IMAPS - Device Packaging 2008 Exhibiting Companies

4th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 17-20, 2008

Exhibition and Technology Showcase
March 18-19, 2008

Professional Development Courses
March 17, 2008

GBC Spring Conference
March 16-17, 2008

Exhibiting Companies

Exhibit Brochure | Floorplan | 2007 Exhibitors

THE EXHIBIT FLOOR HAS SOLD OUT

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717. The 2006 and 2007 exhibitions were sold out early and we expect continued growth for 2008 so reserve your booth early.

Here are the companies that have already reserved exhibit space:

COMPANY	BOOTH NUMBER(S)
AdTech Ceramics	30
AI Technology, Inc.	32
AkroMetrix, LLC	6
Amkor Technology, Inc.	59
Ansoft Corp.	15
Antares Advanced Test Technologies	24
Asymtek	23
Atotech	3
AZ Electronic Materials USA Corp.	54
Azimuth Electronics, Inc.	40
BE Semiconductor Industries NV	47
Bennington Microtechnology Center	29
Boschman Technologies	43
Brewer Science, Inc.	9
Chalman Technologies	7 - 8
Chip Supply, Inc.	28
CMC Interconnect Technologies	44
Cyber Technologies USA	13
DuPont Company	68-69
Dyconex A.G.	35
Endicott Interconnect Technologies, Inc.	71
ESL ElectroScience	21
EV Group Inc.	60
F&K Delvotec, Inc.	62
FEI	65
Gel-Pak/Quik-Pak	39
GPD Global, Inc.	58
HCM	18
HEI	57
Hesse & Knipps, Inc.	1 - 2
Interconnect Systems, Inc.	49
JSR Micro, Inc.	4
Lambda Technologies, Inc.	56
LINTEC Corporation	41
Maxtek Components Corporation	51
Micro Hybrid Dimensions, Inc.	36
MicroChem Corp.	16
MicroFab Technologies, Inc.	46
Microsystems Packaging Research Center	14
MJS Designs	45
NAMICS Technologies, Inc.	38
Nexx Systems, Inc.	48
NTK Technologies, Inc.	64
NuSil Technology	50
Oneida Research Services, Inc.	34
Orthodyne Electronics	26
PacTech USA - Packaging Technologies, Inc.	20
Palomar Technologies	66
Photonics Spectra/Laurin Publishing	17
Pure Technologies, LLC	52
Reinhardt Microtech AG	19
Reldan Metals, Inc.	63
S.E.T.	55
Semitool, Inc.	67
Sikama International, Inc.	53
Starfire Systems	12
Stellar Microelectronics Inc.	22
Surface Technology Systems Ltd. SA	25
SUSS MicroTec	33
Synergistic Technology Group, Inc.	31
TechSearch International, Inc.	37
Teledyne Microelectronics	42
Ticona Engineering Polymers	61
Twilight Technology, Inc.	10
Weiss-Aug Co. Inc.	11
West-Bond, Inc.	27
WLCSP Forum	70
Zymet, Inc.	5