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9th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 12-14, 2013
Exhibition and Technology Showcase
March 12-13, 2013
Professional Development Courses
March 11, 2013
GBC Spring Conference
March 10-11, 2013

In conjunction with the Global Business Council (GBC) Spring Conference, March 10-11

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

James Lu
Rensselaer Polytechnic Institute

General Chair-elect (PDCs):
Ron Huemoeller
Amkor Technology
Past General Chair (Panels):
Peter Elenius
E&G Technology Partners

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
LED Packaging for SSL
Topical Workshop
Technical Chair:
Rozalia Beica
Lam Research AG
Technical Chair:
Linda Bal
Freescale Semiconductor
Technical Chair:
Tracy Hudson
US Army
Technical Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT
Technical Co-Chair:
Luu Nguyen
Texas Instruments
Technical Co-Chair:
Russell Shumway
Amkor Technology
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

Exhibition Information

Exhibit Booths are now SOLD OUT1

Exhibit Hours | Installation | Dismantle | Cost | Conference USB Participation
Floorplan | 2013 Exhibitors | 2012 Exhibitors

* Download GES Exhibitor Kit * | Leads Retrieval Scanner Rental Form

IMAPS is pleased to organize the 9th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format is similar to previouis Conferences, featuring four tracks/workshops concentrating on: 2.5D & 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; and LED Packaging for Future Solid-State Lighting. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2013 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Sixty-five 8' by 10' exhibit spaces will be available. The 2006-2012 exhibitions were sold out early and the hall has again sold out in 2013!

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2013 Device Packaging Conference and Exhibition will be held again at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Due to an increase in the number of attendees and the size of the technical program, we have reconfigured the exhibit hall to allow for an additional meeting room. There is a strict limit to the number of booths available in 2012, so it’s in your best interest to reserve early.

Exhibit Hours:
Tuesday, March 12, 2013 - 10:00 AM - 7:00 PM
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 13, 2013 - 12:00 PM - 4:30 PM
Lunch, Breaks and a Poster Session will be held in the Exhibit Hall

Installation Hours:
Monday, March 11: 12 PM (noon) to 8:00 PM

Tuesday, March 12: 7:00 AM to 9:00 AM

*Dismantle Hours:
Wednesday, March 13 - 4:30 PM - 8:30 PM

*Dismantling and move-out of exhibits may begin at 3:01 pm, Wednesday, March 13, 2013, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2014.

Booth Rental Fees for one (1) 8' x 10' Booth:*

On/Before 2/1/13
After 2/1/13
IMAPS Corporate Member
Non-Corporate Member *
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • Pipe and drape around the booth
  • Exhibition hall is carpeted, so exhibitors do not need to order carpeting unless they prefer customer colors/styles
  • one (1) 6’ table draped in Forest Green with two (2) Chairs
  • one (1) wastebasket
  • one (1) company ID sign hung on pipe and drape (provided by GES)
  • one (1) Full Conference Registration
  • two (2) Booth Personnel (additional booth personnel can be signed up at no charge. If additional personnel wish to have access to lunches, they must pay for meal tickets separately)
  • one (1) USB of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • USB Participation (exhibitors can provide marketing PDFs to be included on the USB Drive)
  • $100 Discount on GBC Spring Meeting Registration
  • Electricity, additional furniture needs, etc are all separate and need to be discussed directly with our show decorator, GES. See GES Exhibitor Kit for further details.

Additional booth personnel are welcome at an extra cost of $50 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

Conference USB Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference USB Flash Drive containing all technical presentations. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to on or before 3/13/13. Submisions must be as stated and make the deadline. There is no charge for participation.

Hotel Reservation Deadline - February 1, 2013

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$155 single/double

Online Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone0

Hotel Scams Alert!
Beware of Hotel Scams! Exhibition Housing Services has been soliciting several exhibitors indicating that they are the official housing vendor for IMAPS Device Packaging 2013 Please note that they are NOT affiliated with the show at all and are not working in your best interest. Booking rooms through companies such as Exhibition Housing Services could result in false reservations and a loss of deposit money.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.


For more information, please contact Brian Schieman, 202-548-8715;

DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: ASE US, Inc.


Sponsor - Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Sponsor - Exhibit Reception, Lunch & Break:

Applied Materials - Event Sponsor

Sponsor - Conference Lanyards:
Hole Sponsor: NAMICS

Sponsor - 3D Panel:
3D Panel Sponsor: Invensas

Sponsor: SANTIER

Sponsor: Dow Corning

Sponsor: Lam Research

Sponsor - Refreshment Breaks:
SETNA Corporation - Coffee Break & Golf Sponsor

Sponsor - Refreshment Breaks:
STATSChipPAC - Coffee Break Sponsor

Sponsor - Refreshment Breaks:
Sikama - Coffee Break Sponsor

Sponsor - GBC Speaker Dinner:
Kyocera - GBC Speaker Dinner Sponsor


"Eagle" Golf Sponsors:
"Eagle" Golf Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Golf Sponsor:
"Birdie" Golf Sponsor: Amkor Technology

Golf Hole Sponsors:

Golf Hole Sponsor: NAMICS

Golf Hole Sponsor: Infinite Graphics

Golf Hole Sponsor: SETNA

3D Panel Sponsor: Invensas

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: PUTTIST, 3-Putt Killer

Golf Hole Sponsor: Dixon Golf


Student Paper Competition

Student Paper Competition Sponsor - The Microelectronics Foundation


Media Sponsors:

Yole Developpement


3D InCites - Media Sponsor


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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