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8th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 6-8, 2012
Exhibition and Technology Showcase
March 6-7, 2012
Professional Development Courses
March 5, 2012
GBC Spring Conference
March 4-5, 2012

In conjunction with the Global Business Council (GBC) Spring Conference, March 4-5


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Peter Elenius
E&G Technology Partners

General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute
Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC


3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Passive Integration
Topical Workshop
LED Packaging
Topical Workshop
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Franck Murray
IPDIA
Technical Co-Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Rozalia Beica
Lam Research AG
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Kai Liu
STATS ChipPAC
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

2012 Exhibiting Companies

EXHIBIT HALL SOLD OUT
EARLY REGISTRATION/EXHIBIT/Hotel Deadlines: February 10, 2012


Exhibition Details | Floorplan | 2011 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament


Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out in 2012, as it has each year since 2006. Please review the exhibit information or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

Here are the companies that have already reserved exhibit space:

Exhibitor

Contact name

Booth

Booth Type

Booth Category

3D Glass Solutions

Foster Timothy

Booth: 40

8 x 10

In-Line

3D InCites

von Trapp Francoise

Booth: 10

8 x 10

In-Line

AdTech Ceramics

Wade Jim F

Booth: 54

8 x 10

Corner

AI Technology, Inc.

Amigh Richard

Booth: 35

8 x 10

In-Line

Amkor Technology

Garner Shellene

Booth: 37

8 x 10

Corner

Asahi Glass Company

Stygar Vern

Booth: 18

8 x 10

In-Line

ASE Group

MacLeod Patricia

Booth: 65

8 x 10

Corner

ASM Pacific Technology, Ltd.

Taran Gregg

Booth: 14

8 x 10

Corner

Atotech USA, Inc.

Roberts Hugh D

Booth: 25

8 x 10

Corner

Axus Technology

VanDevender Barrie

Booth: 05

8 x 10

Corner

Azimuth Electronics, Inc.

Hall RoJean

Booth: 42

8 x 10

Corner

Boschman Technologies

Crane John H

Booth: 49

8 x 10

In-Line

Bridge Semiconductor Corp.

Tan Jerry

Booth: 07

8 x 10

In-Line

Chalman Technologies, Inc.

Chalman Keith

Booth: 03

8 x 20

In-Line

CPS Technologies Corporation

Sullivan Bo

Booth: 52

8 x 10

In-Line

DJ DevCorp

Johnson Don

Booth: 63

8 x 10

In-Line

Dow Electronic Materials

Cole Jeremy

Booth: 27

8 x 10

In-Line

DuPont Electronics

Vernon Joan M.

Booth: 55

8 x 20

Corner

DYCONEX AG

Stutz Melanie

Booth: 20

8 x 10

Corner

Endicott Interconnect Technologies

Bagen Susan

Booth: 64

8 x 10

In-Line

Finetech, Inc.

Gerard Adrienne

Booth: 33

8 x 10

Corner

FRT of America, LLC

Flynn Paul

Booth: 62

8 x 10

In-Line

Geib Refining Corporation

Gervais Michael T

Booth: 22

8 x 10

In-Line

Gel-Pak/Quik-Pak

Nunes Jennifer

Booth: 57

8 x 10

In-Line

Hesse & Knipps, Inc.

Bubel Joseph S

Booth: 01

8 x 20

Corner

IMAT, Inc.

Feigner Eric

Booth: 13

8 x 10

In-Line

Infinite Graphics, Inc.

Maitland Pete

Booth: 53

8 x 10

In-Line

Interconnect Systems, Inc.

Brondi Dennis

Booth: 06

8 x 10

Corner

Invensas Corporation

McElrea Simon

Booth: 09

8 x 10

In-Line

IPDIA

Omnes Laetitias

Booth: 12

8 x 10

In-Line

Kyocera America, Inc.

Bowen Stephen E

Booth: 36

8 x 10

In-Line

LINTEC OF AMERICA, INC

Le Yuki

Booth: 26

8 x 10

In-Line

Micross Components

Riordan John

Booth: 08

8 x 10

In-Line

Micro Hybrid Dimensions, Inc.

Spradlin Greg

Booth: 45

8 x 10

In-Line

Mini-Systems, Inc.

Tourgee Craig

Booth: 21

8 x 10

In-Line

Mitsubishi Materials Corporation

Scott Sumiko

Booth: 24

8 x 10

Corner

NAMICS Corporation

Jensen Richard C

Booth: 39

8 x 10

In-Line

Natel Engineering Co., Inc.

Annas Steven

Booth: 28

8 x 10

Corner

Newport Corporation

Medernach Jon

Booth: 59

8 x 10

In-Line

Nordson ASYMTEK

Schropp Tracey

Booth: 46

8 x 10

Corner

Oneida Research Services, Inc.

Delluomo Deborah

Booth: 15

8 x 10

Corner

Pac Tech Packaging Technologies USA

Sarkar Mausumi

Booth: 51

8 x 10

Corner

Pacific Rim Engineering

Petit Ray P

Booth: 32

8 x 10

Corner

Palomar Technologies, Inc.

Sylvester Jessica

Booth: 41

8 x 10

In-Line

Plexus Corp.

Greathouse Steve W

Booth: 17

8 x 10

In-Line

Pure Technologies, LLC

Cohn Jerry

Booth: 47

8 x 10

Corner

PVA TePla America, Inc.

Chrysostomou Demetrius

Booth: 60

8 x 10

Corner

Rogers Corporation

Long Sheryl

Booth: 48

8 x 10

In-Line

S-Cubed (Service Support Specialties, Inc.)

Hillman Gary

Booth: 30

8 x 10

In-Line

SET - Smart Equipment Technology

Lecarpentier Gilbert

Booth: 50

8 x 10

Corner

Sikama International, Inc.

Skeen Phil

Booth: 31

8 x 10

In-Line

Solid State Equipment Corporation

Voltz John

Booth: 44

8 x 10

In-Line

Sonoscan, Inc.

Lykowski Janet

Booth: 61

8 x 10

In-Line

Souriau PA&E

Kalkowski Rick

Booth: 43

8 x 10

Corner

STATS ChipPAC, Inc.

Lavin Lisa

Booth: 23

8 x 10

In-Line

SUSS MicroTec, Inc.

Mueller Heike

Booth: 11

8 x 10

Corner

TechSearch International, Inc.

Travelstead Becky

Booth: 38

8 x 10

Corner

Teledyne Microelectronic Technologies, Inc.

Fletcher Sharon

Booth: 19

8 x 10

Corner

Trace Laboratories

Pawluk Nicholas

Booth: 29

8 x 10

Corner

West Bond, Inc.

Witters Lorri

Booth: 34

8 x 10

In-Line

XYZTEC

Blank Cynthia

Booth: 58

8 x 10

In-Line

Yole Developpement

Leroy Sandrine

Booth: 16

8 x 10

In-Line

Booth Count:

65

 

Questions?
Contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

 



DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

DPC/GBC Premier Sponsor: Amkor Technology

Event Sponsor - Exhibit Reception, Lunch & Break:

Applied Materials - Event Sponsor

Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Event Sponsor - 3D Panel, Breakfasts:

Event Sponsor - 3D Panel, Breakfasts, Birdie Golf: Invensas

Coffee Break Sponsor:
Sikama - Coffee Break Sponsor

Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation

Golf Hole Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

Premier "Birdie" Sponsor: Invensas

Hole Sponsor: NAMICS

Golf Hole Sponsor: LORD Corporation

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: Kyzen Corp.

Media Sponsors:

MEPTEC

Yole Developpement

I-Micronews

3D InCites - Media Sponsor

Chip Scale Review - Media Sponsor




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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