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4th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 17-20, 2008
Exhibition and Technology Showcase
March 18-19, 2008
Professional Development Courses
March 17, 2008
GBC Spring Conference
March 16-17, 2008

Exhibition Information
download PDF of Exhibit Brochure


Reserve Exhibits On-line | Hotel Reservations
Exhibit Hours | Installation | Dismantle | Cost | CD Participation
Floorplan | 2008 Exhibitors | 2007 Exhibitors
Professional Development Courses (PDCs)

IMAPS is pleased to organize the 4th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format again this year will feature five Workshops concentrating on: 3D Packaging; FlipChip Technologies; Wafer Level Packaging/Embedded Packaging; MEMS and associated microsystems; and Electronic Packaging Issues for Medical Devices. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2008 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006 and 2007 exhibitions were sold out early and we expect continued growth for 2008 so reserve your booth early. THE EXHIBIT FLOOR HAS SOLD OUT AGAIN IN 2008

The Device Packaging Conference and Exhibition has doubled in attendance and sold out exhibit space every year since its inception. Last year the session rooms were crowded and we had six (6) companies on a waiting list for booth space.

Exhibitors had this to say about past Device Packaging Conferences:

"Strong technical sessions brought quality leads."
"Great to see a lot of local attendees as well as international visitors."
"Good booth traffic."
"Good potential customers."
"Best show for wafer level packaging."

The 2008 Device Packaging Conference and Exhibition will be at the brand new Radisson Fort McDowell Resort and Casino, Scottsdale, AZ where we will be able to accommodate a larger group of attendees and exhibiting companies. However, there is a limit, so it’s in your best interest to reserve early.

Reserve Exhibits On-line

Exhibit Hours:
Tuesday, March 18, 2008 - 10:30 AM - 7:00 PM
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 19, 2008 - 9:00 AM - 3:00 PM
Lunch, Breaks and a Poster Session will be held in the Exhibit Hall

Installation Hours:
Monday, March 17 - 12 PM (noon) to 8:00 PM

Tuesday, March 18 - 6:00 AM to 9:00 AM

*Dismantle Hours:
Wednesday, March 19 - 3:00 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 3:01 pm, Wednesday, March 19, 2008, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2009.

Booth Rental Fees for one (1) 8' x 10' Booth:*

On/Before 2/14/08
After 2/14/08
IMAPS Corporate Member
Non-Corporate Member *
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

Each Exhibiting Company will receive with their booth rental:

  • one (1) Full Conference Registration
  • one (1) Full CD-ROM of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees
  • Exhibit Hall Admission for two Booth Personnel
  • CD-Rom Participation
  • $100 Discount on GBC Spring Meeting Registration

Additional booth personnel are welcome at an extra cost of $50 per person. Additional registrations for the full conference are not included, but are available at an additional cost.

CD-Rom Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference CD-ROM. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to on or before 3/15/08. Submisions must be as stated and make the deadline. There is no charge for participation.

Hotel Reservation Deadline - February 12, 2008
Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
Rooms on hold March 15 – 20, 2008

For reservations, call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 12, 2008.

For more information and to rent a booth, please contact Ann Bell, 202-548-8717;
E-Mail: or Reserve on-line.


Corporate Sponsor - Ticona Engineering Polymers

Corporate Sponsor - NEXX Systems

Student Paper Competition

Student Paper Competition Sponsor - Nordson

Student Paper Competition Sponsor - The Microelectronics Foundation

Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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