<%@LANGUAGE="VBSCRIPT"%> <% ' FileName="Connection_odbc_conn_dsn.htm" ' Type="ADO" ' DesigntimeType="ADO" ' HTTP="true" ' Catalog="" ' Schema="" Dim MM_symposium_STRING MM_symposium_STRING = "dsn=symposium;" %> <% Dim rsExhibitors__MMColParam rsExhibitors__MMColParam = "71" If (Request("MM_EmptyValue") <> "") Then rsExhibitors__MMColParam = Request("MM_EmptyValue") End If %> <% Dim rsExhibitors Dim rsExhibitors_cmd Dim rsExhibitors_numRows Set rsExhibitors_cmd = Server.CreateObject ("ADODB.Command") rsExhibitors_cmd.ActiveConnection = MM_symposium_STRING rsExhibitors_cmd.CommandText = "SELECT * FROM Exhibiting_COMPANIES WHERE EventID = ? ORDER BY Exhibiting_Company ASC" rsExhibitors_cmd.Prepared = true rsExhibitors_cmd.Parameters.Append rsExhibitors_cmd.CreateParameter("param1", 5, 1, -1, rsExhibitors__MMColParam) ' adDouble Set rsExhibitors = rsExhibitors_cmd.Execute rsExhibitors_numRows = 0 %> <% Dim Repeat1__numRows Dim Repeat1__index Repeat1__numRows = -1 Repeat1__index = 0 rsExhibitors_numRows = rsExhibitors_numRows + Repeat1__numRows %> IMAPS - Device Packaging 2011 Exhibiting Companies
   
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7th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 8-10, 2011
Exhibition and Technology Showcase
March 8-9, 2011
Professional Development Courses
March 7, 2011
GBC Spring Conference
March 6-7, 2011

In conjunction with the Global Business Council (GBC) Spring Conference, March 6-7


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Phil Garrou
Microelectronic Consultants of NC


3D Packaging
Topical Workshop
Flip Chip Technologies
Topical Workshop
Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Emerging Tech (LEDs & Passives)
Topical Workshop
Technical Co-Chair:
Paul Siblerud
Semitool, Inc.
Technical Co-Chair:
Peter Elenius
E&G Technology Partners
Technical Co-Chair:
Ted Tessier
FlipChip International
Technical Co-Chair:
Robert Dean
Auburn University
Technical Chair:
Jeff Perkins, Yole
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Robert Heistand, AVX

2011 Exhibiting Companies

The Exhibit Hall has SOLD OUT

Exhibit Brochure | Floorplan | 2010 Exhibitors


Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out again in 2011, and each year since 2006. Please review the exhibit information or contact Michael O'Donoghue by email at modonoghue@imaps.org or by phone at 202-548-8707.

Here are the companies that have already reserved exhibit space:

Exhibiting Company Contact Booth Number
3D Plus USA
Quinn John
40
AdTech Ceramics
Wade Jim
7
AI Technology
Amigh Richard
31
Amkor Technology
Garner Shellene
39
Applied Materials, Inc.
Leando Michelle
18
Asahi Glass Company
Stygar Vern
64
Atotech USA, Inc.
Roberts Hugh D
22
Axus Technology
VanDevender Barrie
46
Azimuth Electronics, Inc.
Hall RoJean
42
Boschman Technologies
Crane John H
49
CAD Design Software
Schiesser Hans
59
Chalman Technologies, Inc.
Chalman Keith
08-09
Chip Supply
Hartung Mark
06
CPS Technologies Corporation
Sullivan Bo
41
CVInc
Collier Terence
63
Dow Electronic Materials
Cole Jeremy
54
DuPont Wafer Level Packaging Solutions
Vernon Joan M.
55-56
Dyconex AG
Wuelser Julia
21
EMC3D
Siblerud Paul
60
EV Group, Inc.
Lucero Carol
61
Finetech
Gerard Adrienne
58
FRT of America, LLC
Flynn Paul
25
GPD Global
Vega Christian
27
Geib Refining Corporation
Gervais Michael
34
Hesse & Knipps, Inc.
Kivi George
01-02
Interconnect Systems, Inc.
Brondi Dennis
37
IPDIA
Omnes Laetitia
13
Kundich Associates
Kundich Bud
05
Kyocera America
Bowen Stephen
36
Laser Tech, Inc.
Whitman Larry
44
LINTEC of America, Inc.
Le Yuki
28
Micro Hybrid Dimensions
Spradlin Greg
45
NAMICS Corporation
Jensen Richard C
38
Newport Corporation
Crowley Dan
12
Oneida Research Services, Inc.
Delluomo Deborah
15
Orthodyne Electronics
Frese Sheila
35
Pac Tech Packaging Technologies USA
Sarkar Mausumi
52
Palomar Technologies, Inc.
Hueners Rich
16
Phoenix Analysis and Design Technologies (PADT)
Ayres Jennifer
57
Plan Optik AG
Schilling Baerbel
17
Pure Technologies, LLC
Cohn Jerry
47
PVA TePla America, Inc.
Babcock Andrea
29
Rogers Corporation
Long Sheryl
23
Semiconductor Equipment Corp.
Moore Don
10
SET - Smart Equipment Technology
Greneche Emmanuelle
50
Sierra Circuits, Inc.
Barnhart Laurie
03
Sikama International, Inc.
Wathne Sigurd
24
Smoltek AB
Johansson Anders
62
Solid State Equipment Corporation
Richardson Richard
53
Sonoscan
Lykowski Janet
65
Souriau PA&E
Kalkowski Rick
43
Spectra-Mat, Inc.
Petznick Sandra
04
SPP Process Technology Systems
Short Carolyn
14
STATS ChipPAC, Ltd.
Lavin Lisa
30
TDI International, Inc.
DeJean Karen
11
TechSearch International, Inc.
Travelstead Becky
20
Teledyne Microelectronic Technologies, Inc.
Fletcher Sharon
33
Torrey Hills Technologies, LLC
Zhang Joyce
48
Utz Technologies, Inc.
Guidi Kristian
Tabletop 1
West Bond, Inc.
Witters Lorri
26
Williams Advanced Materials
Schoen Kimberly A
51
XYZTEC
Blank Cynthia
19
Yole Developpement
Leroy Sandrine
32

 

Questions?
Contact Michael O'Donoghue - modonoghue@imaps.org or 202-548-8707.


Exhibit Hall Reception
Sponsor:


Exhibit Hall Reception Sponsor: Williams Advanced Materials

GBC Speaker Dinner & Foundation Golf/Hold'em Sponsors:

Premier "Eagle" Sponsor: ASE US, Inc.


Premier "Birdie" Sponsor: Amkor Technology


Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation


Golf Hole Sponsors:

Golf Hole Sponsor: Teledyne Microelectronics

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: Kyzen Corp.

Golf Hole Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

Golf Hole Sponsor: LORD Corporation

Media Sponsors:

I-Micronews

MEPTEC




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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