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6th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 9-11, 2010
Exhibition and Technology Showcase
March 9-10, 2010
Professional Development Courses
March 8, 2010
GBC Spring Conference
March 7-8, 2010

In conjunction with the Global Business Council (GBC) Spring Conference, March 7-8


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Phil Garrou
Microelectronic Consultants of NC


Technical Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Technical Co-Chair:
Ted Tessier
FlipChip International
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Frank Wall
Philips
Technical Co-Chair:
Lee Smith
Amkor Technology
Technical Co-Chair:
Lou Nicholls
Amkor Technology
Technical Co-Chair:
Andrew Strandjord
Pac Tech USA
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:

Exhibition Information
download PDF of Exhibit Brochure

Early Reservation Deadline: February 4, 2010

Reserve Exhibits On-line | Hotel Reservations
Exhibit Hours | Installation | Dismantle | Cost | CD Participation
Floorplan | 2010 Exhibitors | 2009 Exhibitors



IMAPS is pleased to organize the 6th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format has expanded again this year now featuring five tracks/workshops concentrating on: 3D Interconnect & Packaging; FlipChip Technologies; Wafer Level Packaging/CSP; MEMS, including Bio-MEMS; and Emerging Technologies includin LED Devices and, new this year, Passive Integration. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2010 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006-2009 exhibitions were sold out early and the hall is already filling fast for 2010.

The Device Packaging Conference and Exhibition has doubled in attendance and sold out exhibit space every year since its inception. In 2008, the attendance grew another 20%, it was standing room only in all the session rooms , and we had 17 companies on a waiting list for booth space.

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2010 Device Packaging Conference and Exhibition will be held again at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Due to an increase in the number of attendees and the size of the technical program with the addition of a sixth technical workshop, we have reconfigured the exhibit hall to allow for an additional meeting room. There is a strict limit to the number of booths available in 2009, so it’s in your best interest to reserve early.


Exhibit Hours:
Tuesday, March 9, 2010 - 10:00 AM - 7:00 PM
Lunch, Breaks and Receptions will be held in the Exhibit Hall

Wednesday, March 10, 2010 - 9:00 AM - 3:00 PM
Lunch, Breaks and a Poster Session will be held in the Exhibit Hall

Installation Hours:
Monday, March 8: 12 PM (noon) to 8:00 PM

Tuesday, March 9: 6:00 AM to 10:00 AM

*Dismantle Hours:
Wednesday, March 10 - 3:00 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 3:01 pm, Wednesday, March 10, 2010, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2011.

Booth Rental Fees for one (1) 8' x 10' Booth:*


On/Before 2/4/10
After 2/4/10
IMAPS Corporate Member
$1,300
$1,500
Non-Corporate Member *
$2,000
$2,200
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • one (1) Full Conference Registration
  • one (1) Booth Personnel (any more than 1 per each 8x10 will be charged each if they wish to have access to food/beverage)
  • one (1) Full CD-ROM of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • CD-Rom Participation
  • $100 Discount on GBC Spring Meeting Registration

Additional booth personnel are welcome at an extra cost of $50 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

CD-Rom Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference CD-ROM. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to abell@imaps.org on or before 3/5/10. Submisions must be as stated and make the deadline. There is no charge for participation.

HOUSING
Hotel Reservation Deadline - February 4, 2010

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300

Online Reservations: http://www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP10&hotelCode=AZMCDOWE Or use Promotional Code: IMAP10 from the hotel’s direct website: http://www.radisson.com/hotels/azmcdowe

**Working on special reservation process for government rate.

 



Reserve Exhibits On-line
For more information and to rent a booth, please contact Ann Bell, 202-548-8717;
E-Mail: abell@imaps.org


Corporate
Sponsor:


Corporate Sponsor - NEXX Systems


Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation


Media
Sponsor:

Wafer & Device Packaging and Interconnect - Media Sponsor



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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