Micross

10th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 11-13, 2014
Exhibition and Technology Showcase
March 11-12, 2014
Professional Development Courses
March 10, 2014
GBC Spring Conference
March 9-10, 2014

In conjunction with the Global Business Council (GBC) Spring Conference, March 9-10


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Paul Siblerud
Strategic Tech Analysis, LLC
Past General Chair
(PDCs):

James Lu
Rensselaer Polytechnic Institute

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
Packaging Innovations & System Challenges for:
Microsystems & Devices
Topical Workshop
Photonics & LED Packaging
Topical Workshop
Technical Co-Chair:
Rozalia Beica
Yole Developpement
rbeica@gmail.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair:
Robert Dean
Auburn University deanron@auburn.edu
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
jmazurowski@eoc.psu.edu
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
peter.ramm@emft.fraunhofer.de
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Linda.Bal@freescale.com
Technical Co-Chair:
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Bob Kuo
Amkor Technology
Bob.Kuo@amkor.com


Early Registration & Hotel Deadlines: February 7, 2014

2014 Exhibiting Companies

Exhibit Booths SOLD OUT


Technical Program


Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Sixty-five full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out each year since 2006, and has sold-out again in 2014. Contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 with questions.

ALLVIA - Event Sponsor

Here are the companies that have already reserved exhibit space:

Exhibitor Booth Booth Type Booth Category
AGC Electronics America Booth: 12 8 x 10 In-Line
AI Technology, Inc. Booth: 30 8 x 10 In-Line
ALLVIA, Inc. Booth: 42 8 x 10 Corner
Amicra Microtechnologies GmbH Booth: 64 8 x 10 In-Line

Amkor Technology

PREMIER SPONSOR

Booth: 47 8 x 10 Corner

ancosys Inc.

Booth: 56 8 x 10 In-Line

ASE Group

PREMIER SPONSOR

Booth: 50 8 x 10 Corner
ASM Pacific Technology, Ltd. Booth: 26 8 x 10 In-Line
Atotech USA, Inc. Booth: 49 8 x 10 In-Line

ATV Technologie GmbH

BSET EQ

Booth: 15

SHARED

8 x 10 Corner
Axus Technology Booth: 19 8 x 10 Corner
Azimuth Electronics, Inc. Booth: 40 8 x 10 In-Line
Boschman Technologies / Advanced Packaging Center Booth: 09 8 x 10 In-Line
Chalman Technologies, Inc. Booth: 03 8 x 20 In-Line

Colorado Microcircuits, Inc.

Booth: 57 8 x 10 In-Line
CPS Technologies Booth: 52 8 x 10 In-Line
Dow Electronic Materials Booth: 28 8 x 10 Corner

DYCONEX AG

Micro Systems Engineering GmbH

Booth: 25

SHARED

8 x 10 Corner
Dynaloy - Eastman Chemical Booth: 31 8 x 10 In-Line
F&K Delvotec Inc. Booth: 36 8 x 10 In-Line
Finetech, Inc. Booth: 35 8 x 10 In-Line

FlipChip International, LLC

Booth: 45 8 x 10 In-Line
FRT of America, LLC Booth: 07 8 x 10 In-Line

Geib Refining Corporation

Booth: 63 8 x 10 In-Line
Hesse Mechatronics Booth: 01 8 x 20 Corner

i3 Electronics (Formerly Endicott Interconnect Technologies)

Booth: 27 8 x 10 In-Line
IMAT, Inc. Booth: 05 8 x 10 Corner
Infinite Graphics Booth: 08 8 x 10 In-Line
Kyocera America, Inc. Booth: 22 8 x 20 In-Line
LINTEC of America Booth: 24 8 x 10 Corner

LTEC Corporation

Booth: 53 8 x 10 In-Line
Micross Components Booth: 43 8 x 10 Corner
Mini-Systems, Inc. Booth: 44 8 x 10 In-Line
Mitsubishi Materials Corporation Booth: 34 8 x 10 In-Line
NAMICS Corporation Booth: 61 8 x 10 Corner

Neu Dynamics Corp.

Booth: 29 8 x 10 Corner
Pac Tech Packaging Technologies USA Booth: 60 8 x 10 Corner
Palomar Technologies, Inc. Booth: 41 8 x 10 In-Line

Plasma-Therm, LLC

Booth: 54 8 x 10 Corner
Polysciences, Inc. Booth: 13 8 x 10 In-Line
Pure Technologies, LLC Booth: 37 8 x 10 Corner
PVA TePla America, Inc. Booth: 16 8 x 10 In-Line
Riv, Inc. Booth: 20 8 x 10 Corner
Rudolph Technologies, Inc. Booth: 32 8 x 10 Corner
SETNA Booth: 58 8 x 10 In-Line
Sikama International, Inc. Booth: 21 8 x 10 In-Line

Solid State Equipment Corporation

PREMIER SPONSOR

Booth: 38 8 x 10 Corner
Sonoscan, Inc. Booth: 33 8 x 10 Corner

SAES Group

Booth: 10 8 x 10 In-Line

SPTS Technologies

Booth: 17 8 x 10 In-Line
STATS ChipPAC, Inc. Booth: 59 8 x 10 In-Line

Tango Systems, Inc.

Booth: 11 8 x 10 Corner
TDI International Booth: 14 8 x 10 Corner
TechSearch International, Inc. Booth: 39 8 x 10 In-Line
Trace Laboratories, Inc. Booth: 06 8 x 10 Corner
Tritron Micro Tech Booth: 66 8 x 10 Corner
Unisem Group Booth: 55 8 x 10 Corner
West Bond, Inc. Booth: 62 8 x 10 In-Line
XIA, LLC Booth: 18 8 x 10 In-Line

XYZTEC

CWI Technical Sales

Booth: 51

SHARED

8 x 10 Corner
Yole Developpement Booth: 65 8 x 10 Corner

YXLON International, Inc.

Booth: 46 8 x 10 Corner
Ziptronix, Inc. Booth: 48 8 x 10 In-Line

 

Questions?
Contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621.

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems