Micross

14th International Conference and Exhibition on
DEVICE PACKAGING
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 6-8, 2018
Exhibition and Technology Showcase
March 6-7, 2018
Professional Development Courses
March 5, 2018
GBC Plenary Session
March 7, 2018
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Peter Ramm
Fraunhofer EMFT Munich


General Chair-Elect:
Jon Aday
Qualcomm


Past General Chair:
Rozalia Beica
Dow Electronic Materials

Past General Chair:
Gilles Poupon
CEA



 

2018 Exhibiting Companies
Exhibit Booths SOLD OUT


Device Homepage | Floorplan


Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Sixty-five full 8' by 10' exhibit spaces will be available. The Exhibit Hall has sold out each year since 2006, and has sold-out again in 2018 (early than ever before - September!). Contact Brian Schieman by email at bschieman@imaps.org with questions.

 

Here are the companies that have already reserved exhibit space:

Company Booth # 
AdTech 12
AGC 34
AI Technology 66
AMICRA  Microtechnologies 26
Amkor Technology, Inc. 37
ASE Group 47
ASM Pacific Technology 55
AT&S America 24
ATV Technologie GmbH 13
Axus Technology 22
Boschman Technologies / APC 2
Cadence Design Systems, Inc. 43
Chalman Technologies 8+9
DeWeyl Tool Company 17
Dow Electronic Materials  19
EMD Performance Materials 38
EV Group, Inc. 41
Evatec 49
F&K Delvotec, Inc. 59
FlipChip - Huatian 18
Hesse Mechatronics, Inc. 7
HSIO Technologies 5
IBM Canada Ltd. 16
IMAT, Inc. 29
JSR Micro, Inc 6
Kyocera 40
LINTEC of America 11
MacDermid Enthone / Alpha Advanced Materials 45+46
Mentor, A Siemens Business 48
Metalor Technologies USA 15
Micro Systems Technologies Management AG 28
MicroChem Corp. 58
Microconnex 3
Micross 52
Mini-Systems, Inc. 4
NAMICS 39
nanosystec Inc. 10
Neutronix-Quintel 53
Nikon Precision Inc 51
NTK Technologies 21
PacTech USA Inc. 56
Palomar Technologies 63
Plasma-Therm, LLC 65
Rudolph Technologies, Inc. 32
SETNA 50
SHINKO Electric America, Inc. 44
Sikama International Inc 35
SMART Microsystems Ltd 14
Sonoscan, Inc. 33
SPTS 42
Sputtering Components Inc 30
STATS ChipPAC 23
StratEdge Corporation 62
Superior Silica 31
Technic 25
TechSearch International 20
Teikoku Taping System, Inc. 57
Unisem 1
UnitySC 60
XYZTEC 61
Yield Engineering Systems 64
Yole Developpement 36
Yxlon FeinFocus 54
Zuken, Inc 27

 

 

Questions?
Contact Brian Schieman by email at bschieman@imaps.org.

 

Device Packaging Sponsorship (Need to be ahead of your competition? Join this list today!)

PLATINUM PREMIER SPONSOR

Premier Platinum Sponsor: ASE US, Inc.
GOLD PREMIER SPONSORS
Premier Gold 
Sponsor - EMD Performance Materials
Premier Gold Sponsor - XYZTEC
SILVER PREMIER SPONSORS
Premier Silver Sponsor: Amkor Technology
Premier Silver Sponsor: NAMICS
Premier Silver Sponsor: Cadence
Premier Silver Sponsor: Mentor Graphics Premier Silver Sponsor: Kyocera
Corporate Sponsors
Corporate Sponsor - Dow Electronic Materials Corporate Sponsor - Technic
Mobile APP Sponsor: SETNA
SPTS - Corporate Sponsor
Corporate Sponsor - NGK NTK
Corporate Sponsor: Evatec
Corporate Sponsor: Applied Materials
Additional Event Sponsors

Mobile Station & Poster Session Sponsor: VEECO

Mobile Charging Station &
Poster Session Happy Hour

Poster Session Sponsor: SAMTEC

Poster Session Happy Hour

Break Sponsor - Intevac

Coffee Breaks (3)

Break Sponsor: 
TechSearch International

Coffee Break

Evening Panel & Reception Sponsor: Yield Engineering Systems, Inc.(YES)

Evening Panel & Reception

Break Sponsor: 
S3IP Binghamton University

Coffee Break

Sponsor: 
Kulicke and Soffa Industries

Bag Inserts & Web

 
Golf/Foundation Sponsors

"Birdie" Sponsor (1 hole):

DPC/GBC Premier Sponsor: ASE US, Inc.

Hole: 5 - Closest to Pin

"Birdie" Sponsor (1 hole):

EMD Performance Materials - Corporate Sponsor

Hole: 9 - Closest to Pin

"Birdie" Sponsor (1 hole):

Premier Gold Sponsor - XYZTEC

Hole: 15 - Closest to Pin

"Birdie" Sponsor (1 hole):

DPC/GBC Premier Sponsor: NAMICS

Hole: 12 - Longest Drive

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology

Hole: 18 - Longest Putt

"Birdie" Sponsor (1 hole):

DPC Premier Gold Sponsor: Cadence

Hole: 1

"Birdie" Sponsor (1 hole):

Premier Silver Sponsor: Mentor Graphics

Hole: 2

"Birdie" Sponsor (1 hole):

Premier Silver Sponsor: Kyocera

Hole: 3

Golf Hole Sponsor: AGC Electronics America

Hole: 7 - Closest 2ND SHOT

Mobile Station & Poster Session Sponsor: VEECO

Hole: 6

Golf Sponsor: NxQ
Mask Aligners

Hole: 8

Golf Hole Sponsor: Nikon

Hole: 10

ASM Pacific - Hole Sponsor

Hole: 13

Corporate Sponsor - Technic

Hole: 14

Corporate Sponsor - Technic

Hole: 16

Golf Hole Sponsor: Advance Reproductions

Hole: 17

Golf Hole Sponsor: Dixon Golf

Hole: 4 - Straight Drive Competition
Hole: 11 - Hole-in-One Competition

Official Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: Webcom - Electronics Protection
   

 



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems