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8th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 6-8, 2012
Exhibition and Technology Showcase
March 6-7, 2012
Professional Development Courses
March 5, 2012
GBC Spring Conference
March 4-5, 2012

In conjunction with the Global Business Council (GBC) Spring Conference, March 4-5

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Peter Elenius
E&G Technology Partners

General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute
Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Passive Integration
Topical Workshop
LED Packaging
Topical Workshop
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Franck Murray
Technical Co-Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Rozalia Beica
Lam Research AG
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Kai Liu
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

Exhibition Information

The Exhibit Hall has SOLD OUT

Exhibit Hours | Installation | Dismantle | Cost | Conference USB Participation
Floorplan | 2012 Exhibitors | 2011 Exhibitors

* Download GES Exhibitor Kit * | Leads Retrieval Scanner Rental Form

IMAPS is pleased to organize the 8th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format has expanded again this year now featuring five tracks/workshops concentrating on: 2.5D & 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; High Brightness LEDs; and Passive Integration. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2012 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. 8' by 10' exhibit spaces will be available. The 2006-2011 exhibitions were sold out early and the hall has sold out again in 2012.

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2012 Device Packaging Conference and Exhibition will be held again at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Due to an increase in the number of attendees and the size of the technical program, we have reconfigured the exhibit hall to allow for an additional meeting room. There is a strict limit to the number of booths available in 2012, so it’s in your best interest to reserve early.

Exhibit Hours:
Tuesday, March 6, 2012 - 10:00 AM - 7:00 PM
Lunch, Breaks and Receptions will be held in the Exhibit Hall

Wednesday, March 7, 2012 - 12:00 PM - 4:30 PM
Lunch, Breaks and a Poster Session will be held in the Exhibit Hall

Installation Hours:
Monday, March 5: 12 PM (noon) to 8:00 PM

Tuesday, March 6: 7:00 AM to 9:00 AM

*Dismantle Hours:
Wednesday, March 7 - 4:30 PM - 8:30 PM

*Dismantling and move-out of exhibits may begin at 3:01 pm, Wednesday, March 7, 2012, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2013.

Booth Rental Fees for one (1) 8' x 10' Booth:*

On/Before 2/3/12
After 2/3/12
IMAPS Corporate Member
Non-Corporate Member *
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • one (1) Full Conference Registration
  • two (2) Booth Personnel (additional booth personnel can be signed up at no charge. If additional personnel wish to have access to lunches, they must pay for meal tickets separately)
  • one (1) Full CD-ROM of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • CD-Rom Participation
  • $100 Discount on GBC Spring Meeting Registration

Additional booth personnel are welcome at an extra cost of $50 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

Conference USB Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference USB Flash Drive containing all technical presentations. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to on or before 3/7/12. Submisions must be as stated and make the deadline. There is no charge for participation.

Hotel Reservation Deadline - February 1, 2012

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300 - Mention IMAPS or IMAPS1 when booking

Online Reservations:



The Exhibit Hall has sold out again
For more information, please contact Brian Schieman, 202-548-8715;

DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

DPC/GBC Premier Sponsor: Amkor Technology

Event Sponsor - Exhibit Reception, Lunch & Break:

Applied Materials - Event Sponsor

Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Event Sponsor - 3D Panel, Breakfasts:

Event Sponsor - 3D Panel, Breakfasts, Birdie Golf: Invensas

Coffee Break Sponsor:
Sikama - Coffee Break Sponsor

Student Paper Competition

Student Paper Competition Sponsor - The Microelectronics Foundation

Golf Hole Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

Premier "Birdie" Sponsor: Invensas

Hole Sponsor: NAMICS

Golf Hole Sponsor: LORD Corporation

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: Kyzen Corp.

Media Sponsors:


Yole Developpement


3D InCites - Media Sponsor

Chip Scale Review - Media Sponsor

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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