics
Technic, Inc. 42 
Teledyne Microelectronic Technologies 29 
West-Bond, Inc. 17 
Yole Development/Micronews 12 
Zeland Software, Inc. 35 

 


 


IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 | E-mail: imaps@imaps.org

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