Micross

10th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 11-13, 2014
Exhibition and Technology Showcase
March 11-12, 2014
Professional Development Courses
March 10, 2014
GBC Spring Conference
March 9-10, 2014

In conjunction with the Global Business Council (GBC) Spring Conference, March 9-10


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Paul Siblerud
Strategic Tech Analysis, LLC
Past General Chair
(PDCs):

James Lu
Rensselaer Polytechnic Institute

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
Packaging Innovations & System Challenges for:
Microsystems & Devices
Topical Workshop
Photonics & LED Packaging
Topical Workshop
Technical Co-Chair:
Rozalia Beica
Yole Developpement
rbeica@gmail.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair:
Robert Dean
Auburn University deanron@auburn.edu
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
jmazurowski@eoc.psu.edu
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
peter.ramm@emft.fraunhofer.de
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Linda.Bal@freescale.com
Technical Co-Chair:
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Bob Kuo
Amkor Technology
Bob.Kuo@amkor.com


Early Registration & Hotel Deadlines: February 7, 2014

Exhibition Information

Exhibit Booths SOLD OUT


IMAPS is pleased to organize the 10th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format is similar to previouis Conferences, featuring four tracks/workshops concentrating on: 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; and Photonics Packaging. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2014 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Sixty-five 8' by 10' exhibit spaces will be available. The 2006-2013 exhibitions were sold out early and the hall has again sold out in 2014!

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2014 Device Packaging Conference and Exhibition will be held again at the Radisson Fort McDowell Resort and Casino, Scottsdale, AZ. Due to an increase in the number of attendees and the size of the technical program, we have reconfigured the exhibit hall to allow for an additional meeting room.


Exhibit Hours:
Tuesday, March 11, 2014 - 10:00 AM - 7:00 PM
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 12, 2014 - 10:00 AM - 4:00 PM
Lunch, and Breaks will be held in the Exhibit Hall

Installation Hours:
Monday, March 10: 12 PM (noon) to 8:00 PM

Tuesday, March 11: 7:00 AM to 9:30 AM

*Dismantle Hours:
Wednesday, March 12 - 4:00 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 4:01 pm, Wednesday, March 12, 2014, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2015.

Booth Rental Fees for one (1) 8' x 10' Booth:*


On/Before 2/7/14
After 2/7/14
IMAPS Corporate Member
$1,300
$1,500
Non-Corporate Member *
$2,000
$2,200
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • Pipe and drape around the booth
  • Exhibition hall is carpeted, so exhibitors do not need to order carpeting unless they prefer customer colors/styles
  • one (1) company ID sign hung on pipe and drape (provided by GES)
  • one (1) six-foot skirted table, 2 plastic contour chairs and 1 wastebasket (provided by GES)
  • one (1) Full Conference Registration
  • two (2) Booth Personnel (additional booth personnel can be signed up at no charge. If additional personnel wish to have access to lunches, they must pay for meal tickets separately)
  • one (1) USB of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • USB Participation (exhibitors can provide marketing PDFs to be included on the USB Drive)
  • $100 Discount on GBC Spring Meeting Registration
  • Electricity, additional furniture needs, etc are all separate and need to be discussed directly with our show decorator, GES. See GES Exhibitor Kit for further details.

Additional booth personnel are welcome at an extra cost of $30 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

Conference USB Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference USB Flash Drive containing all technical presentations. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to bschieman@imaps.org on or before 3/12/14. Submisions must be as stated and make the deadline. There is no charge for participation.

HOUSING

Hotel Reservation Deadline - February 7, 2014

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

 

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

 

For more information, please contact Brian Schieman, 412-368-1621;
E-Mail: bschieman@imaps.org


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems