IMAPS - Device Packaging 2010 Exhibiting Companies

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6th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 9-11, 2010

Exhibition and Technology Showcase
March 9-10, 2010

Professional Development Courses
March 8, 2010

GBC Spring Conference
March 7-8, 2010

In conjunction with the Global Business Council (GBC) Spring Conference, March 7-8

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Phil Garrou
Microelectronic Consultants of NC

Exhibiting Companies

Exhibit Brochure | Floorplan | 2009 Exhibitors

Device Packaging Exhibit and Technology Show:
Device Packaging 2010 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006-2009 exhibitions were sold out early. The 2010 Conference exhibit is expected to sell-out as well. You can contact Ann (below) to reserve your spot.

Questions? Contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Here are the companies that have already reserved exhibit space:

Exhibiting Company	Contact name	Booth(s)
3D Plus USA	Quinn John	54
AdTech Ceramics	Bukovitz Brian	07
Advance Reproductions Corp.	Alaimo Steve	58
AI Technology, Inc.	Amigh Richard	63
Alchimer SA	Cook Kathy	09
Amkor Technology	Garner Shellene	20
Applied Materials, Inc.	Hirasawa Mika	57
Asahi Glass Company	Stygar Vern	18
ASM Pacific Technology, Ltd.	Ream Donald	36
Atotech USA, Inc.	Roberts Hugh D	35
Azimuth Electronics, Inc.	Johnsen Kenneth C	40
Boschman Technologies	van Weelden Ton	25
Brewer Science, Inc.	Shaw Patti	44
CAD Design Software, Inc.	Slovinsky John	05
Chalman Technologies, Inc.	Chalman Ronald C	03-04
Chip Supply, Inc.	Hamby Tony A	13
Coining, Inc.	Scelzo Julie	49
CPS Technologies Corporation	Sullivan Bo	43
Dow Electronic Materials	Cole Jeremy	30
DuPont Electronic Technologies	Simpkins Michele	55-56
Dyconex AG	Stutz Melanie	51
EMC3D	Siblerud Paul	52-53
ESL ElectroScience.	Feingold Alvin	28
EV Group, Inc.	Lucero Carol	48
Finetech, Inc.	Gerard Adrienne	46
Geib Refining Corporation	Gervais Michael T	31
Gel-Pak/Quik-Pak	Davis Darby	23
Hesse & Knipps GmbH	Bubel Joseph S	01-02
Infinite Graphics, Inc.	Stritch Kendra	39
Interconnect Systems, Inc.	Gilliam Mark W	61
Interplex Engineered Products, Inc.	Federici Domenic	26
Kyocera America, Inc.	Bowen Stephen E	21
LINTEC OF AMERICA, INC	Le Yuki
Micro Hybrid Dimensions, Inc.	Myers Ted	37
NAMICS Corporation	Jensen Richard C	41
Natel Engineering Co., Inc.	Angeloni James A	34
NEXX Systems, Inc.	Walsh Thomas M	06
Oneida Research Services, Inc.	Rossiter Daniel J	33
Orthodyne Electronics	Frese Sheila	14
Pac Tech Packaging Technologies USA	Teutsch Thorsten	16
Palomar Technologies, Inc.	Taylor Michelle	15
Pure Technologies, LLC	Cohn Jerry	38
Riv, Inc.	Keefe Tania	27
Rogers Corporation	Sleasman Thomas	50
Semitool-Atotech	Welsh James	29
Sikama International, Inc.	Wathne Sigurd R	24
Smart Equipment Technology (S.E.T.)	Lecarpentier Gilbert	32
Solid State Equipment Corporation	Richardson Richard D	08
Sound Design Technologies	Smith Andrew	64
SPP Process Technology Systems	Short Carolyn	19
Tamarack Scientific Co.	Souter Matt	11
TechSearch International, Inc.	Travelstead Becky	47
Tegal Corporation	Werbaneth Paul F	62
Teledyne Microelectronic Technologies, Inc.	Fletcher Sharon	42
West-Bond, Inc.	Price John	22
Yole Developpement	Leroy Sandrine	17

Corporate
Sponsor:

Student Paper Competition
Sponsor:

Media
Sponsor:

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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