Micross

12th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 15-17, 2016
Exhibition and Technology Showcase
March 15-16, 2016
Professional Development Courses
March 14, 2016
GBC Plenary Session
March 16, 2016

*BOOTHS SOLD OUT*

Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Rozalia Beica
Yole Developpement

General Chair-elect:
Peter Ramm
Fraunhofer EMFT Munich
Past General Chair:
Ron Huemoeller
Amkor Technology

Interposers, 3D IC & Packaging
Flip Chip, Wafer Level Packaging & FAN-OUT
SiP & Engineered Micro Systems/Devices
(including MEMS & Sensors)
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
jcalvert@dow.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair (Engr. Micro Sys.):
Robert Dean
Auburn University
deanron@auburn.edu
Technical Co-Chair:
Kathy Cook
Ziptronix
k.cook@ziptronix.com
Technical Co-Chair:
John Hunt
ASE US
John.Hunt@aseus.com
Technical Co-Chair (Engr. Micro Sys.):
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Rahul Agarwal
GlobalFoundries
rahul.agarwal@globalfoundries.com
Technical Co-Chair:
Eric Huenger
Dow Advanced Packaging Materials
EHuenger@dow.com
Technical Co-Chair (SiP):
Nozad Karim
Amkor Technology
nozad.karim@amkor.com


 

2016 Exhibiting Companies
Exhibit Booths SOLD OUT


Device Homepage | Floorplan | 2015 Exhibitors


Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Sixty-five full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out each year since 2006, and has sold-out again in 2016. Contact Brian Schieman by email at bschieman@imaps.org with questions.

 

Here are the companies that have already reserved exhibit space:

Exhibitor Booth Booth Type Booth Category
Advance Reproductions Corp. Booth:  58 8 x 10 In-Line
AGC Electronics America Booth:  31 8 x 10 In-Line
AI Technology, Inc. Booth:  53 8 x 10 In-Line
AkroMetrix, LLC Booth:  02 8 x 10 In-Line
AMICRA Microtechnologies GmbH Booth:  26 8 x 10 In-Line
Amkor Technology Booth:  38 8 x 10 Corner
ASE US, Inc. Booth:  47 8 x 10 Corner
ASM Pacific Technology, Ltd. Booth:  51 8 x 10 Corner
AT&S Americas, LLC Booth:  45 8 x 10 In-Line
Atotech USA, Inc. Booth:  32 8 x 10 Corner
ATV Technologie GmbH Booth:  06 8 x 10 Corner
Axus Technology Booth:  56 8 x 10 In-Line
Azimuth Electronics, Inc. Booth:  62 8 x 10 In-Line
Boschman Technologies / Advanced Packaging Center Booth:  36 8 x 10 In-Line
Canon USA Booth:  66 Tabletop Island
Coherent, Inc. Booth:  46 8 x 10 Corner
Deweyl Tool Company, Inc. Booth:  03 8 x 10 In-Line
Dow Electronic Materials Booth:  29 8 x 10 Corner
EMD Performance Materials Booth:  10 8 x 10 In-Line
EV Group, Inc. Booth:  22 8 x 10 In-Line
F & K Delvotec, Inc. Booth:  11 8 x 10 Corner
Finetech, Inc. Booth:  21 8 x 10 In-Line
FlipChip International, LLC Booth:  30 8 x 10 In-Line
Geib Refining Corporation Booth:  25 8 x 10 Corner
Hesse Mechatronics, Inc. Booth:  01 8 x 10 Corner
HSIO Technologies Booth:  54 8 x 10 Corner
i3 Electronics Booth:  15 8 x 10 Corner
IBM Canada Ltd. Booth:  12 8 x 10 In-Line
IMAT, Inc. Booth:  05 8 x 10 Corner
Infinite Graphics Booth:  04 8 x 10 In-Line
Invenios Booth:  52 8 x 10 In-Line
JSR Micro, Inc. Booth:  07 8 x 10 In-Line
Kulicke & Soffa Industries, Inc. Booth:  60 8 x 10 Corner
Kyocera America, Inc. Booth:  48 8 x 20 In-Line
LB Semicon, Inc. Booth:  18 8 x 10 In-Line
Mentor Graphics Corporation Booth:  50 8 x 10 Corner
Metalor Technologies USA Booth:  65 8 x 10 Corner
Micro Hybrid Dimensions, Inc. Booth:  23 8 x 10 In-Line
Micro Systems Technologies Management AG Booth:  33 8 x 10 Corner
Micross Components Booth:  34 8 x 10 In-Line
Mini-Systems, Inc. Booth:  27 8 x 10 In-Line
MRSI Systems LLC Booth:  61 8 x 10 Corner
NAMICS Corporation Booth:  39 8 x 10 In-Line
Neu Dynamics Corp. Booth:  59 8 x 10 In-Line
Pac Tech Packaging Technologies USA Booth:  14 8 x 10 Corner
Palomar Technologies, Inc. Booth:  16 8 x 10 In-Line
Plasma-Therm, LLC Booth:  19 8 x 10 Corner
Riv Inc. ~ Precision Printing Screens Booth:  24 8 x 10 Corner
Rudolph Technologies Booth:  63 8 x 10 In-Line
SAES Getters USA Booth:  09 8 x 10 In-Line
SavanSys Solutions LLC Booth:  35 8 x 10 In-Line
Sentec E&E Co., Ltd. Booth:  13 8 x 10 In-Line
SETNA Corporation Booth:  41 8 x 10 In-Line
Shinko Electric America Booth:  28 8 x 10 Corner
Sikama International, Inc. Booth:  40 8 x 10 In-Line
Sonoscan, Inc. Booth:  64 8 x 10 In-Line
SPTS Technologies, an Orbotech company Booth:  20 8 x 10 Corner
STATS ChipPAC, Inc. Booth:  55 8 x 10 Corner
Technic, Inc. Booth:  17 8 x 10 In-Line
TechSearch International, Inc. Booth:  37 8 x 10 Corner
Teikoku Taping System Inc. Booth:  08 8 x 10 In-Line
Triton Microtechnologies Booth:  57 8 x 10 In-Line
West Bond, Inc. Booth:  44 8 x 10 In-Line
XYZTEC Booth:  43 8 x 10 Corner
Yole Developpement Booth:  42 8 x 10 Corner

 

 

 

Questions?
Contact Brian Schieman by email at bschieman@imaps.org.

 

Device Packaging/GBC Sponsorship
(Need to be ahead of your competition? Join this list today! A few spots remain)

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: ASE US, Inc.

PREMIER SPONSOR:
Golf Hole Sponsor: Amkor Technology

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors
SPTS - Corporate Sponsor
Mentor Graphics - Corporate Sponsor
EMD Performance Materials - Corporate Sponsor
Event Sponsors

Mobile APP Sponsor: SETNA

Mobile "App" Sponsor

Applied Materials - Event Sponsor

Mobile Charging Station &
Evening Panel / Reception

VEECO - Mobile Charging Station & Golf Sponsor

Mobile Charging Station

Shenmao - Event Sponsor

Refreshment Breaks &
Attendee Bag Insert

Poster Session / Happy Hour Sponsor: XIA

Poster Session & Happy Hour Sponsor

 

 

 

Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Birdie" Sponsor (1 hole):
Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Eagle" Sponsor (3 holes):DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

EMD Performance Materials - Corporate Sponsor

Hole #14 - Closest to Pin

Golf Hole Sponsor: Infinite Graphics

Hole #6 - Closest to Pin

MRSI - Break Sponsor

Hole #10

Golf Hole Sponsor: Coining Inc/SPM

Hole #5

Technic - Sponsor - Mobile Charging Station

Hole #7

VEECO - Golf Sponsor

Holes #4 - Longest Putt, #15

ASM Pacific - Hole Sponsor

Hole #11

Golf Hole Sponsor: AGC Electronics America

Hole #13

Golf Hole Sponsor: Dixon Golf

Hole #9 - Straight Drive Competition
Hole #17 - Hole-in-One Competition

Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor
     

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems