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7th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 8-10, 2011
Exhibition and Technology Showcase
March 8-9, 2011
Professional Development Courses
March 7, 2011
GBC Spring Conference
March 6-7, 2011

In conjunction with the Global Business Council (GBC) Spring Conference, March 6-7


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Phil Garrou
Microelectronic Consultants of NC


3D Packaging
Topical Workshop
Flip Chip Technologies
Topical Workshop
Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Emerging Tech (LEDs & Passives)
Topical Workshop
Technical Co-Chair:
Paul Siblerud
Applied Materials
Technical Co-Chair:
Peter Elenius
E&G Technology Partners
Technical Co-Chair:
Ted Tessier
FlipChip International
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Frank Wall, Philips &
Jeff Perkins, Yole
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Robert Heistand, AVX

Exhibition Information
download PDF of Exhibit Brochure

The Exhibit Hall has SOLD OUT

Reserve Exhibits On-line | Hotel Reservations
Exhibit Hours | Installation | Dismantle | Cost | CD Participation
Floorplan | 2011 Exhibitors | 2010 Exhibitors
Download GES Exhibitor Kit



IMAPS is pleased to organize the 7th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format has expanded again this year now featuring five tracks/workshops concentrating on: 3D Interconnect & Packaging; FlipChip Technologies; Wafer Level Packaging/CSP; MEMS, including Bio-MEMS; and Emerging Technologies includin LED Devices and Passive Integration. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2011 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006-2010 exhibitions were sold out early and the hall has again sold out in 2011.

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2011 Device Packaging Conference and Exhibition will be held again at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Due to an increase in the number of attendees and the size of the technical program, we have reconfigured the exhibit hall to allow for an additional meeting room. There is a strict limit to the number of booths available in 2011, so it’s in your best interest to reserve early.


The Exhibit Hall has SOLD OUT

Exhibit Hours:
Tuesday, March 8, 2011 - 10:00 AM - 7:00 PM
Lunch, Breaks and Receptions will be held in the Exhibit Hall

Wednesday, March 9, 2011 - 12:00 PM - 4:30 PM
Lunch, Breaks and a Poster Session will be held in the Exhibit Hall

Installation Hours:
Monday, March 7: 12 PM (noon) to 8:00 PM

Tuesday, March 8: 7:00 AM to 9:00 AM

*Dismantle Hours:
Wednesday, March 9 - 4:30 PM - 8:30 PM

*Dismantling and move-out of exhibits may begin at 3:01 pm, Wednesday, March 9, 2011, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2012.

Booth Rental Fees for one (1) 8' x 10' Booth:*


On/Before 2/3/11
After 2/3/11
IMAPS Corporate Member
$1,300
$1,500
Non-Corporate Member *
$2,000
$2,200
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • one (1) Full Conference Registration
  • two (2) Booth Personnel (any more than 1 per each 8x10 will be charged each if they wish to have access to food/beverage)
  • one (1) Full CD-ROM of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • CD-Rom Participation
  • $100 Discount on GBC Spring Meeting Registration

Additional booth personnel are welcome at an extra cost of $50 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

CD-Rom Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference CD-ROM. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to bschieman@imaps.org on or before 3/3/11. Submisions must be as stated and make the deadline. There is no charge for participation.

HOUSING
Hotel Reservation Deadline - February 3, 2011

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300

Online Reservations:
http://www.radisson.com/reservation/resEntrance.do?pacLink=Y&promoCode=IMAP11&hotelCode=AZMCDOWE

Or use Promotional Code: IMAP11 from the hotel’s direct website: http://www.radisson.com/hotels/azmcdowe

**Working on special reservation process for government rate.

 
The Exhibit Hall has SOLD OUT
For more information, please contact Michael O'Donoghue, 202-548-8707;
E-Mail: modonoghue@imaps.org

Exhibit Hall Reception
Sponsor:


Exhibit Hall Reception Sponsor: Williams Advanced Materials

GBC Speaker Dinner & Foundation Golf/Hold'em Sponsors:

Premier "Eagle" Sponsor: ASE US, Inc.


Premier "Birdie" Sponsor: Amkor Technology


Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation


Golf Hole Sponsors:

Golf Hole Sponsor: Teledyne Microelectronics

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: Kyzen Corp.

Golf Hole Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

Golf Hole Sponsor: LORD Corporation

Media Sponsors:

I-Micronews

MEPTEC





© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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