Micross

11th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA



Conference and Technical Workshops
March 17-19, 2015
Exhibition and Technology Showcase
March 17-18, 2015
Professional Development Courses
March 16, 2015
NEW** GBC Plenary Session on IoT
March 18, 2015




Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Rozalia Beica
Yole Developpement
Past General Chair
(PDCs):

James Lu
Rensselaer Polytechnic Institute
Past General Chair
(Technical):

Paul Siblerud
Strategic Tech Analysis, LLC

3D & TSV
Track
Flip Chip & Wafer Level Packaging
Track
Engineered Microsystems & Devices (includes MEMS & Sensors) Track
Photonics, LED & Emerging Technologies Track
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
peter.ramm@emft.fraunhofer.de
Technical Co-Chair:
John Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair:
Robert Dean
Auburn University
deanron@auburn.edu
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
jmazurowski@eoc.psu.edu
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
jcalvert@dow.com
Technical Co-Chair:
John Hunt
ASE US
John.Hunt@aseus.com
Technical Co-Chair:
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
TBD


Early Registration & Hotel Deadlines: February 17, 2015

 

2015 Exhibiting Companies
Exhibit Booths SOLD OUT


Device Homepage | Floorplan | 2014 Exhibitors


Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Sixty-five full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out each year since 2006, and has sold-out again in 2015. Contact Brian Schieman by email at bschieman@imaps.org with questions.

 

Here are the companies that have already reserved exhibit space:

Exhibitor

Booth

Booth Type

Booth Category

AdTech Ceramics

Booth #: 64

8 x 10

In-Line

AGC Electronics America

Booth #: 15

8 x 10

Corner

AI Technology, Inc.

Booth #: 30

8 x 10

In-Line

ALLVIA, Inc.

Booth #: 58

8 x 10

In-Line

AMICRA Microtechnologies GmbH

Booth #: 06

8 x 10

Corner

Amkor Technology

Booth #: 47

8 x 10

Corner

ASE US, Inc.

Booth #: 50

8 x 10

Corner

AT&S

Booth #: 55

8 x 10

Corner

Atotech USA, Inc.

Booth #: 51

8 x 10

Corner

ATV Technologie GmbH

Booth #: 46

8 x 10

Corner

Azimuth Electronics, Inc.

Booth #: 21

8 x 10

In-Line

Benchmark Electronics, Inc.

Booth #: 26

8 x 10

In-Line

Boschman Technologies / Advanced Packaging Center

Booth #: 41

8 x 10

In-Line

Chalman Technologies, Inc.

Booth #: 03

8 x 20

In-Line

DCG Systems

Booth #: 08

8 x 10

In-Line

Deweyl Tool Company, Inc.

Booth #: 16

8 x 10

In-Line

Dow Electronic Materials

Booth #: 29

8 x 10

Corner

DYCONEX AG
(Shared with Micro Systems Eng.)

Booth #: 62

8 x 10

In-Line

Engent, Inc.

Booth #: 11

8 x 10

Corner

F & K Delvotec, Inc.

Booth #: 36

8 x 10

In-Line

Finetech, Inc.

Booth #: 24

8 x 10

Corner

FRT of America, LLC

Booth #: 23

10 x 10

In-Line

Geib Refining Corporation

Booth #: 31

8 x 10

In-Line

Hesse Mechatronics, Inc.

Booth #: 01

8 x 20

Corner

IBM Microelectronics Division

Booth #: 12

8 x 10

In-Line

IMAT, Inc.

Booth #: 05

8 x 10

Corner

Infinite Graphics

Booth #: 37

8 x 10

Corner

Invenios

Booth #: 54

8 x 10

Corner

Kulicke & Soffa Industries, Inc.

Booth #: 10

8 x 10

In-Line

Kyocera America, Inc.

Booth #: 48

8 x 20

In-Line

LINTEC OF AMERICA, INC

Booth #: 40

8 x 10

In-Line

Mentor Graphics Corporation

Booth #: 52

8 x 10

In-Line

Micro Hybrid Dimensions

Booth #: 66

8 x 10

Corner

Micro Systems Engineering GmbH
(Shared with DYCONEX)

Booth #: 62

8 x 10

In-Line

Micross Components

Booth #: 28

8 x 10

Corner

M-Solv Ltd.

Booth #: 13

8 x 10

In-Line

NAMICS Corporation

Booth #: 61

8 x 10

Corner

Neu Dynamics Corp.

Booth #: 53

8 x 10

In-Line

Pac Tech Packaging Technologies USA

Booth #: 65

8 x 10

Corner

Palomar Technologies, Inc.

Booth #: 25

8 x 10

Corner

Panasonic Factory Solutions Company of America

Booth #: 60

8 x 10

Corner

Plasma-Therm, LLC

Booth #: 19

8 x 10

Corner

Polysciences, Inc.

Booth #: 34

8 x 10

In-Line

Pure Technologies, LLC

Booth #: 20

8 x 10

Corner

Riv, Inc.

Booth #: 32

8 x 10

Corner

Rudolph Technologies

Booth #: 33

8 x 10

Corner

SavanSys Solutions LLC

Booth #: 45

8 x 10

In-Line

Sikama International, Inc.

Booth #: 22

8 x 10

In-Line

Solid State Equipment Corporation

Booth #: 38

8 x 10

Corner

Sonoscan, Inc.

Booth #: 43

8 x 10

Corner

SPTS Technologies

Booth #: 57

8 x 10

In-Line

STATS ChipPAC, Inc.

Booth #: 9

8 x 10

In-Line

Tango Systems, Inc.

Booth #: 59

8 x 10

In-Line

Technic, Inc.

Booth #: 17

8 x 10

In-Line

TechSearch International, Inc.

Booth #: 39

8 x 10

In-Line

Teikoku Taping System Inc.

Booth #: 07

8 x 10

In-Line

TESEC Incorporated

Booth #: 27

8 x 10

In-Line

Tresky Corporation

Booth #: 44

8 x 10

In-Line

Triton MicroTech, Inc.

Booth #: 56

8 x 10

In-Line

Unisem Group

Booth #: 14

8 x 10

Corner

West Bond, Inc.

Booth #: 63

8 x 10

In-Line

XIA, LLC

Booth #: 35

8 x 10

In-Line

XYZTEC

Booth #: 42

8 x 10

Corner

Yole Developpement

Booth #: 18

8 x 10

In-Line

Exhibitor Count:

66 - SOLD OUT

 

Questions?
Contact Brian Schieman by email at bschieman@imaps.org.

 

Device Packaging/GBC Sponsors

Premier Sponsor:
DPC/GBC Premier Sponsor: VEECO

Premier Sponsor:

Golf Hole Sponsor: Amkor Technology

Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.

Corporate Sponsors

SPTS - Corporate Sponsor

Mentor Graphics - Corporate Sponsor
Event Sponsors
Sponsor - Badge Lanyards:
Hole Sponsor: NAMICS
Sponsor - GBC Speaker Dinner:
Kyocera - GBC Speaker Dinner Sponsor
Poster Session "Happy Hour":
Sponsor: Lam Research

Sponsor - Lunches:
Applied Materials - Event Sponsor

Sponsor - Evening Sessions:
EV Group - Evening Sessions Sponsor
Sponsor - Lunches:
Protavic - Event Sponsor
Sponsor - Refreshment Breaks:
MRSI - Break Sponsor
Sponsor - Refreshment Breaks:
i3 Electronics - Refreshment Break Sponsor
Sponsor - Refreshment Breaks:
ASM Pacific - Refreshment Break Sponsor
Sponsor - Mobile Charging Station:
Technic - Sponsor - Mobile Charging Station
Sponsor - Bag Insert/Giveaway:
Ubotic - Insert/Giveaway Sponsor
Sponsor - Bag Insert/Giveaway:
ALLVIA - Insert/Giveaway Sponsor
Sponsor - Bag Insert/Giveaway:
STATSChipPAC - Bag Insert/Giveaway Sponsor
sponsorships
available
   
Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: VEECO

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology
Hole Sponsor:
Hole Sponsor: NAMICS
Hole Sponsor:
Ubotic - Insert/Giveaway Sponsor
Hole Sponsor:
Golf Hole Sponsor: Coining Inc/Ametek
Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor:
ASM Pacific - Hole Sponsor

Hole Sponsor:
Golf Hole Sponsor: Infinite Graphics

Hole Sponsor:
Golf Hole Sponsor: PUTTIST, 3-Putt Killer

Hole Sponsor:
Golf Hole Sponsor: Dixon Golf

2 hole sponsorships
available
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems