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5th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 10-12, 2009
Exhibition and Technology Showcase
March 10-11, 2009
Professional Development Courses
March 9, 2009
GBC Spring Conference
March 8-9, 2009

In conjunction with the Global Business Council (GBC) Spring Conference, March 8-9

Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute
General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer

Exhibition Information
download PDF of Exhibit Brochure

The Exhibit Hall Has Sold Out!

Early Reservation Deadline: February 4, 2009

Reserve Exhibits On-line | Hotel Reservations
Exhibit Hours | Installation | Dismantle | Cost | CD Participation
Floorplan | 2009 Exhibitors | 2008 Exhibitors

IMAPS is pleased to organize the 4th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format has expanded again this year now featuring six Workshops concentrating on: 3D Packaging; FlipChip Technologies; Wafer Level Packaging/CSP; MEMS and associated microsystems; Electronic Packaging for Medical Devices; and new this year, Packaging & Application of Power LED Devices. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2009 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006, 2007 and 2008 exhibitions were sold out early and the hall has sold out again for 2009 (in late-December 2008).

The Exhibit Hall Has Sold Out!

The Device Packaging Conference and Exhibition has doubled in attendance and sold out exhibit space every year since its inception. In 2008, the attendance grew another 20%, it was standing room only in all the session rooms , and we had 17 companies on a waiting list for booth space.

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2009 Device Packaging Conference and Exhibition will be held again at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Due to an increase in the number of attendees and the size of the technical program with the addition of a sixth technical workshop, we have reconfigured the exhibit hall to allow for an additional meeting room. There is a strict limit to the number of booths available in 2009, so it’s in your best interest to reserve early.

The Exhibit Hall Has Sold Out!

Exhibit Hours:
Tuesday, March 10, 2009 - 10:00 AM - 7:00 PM
Lunch, Breaks and Receptions will be held in the Exhibit Hall

Wednesday, March 11, 2009 - 9:00 AM - 3:00 PM
Lunch, Breaks and a Poster Session will be held in the Exhibit Hall

Installation Hours:
Monday, March 9 - 12 PM (noon) to 8:00 PM

Tuesday, March 10 - 7:00 AM to 9:00 AM

*Dismantle Hours:
Wednesday, March 11 - 3:00 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 3:01 pm, Wednesday, March 11, 2009, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2010.

Booth Rental Fees for one (1) 8' x 10' Booth:*

On/Before 2/4/09
After 2/4/09
IMAPS Corporate Member
Non-Corporate Member *
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

Each Exhibiting Company will receive with their booth rental:

  • one (1) Full Conference Registration
  • two (2) Booth Personnel (any more than 2 per each 8x10 will be charged $50 each)
  • one (1) Full CD-ROM of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • CD-Rom Participation
  • $100 Discount on GBC Spring Meeting Registration

Additional booth personnel are welcome at an extra cost of $50 per person. Additional registrations for the full conference are not included, but are available at an additional cost.

CD-Rom Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference CD-ROM. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to on or before 3/5/09. Submisions must be as stated and make the deadline. There is no charge for participation.

Hotel Reservation Deadline - February 6, 2009

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Promotional Code: IMAPS9

For more information and to rent a booth, please contact Ann Bell, 202-548-8717;


Corporate Sponsor - NEXX Systems

Student Paper Competition

Student Paper Competition Sponsor - The Microelectronics Foundation


Media Sponsor - Advanced Packaging

Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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