KESTER

13th International Conference and Exhibition on
DEVICE PACKAGING
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 7-9, 2017
Exhibition and Technology Showcase
March 7-8, 2017
Professional Development Courses
March 6, 2017
GBC Plenary Session
March 8, 2017
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Gilles Poupon
CEA


General Chair-Elect:
Peter Ramm
Fraunhofer EMFT Munich


Past General Chair:
Rozalia Beica
Dow Electronic Materials

Past General Chair:
Ron Huemoeller
Amkor Technology



 

2017 Exhibiting Companies
Exhibit Booths SOLD OUT


Device Homepage | Floorplan | 2016 Exhibitors


Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Sixty-five full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out each year since 2006, and has sold-out again in 2017. Contact Brian Schieman by email at bschieman@imaps.org with questions.

 

Here are the companies that have already reserved exhibit space:

EXHIBITOR

BOOTH

AGC Electronics America

Booth# 36

AkroMetrix LLC

Booth# 28

AMICRA Microtechnologies GmbH

Booth# 27

Amkor Technology

Booth# 38

ASE US

Booth# 47

ASM Pacific

Booth# 16

AT&S

Booth# 29

Axus Technologies

Booth# 66 (TABLETOP)

Boschman Technologies / Advanced Packaging Center

Booth# 34

Cadence Design Systems

Booth# 50

Chalman Technologies

Booths# 2-3

DeWeyl Tool Company

Booth# 19

Dow Electronic Materials

Booth# 46

EMD Performance Materials

Booth# 37

EV Group

Booth# 24

Evatec AG

Booth# 49

F&K Delvotec

Booth# 13

FlipChip International

Booth# 63

Geib Refining Corp

Booth# 62

Hesse Mechatronics, Inc.

Booth# 1

HSIO Technologies

Booth# 12

i3 Electronics

Booth# 65

IBM Canada Ltd.

Booth# 11

IMAT Inc.

Booth# 5

Invenios

Booth# 26

JSR Micro, Inc.

Booth# 6

Kulicke and Soffa Industries, Inc.

Booth# 53

Kyocera America

Booth# 21-22

MacDermid Enthone Electronics Solutions

Booths# 7-8

Materion Corp.

Booth# 4

Metalor

Booth# 23

Micro Systems Technologies

Booth# 14

Micross Components

Booth# 45

Mini-Systems, Inc.

Booth# 31

MRSI Systems

Booth# 44

NAMICS Corp.

Booth# 39

NANIUM S.A.

Booth# 61

Neu Dynamics Corp.

Booth# 59

NGK / NTK Technologies

Booth# 48

Nikon Precision Inc.

Booth# 20

PacTech USA Inc.

Booth# 60

Palomar Technologies

Booth# 51

Plasma Therm, LLC

Booth# 54

Riv, Inc.

Booth# 43

Rudolph Technologies, Inc.

Booth# 32

SANTIER

Booth# 9

SETNA

Booth# 41

Shinko Electric America

Booth# 56

Sikama International, Inc.

Booth# 18

Sonoscan

Booth# 33

SPTS Technologies, an Orbotech company

Booth# 42

STATS ChipPAC

Booth# 55

StratEdge Corporation

Booth# 10

Superior Silica, LLC

Booth# 52

Takaoka Toko Co., Ltd.

Booth# 40

Technic Inc.

Booth# 25

TechSearch International

Booth# 35

Teikoku Taping System Inc.

Booth# 17

TMS Representatives, LLC

Booth# 30

Unisem

Booth# 57

XYZTEC

Booth# 64

Yole Developpement

Booth# 15

Yxlon FeinFocus

Booth# 58

 

Questions?
Contact Brian Schieman by email at bschieman@imaps.org.

 

Device Packaging Sponsorship (Need to be ahead of your competition? Join this list today!)

PLATINUM PREMIER SPONSOR

DPC/GBC Premier Sponsor: ASE US, Inc.

GOLD PREMIER SPONSORS
DPC Premier Gold Sponsor: Amkor Technology
DPC Premier Gold Sponsor: NAMICS
DPC Premier Gold Sponsor: Nanium
DPC Premier Gold Sponsor: Cadence
Corporate Sponsors
EMD Performance Materials - Corporate Sponsor
Mobile APP Sponsor: SETNA
Corporate Sponsor - NGK NTK
SPTS - Corporate Sponsor
Corporate Sponsor: Evatec
Corporate Sponsor: Takaoka Toko Co. Ltd.
Additional Event Sponsors

Exhibit Reception Sponsor: Metalor

Exhibit Hall Reception & Coffee Break

Exhibit Hall Reception Sponsor: Mentor Graphics

Exhibit Hall Reception

Mobile Station & Poster Session Sponsor: VEECO

Mobile Charging Station &
Poster Session Happy Hour

Poster Session Sponsor: Quantum Analytics

Poster Session Happy Hour

Poster Session Sponsor: SAMTEC

Poster Session Happy Hour

Poster Session Sponsor: Applied Materials

Poster Session Happy Hour

Panel Session Sponsor: Unity SC

Evening Panel & Reception

Notebook Sponsor: SMART Microsystems

Session Notebooks/Pens

Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):

DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Eagle" Sponsor (3 holes):

DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Birdie" Sponsor (1 hole):

DPC Premier Gold Sponsor: Nanium

Hole #6 - Closest to Pin

"Birdie" Sponsor (1 hole):

DPC Premier Gold Sponsor: Cadence

Hole #14 - Closest to Pin

"Birdie" Sponsor (1 hole):

ASM Pacific - Hole Sponsor

Hole #15

EMD Performance Materials - Corporate Sponsor

Hole #10 - Longest Putt

Golf Hole Sponsor: AGC Electronics America

Hole #4

Golf Hole Sponsor: Nikon

Hole #7

Mobile Station & Poster Session Sponsor: VEECO

Hole #5

Golf Sponsor: NxQ
Mask Aligners

Hole #11

Technic - Golf Hole Sponsor

Hole #13

Golf Hole Sponsor: Dixon Golf

Hole #9 - Straight Drive Competition
Hole #17 - Hole-in-One Competition

Golf Awards Sponsor: Advance Reproductions

Golf Awards Sponsor

Official Media Sponsors
Media Sponsor: MEMS Journal
YOLE
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor
   

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems