11th International Conference and Exhibition on
Device Packaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

Conference and Technical Workshops
March 17-19, 2015
Exhibition and Technology Showcase
March 17-18, 2015
Professional Development Courses
March 16, 2015
NEW** GBC Plenary Session on IoT
March 18, 2015

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Rozalia Beica
Yole Developpement
Past General Chair

James Lu
Rensselaer Polytechnic Institute
Past General Chair

Paul Siblerud
Strategic Tech Analysis, LLC

3D & TSV
Flip Chip & Wafer Level Packaging
Engineered Microsystems & Devices (includes MEMS & Sensors) Track
Photonics, LED & Emerging Technologies Track
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
Technical Co-Chair:
John Aday
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
Technical Co-Chair:
John Hunt
Technical Co-Chair:
Russell Shumway
Amkor Technology
Technical Co-Chair:

Early Registration & Hotel Deadlines: February 17, 2015

Exhibition Information

Exhibit Booths SOLD OUT

Device Homepage | Floorplan | 2015 Exhibitors | 2014 Exhibitors


IMAPS is pleased to organize the 11th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format is similar to previouis Conferences, featuring four tracks/workshops concentrating on: 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; and Photonics Packaging. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2015 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Sixty-five 8' by 10' exhibit spaces will be available. The 2006-2014 exhibitions were sold out early and the hall has again sold out in 2015!

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2015 Device Packaging Conference and Exhibition will be held again at the WeKoPa Resort in Fountain Hills, AZ. Due to an increase in the number of attendees and the size of the technical program, we have reconfigured the exhibit hall to allow for an additional meeting room.

Exhibit Hours:

Tuesday, March 17, 2015 - 10:00 AM - 6:30 PM (Subject to Change)
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 18, 2015 - 10:00 AM - 4:00 PM (Subject to Change)
Lunch, and Breaks will be held in the Exhibit Hall

Installation Hours:
Monday, March 16: 12 PM (noon) to 8:00 PM
Tuesday, March 17: 7:00 AM to 9:30 AM
*Dismantle Hours:
Wednesday, March 18 - 4:00 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 4:01 pm, Wednesday, March 18, 2015, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2016.

Booth Rental Fees for one (1) 8' x 10' Booth:*

On/Before 2/2/15
After 2/2/15
IMAPS Corporate Member - SOLD OUT
Non-Corporate Member * - SOLD OUT
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • Pipe and drape around the booth
  • Exhibition hall is carpeted, so exhibitors do not need to order carpeting unless they prefer customer colors/styles
  • one (1) company ID sign hung on pipe and drape (provided by GES)
  • one (1) six-foot skirted table, 2 plastic contour chairs and 1 wastebasket (provided by GES)
  • one (1) Full Conference Registration
  • two (2) Booth Personnel including Tuesday & Wednesday Lunches (additional booth personnel can be signed up at no charge. If additional personnel wish to have access to lunches, they must pay for meal tickets separately)
  • one (1) DOWNLOAD of Technical Presentations (about 3 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • Exhibitor Presentation Participation (exhibitors can provide marketing PDFs to be included on the Conference DOWNLOAD)
  • ADDITIONAL FEES: Electricity (provided by American Audio Visual Center), additional furniture needs, etc are all separate and need to be discussed directly with our show decorator, GES.
  • ADDITIONAL FEES: Lead Retrieval Barcode Scanners, rented by American Tradeshow. See ATS ORDER FORM for pricing and place orders.
  • Electrical, Phone and Internet Services are actually provided by a convention center group, NOT GES. We're told although the forms are included in the GES KIT, they are quite hard to locate. So here is the ORDER FORM for electric, phone, internet and others services.

Additional booth personnel are welcome at an extra cost of $30 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

Conference Exhibitor Presentation Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference Presentation DOWNLOAD containing all technical presentations. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to on or before 3/1/15. Submisions must be as stated and make the deadline. There is no charge for participation.


Hotel Reservation Deadline - February 17, 2015

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
(The Fort McDowell Yavapai Nation re-launched the Radisson Fort McDowell Resort as the new We-Ko-Pa Resort & Conference Center effective October 1, 2014)
10438 North Fort McDowell Road
Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $175/night + Taxes and Fees

On-Line Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.


For more information, please contact Brian Schieman - E-Mail:


Device Packaging/GBC Sponsors

Premier Sponsor:
DPC/GBC Premier Sponsor: VEECO

Premier Sponsor:

Golf Hole Sponsor: Amkor Technology

Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.

Corporate Sponsors

SPTS - Corporate Sponsor

Mentor Graphics - Corporate Sponsor
Event Sponsors
Sponsor - Badge Lanyards:
Hole Sponsor: NAMICS
Sponsor - GBC Speaker Dinner:
Kyocera - GBC Speaker Dinner Sponsor
Poster Session "Happy Hour":
Sponsor: Lam Research

Sponsor - Lunches:
Applied Materials - Event Sponsor

Sponsor - Evening Sessions:
EV Group - Evening Sessions Sponsor
Sponsor - Lunches:
Protavic - Event Sponsor
Sponsor - Refreshment Breaks:
MRSI - Break Sponsor
Sponsor - Refreshment Breaks:
i3 Electronics - Refreshment Break Sponsor
Sponsor - Refreshment Breaks:
ASM Pacific - Refreshment Break Sponsor
Sponsor - Mobile Charging Station:
Technic - Sponsor - Mobile Charging Station
Sponsor - Bag Insert/Giveaway:
Ubotic - Insert/Giveaway Sponsor
Sponsor - Bag Insert/Giveaway:
ALLVIA - Insert/Giveaway Sponsor
Sponsor - Bag Insert/Giveaway:
STATSChipPAC - Bag Insert/Giveaway Sponsor
Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: VEECO

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology
Hole Sponsor:
Hole Sponsor: NAMICS
Hole Sponsor:
Ubotic - Insert/Giveaway Sponsor
Hole Sponsor:
Golf Hole Sponsor: Coining Inc/Ametek
Hole Sponsor:
Golf Hole Sponsor: AGC Electronics America
Hole Sponsor:
ASM Pacific - Hole Sponsor

Hole Sponsor:
Golf Hole Sponsor: Infinite Graphics

Hole Sponsor:
Golf Hole Sponsor: PUTTIST, 3-Putt Killer

Hole Sponsor:
Golf Hole Sponsor: Dixon Golf

2 hole sponsorships
Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic