<%@LANGUAGE="VBSCRIPT"%> <% ' FileName="Connection_odbc_conn_dsn.htm" ' Type="ADO" ' DesigntimeType="ADO" ' HTTP="true" ' Catalog="" ' Schema="" Dim MM_symposium_STRING MM_symposium_STRING = "dsn=symposium;" %> <% Dim rsExhibitors__MMColParam rsExhibitors__MMColParam = "71" If (Request("MM_EmptyValue") <> "") Then rsExhibitors__MMColParam = Request("MM_EmptyValue") End If %> <% Dim rsExhibitors Dim rsExhibitors_cmd Dim rsExhibitors_numRows Set rsExhibitors_cmd = Server.CreateObject ("ADODB.Command") rsExhibitors_cmd.ActiveConnection = MM_symposium_STRING rsExhibitors_cmd.CommandText = "SELECT * FROM Exhibiting_COMPANIES WHERE EventID = ? ORDER BY Exhibiting_Company ASC" rsExhibitors_cmd.Prepared = true rsExhibitors_cmd.Parameters.Append rsExhibitors_cmd.CreateParameter("param1", 5, 1, -1, rsExhibitors__MMColParam) ' adDouble Set rsExhibitors = rsExhibitors_cmd.Execute rsExhibitors_numRows = 0 %> <% Dim Repeat1__numRows Dim Repeat1__index Repeat1__numRows = -1 Repeat1__index = 0 rsExhibitors_numRows = rsExhibitors_numRows + Repeat1__numRows %> IMAPS - Device Packaging 2010 Exhibiting Companies
   
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6th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 9-11, 2010
Exhibition and Technology Showcase
March 9-10, 2010
Professional Development Courses
March 8, 2010
GBC Spring Conference
March 7-8, 2010

In conjunction with the Global Business Council (GBC) Spring Conference, March 7-8


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Phil Garrou
Microelectronic Consultants of NC


Exhibiting Companies

Exhibit Brochure | Floorplan | 2009 Exhibitors


Device Packaging Exhibit and Technology Show:

Device Packaging 2010 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006-2009 exhibitions were sold out early. The 2010 Conference exhibit is expected to sell-out as well. You can contact Ann (below) to reserve your spot.

Questions? Contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Here are the companies that have already reserved exhibit space:

Exhibiting Company

Contact name

Booth(s)

3D Plus USA

Quinn John

54

AdTech Ceramics

Bukovitz Brian

07

Advance Reproductions Corp.

Alaimo Steve

58

AI Technology, Inc.

Amigh Richard

63

Alchimer SA
Cook Kathy
09

Amkor Technology

Garner Shellene

20

Applied Materials, Inc.

Hirasawa Mika

57

Asahi Glass Company

Stygar Vern

18

ASM Pacific Technology, Ltd.

Ream Donald

36

Atotech USA, Inc.

Roberts Hugh D

35

Azimuth Electronics, Inc.

Johnsen Kenneth C

40

Boschman Technologies

van Weelden Ton

25

Brewer Science, Inc.

Shaw Patti

44

CAD Design Software, Inc.

Slovinsky John

05

Chalman Technologies, Inc.

Chalman Ronald C

03-04

Chip Supply, Inc.

Hamby Tony A

13

Coining, Inc.

Scelzo Julie

49

CPS Technologies Corporation

Sullivan Bo

43

Dow Electronic Materials

Cole Jeremy

30

DuPont Electronic Technologies

Simpkins Michele

55-56

Dyconex AG

Stutz Melanie

51

EMC3D

Siblerud Paul

52-53

ESL ElectroScience.

Feingold Alvin

28

EV Group, Inc.

Lucero Carol

48

Finetech, Inc.

Gerard Adrienne

46

Geib Refining Corporation

Gervais Michael T

31

Gel-Pak/Quik-Pak

Davis Darby

23

Hesse & Knipps GmbH

Bubel Joseph S

01-02

Infinite Graphics, Inc.

Stritch Kendra

39

Interconnect Systems, Inc.

Gilliam Mark W

61

Interplex Engineered Products, Inc.

Federici Domenic

26

Kyocera America, Inc.

Bowen Stephen E

21

LINTEC OF AMERICA, INC

Le Yuki

Micro Hybrid Dimensions, Inc.

Myers Ted

37

NAMICS Corporation

Jensen Richard C

41

Natel Engineering Co., Inc.

Angeloni James A

34

NEXX Systems, Inc.

Walsh Thomas M

06

Oneida Research Services, Inc.

Rossiter Daniel J

33

Orthodyne Electronics

Frese Sheila

14

Pac Tech Packaging Technologies USA

Teutsch Thorsten

16

Palomar Technologies, Inc.

Taylor Michelle

15

Pure Technologies, LLC

Cohn Jerry

38

Riv, Inc.

Keefe Tania

27

Rogers Corporation

Sleasman Thomas

50

Semitool-Atotech

Welsh James

29

Sikama International, Inc.

Wathne Sigurd R

24

Smart Equipment Technology (S.E.T.)

Lecarpentier Gilbert

32

Solid State Equipment Corporation

Richardson Richard D

08

Sound Design Technologies

Smith Andrew

64

SPP Process Technology Systems

Short Carolyn

19

Tamarack Scientific Co.

Souter Matt

11

TechSearch International, Inc.

Travelstead Becky

47

Tegal Corporation

Werbaneth Paul F

62

Teledyne Microelectronic Technologies, Inc.

Fletcher Sharon

42

West-Bond, Inc.

Price John

22

Yole Developpement

Leroy Sandrine

17

 



Corporate
Sponsor:


Corporate Sponsor - NEXX Systems


Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation


Media
Sponsor:

3D InCites - Media Sponsor

Wafer & Device Packaging and Interconnect - Media Sponsor




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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