IMAPS - Device Packaging 2012 Exhibiting Companies

8th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 6-8, 2012

Exhibition and Technology Showcase
March 6-7, 2012

Professional Development Courses
March 5, 2012

GBC Spring Conference
March 4-5, 2012

In conjunction with the Global Business Council (GBC) Spring Conference, March 4-5

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Peter Elenius
E&G Technology Partners

General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute

Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC

3D & 2.5D Packaging Topical Workshop	Flip Chip & Wafer Level Packaging Topical Workshop	MEMS & Microsystems Topical Workshop	Passive Integration Topical Workshop	LED Packaging Topical Workshop
Technical Co-Chair: Ron Huemoeller Amkor Technology	Technical Co-Chair: Rey Alvarado Maxim Integrated Prod.	Technical Co-Chair: Robert Dean Auburn University	Technical Co-Chair: Franck Murray IPDIA	Technical Co-Chair: Thomas Goodman E&G Technology Partners
Technical Co-Chair: Rozalia Beica Lam Research AG	Technical Co-Chair: Alan Huffman RTI International	Technical Co-Chair: Tracy Hudson US Army	Technical Co-Chair: Kai Liu STATS ChipPAC	Technical Co-Chair: Bob Karlicek Rensselaer Polytechnic Institute

2012 Exhibiting Companies

EXHIBIT HALL SOLD OUT
EARLY REGISTRATION/EXHIBIT/Hotel Deadlines: February 10, 2012

Exhibition Details | Floorplan | 2011 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out in 2012, as it has each year since 2006. Please review the exhibit information or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

Here are the companies that have already reserved exhibit space:

Exhibitor	Contact name	Booth	Booth Type	Booth Category
3D Glass Solutions	Foster Timothy	Booth: 40	8 x 10	In-Line
3D InCites	von Trapp Francoise	Booth: 10	8 x 10	In-Line
AdTech Ceramics	Wade Jim F	Booth: 54	8 x 10	Corner
AI Technology, Inc.	Amigh Richard	Booth: 35	8 x 10	In-Line
Amkor Technology	Garner Shellene	Booth: 37	8 x 10	Corner
Asahi Glass Company	Stygar Vern	Booth: 18	8 x 10	In-Line
ASE Group	MacLeod Patricia	Booth: 65	8 x 10	Corner
ASM Pacific Technology, Ltd.	Taran Gregg	Booth: 14	8 x 10	Corner
Atotech USA, Inc.	Roberts Hugh D	Booth: 25	8 x 10	Corner
Axus Technology	VanDevender Barrie	Booth: 05	8 x 10	Corner
Azimuth Electronics, Inc.	Hall RoJean	Booth: 42	8 x 10	Corner
Boschman Technologies	Crane John H	Booth: 49	8 x 10	In-Line
Bridge Semiconductor Corp.	Tan Jerry	Booth: 07	8 x 10	In-Line
Chalman Technologies, Inc.	Chalman Keith	Booth: 03	8 x 20	In-Line
CPS Technologies Corporation	Sullivan Bo	Booth: 52	8 x 10	In-Line
DJ DevCorp	Johnson Don	Booth: 63	8 x 10	In-Line
Dow Electronic Materials	Cole Jeremy	Booth: 27	8 x 10	In-Line
DuPont Electronics	Vernon Joan M.	Booth: 55	8 x 20	Corner
DYCONEX AG	Stutz Melanie	Booth: 20	8 x 10	Corner
Endicott Interconnect Technologies	Bagen Susan	Booth: 64	8 x 10	In-Line
Finetech, Inc.	Gerard Adrienne	Booth: 33	8 x 10	Corner
FRT of America, LLC	Flynn Paul	Booth: 62	8 x 10	In-Line
Geib Refining Corporation	Gervais Michael T	Booth: 22	8 x 10	In-Line
Gel-Pak/Quik-Pak	Nunes Jennifer	Booth: 57	8 x 10	In-Line
Hesse & Knipps, Inc.	Bubel Joseph S	Booth: 01	8 x 20	Corner
IMAT, Inc.	Feigner Eric	Booth: 13	8 x 10	In-Line
Infinite Graphics, Inc.	Maitland Pete	Booth: 53	8 x 10	In-Line
Interconnect Systems, Inc.	Brondi Dennis	Booth: 06	8 x 10	Corner
Invensas Corporation	McElrea Simon	Booth: 09	8 x 10	In-Line
IPDIA	Omnes Laetitias	Booth: 12	8 x 10	In-Line
Kyocera America, Inc.	Bowen Stephen E	Booth: 36	8 x 10	In-Line
LINTEC OF AMERICA, INC	Le Yuki	Booth: 26	8 x 10	In-Line
Micross Components	Riordan John	Booth: 08	8 x 10	In-Line
Micro Hybrid Dimensions, Inc.	Spradlin Greg	Booth: 45	8 x 10	In-Line
Mini-Systems, Inc.	Tourgee Craig	Booth: 21	8 x 10	In-Line
Mitsubishi Materials Corporation	Scott Sumiko	Booth: 24	8 x 10	Corner
NAMICS Corporation	Jensen Richard C	Booth: 39	8 x 10	In-Line
Natel Engineering Co., Inc.	Annas Steven	Booth: 28	8 x 10	Corner
Newport Corporation	Medernach Jon	Booth: 59	8 x 10	In-Line
Nordson ASYMTEK	Schropp Tracey	Booth: 46	8 x 10	Corner
Oneida Research Services, Inc.	Delluomo Deborah	Booth: 15	8 x 10	Corner
Pac Tech Packaging Technologies USA	Sarkar Mausumi	Booth: 51	8 x 10	Corner
Pacific Rim Engineering	Petit Ray P	Booth: 32	8 x 10	Corner
Palomar Technologies, Inc.	Sylvester Jessica	Booth: 41	8 x 10	In-Line
Plexus Corp.	Greathouse Steve W	Booth: 17	8 x 10	In-Line
Pure Technologies, LLC	Cohn Jerry	Booth: 47	8 x 10	Corner
PVA TePla America, Inc.	Chrysostomou Demetrius	Booth: 60	8 x 10	Corner
Rogers Corporation	Long Sheryl	Booth: 48	8 x 10	In-Line
S-Cubed (Service Support Specialties, Inc.)	Hillman Gary	Booth: 30	8 x 10	In-Line
SET - Smart Equipment Technology	Lecarpentier Gilbert	Booth: 50	8 x 10	Corner
Sikama International, Inc.	Skeen Phil	Booth: 31	8 x 10	In-Line
Solid State Equipment Corporation	Voltz John	Booth: 44	8 x 10	In-Line
Sonoscan, Inc.	Lykowski Janet	Booth: 61	8 x 10	In-Line
Souriau PA&E	Kalkowski Rick	Booth: 43	8 x 10	Corner
STATS ChipPAC, Inc.	Lavin Lisa	Booth: 23	8 x 10	In-Line
SUSS MicroTec, Inc.	Mueller Heike	Booth: 11	8 x 10	Corner
TechSearch International, Inc.	Travelstead Becky	Booth: 38	8 x 10	Corner
Teledyne Microelectronic Technologies, Inc.	Fletcher Sharon	Booth: 19	8 x 10	Corner
Trace Laboratories	Pawluk Nicholas	Booth: 29	8 x 10	Corner
West Bond, Inc.	Witters Lorri	Booth: 34	8 x 10	In-Line
XYZTEC	Blank Cynthia	Booth: 58	8 x 10	In-Line
Yole Developpement	Leroy Sandrine	Booth: 16	8 x 10	In-Line
Booth Count:	65

Questions?
Contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

DPC/GBC Premier Sponsors:

Event Sponsor - Exhibit Reception, Lunch & Break:

Post-Conference Presentations USB Drives:

Event Sponsor - 3D Panel, Breakfasts:

Coffee Break Sponsor:

Student Paper Competition
Sponsor:

Golf Hole Sponsors:

Premier "Birdie" Sponsor: Invensas

Media Sponsors:

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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