KESTER

12th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 15-17, 2016
Exhibition and Technology Showcase
March 15-16, 2016
Professional Development Courses
March 14, 2016
GBC Plenary Session
March 16, 2016


*BOOTHS SOLD OUT*


Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Rozalia Beica
Yole Developpement

General Chair-elect:
Peter Ramm
Fraunhofer EMFT Munich
Past General Chair:
Ron Huemoeller
Amkor Technology

Interposers, 3D IC & Packaging
Flip Chip, Wafer Level Packaging & FAN-OUT
SiP & Engineered Micro Systems/Devices
(including MEMS & Sensors)
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
jcalvert@dow.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair (Engr. Micro Sys.):
Robert Dean
Auburn University
deanron@auburn.edu
Technical Co-Chair:
Kathy Cook
Ziptronix
k.cook@ziptronix.com
Technical Co-Chair:
John Hunt
ASE US
John.Hunt@aseus.com
Technical Co-Chair (Engr. Micro Sys.):
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Rahul Agarwal
GlobalFoundries
rahul.agarwal@globalfoundries.com
Technical Co-Chair:
Eric Huenger
Dow Advanced Packaging Materials
EHuenger@dow.com
Technical Co-Chair (SiP):
Nozad Karim
Amkor Technology
nozad.karim@amkor.com


Exhibition Information

Exhibit Booths SOLD OUT

Device Homepage | Floorplan | 2016 Exhibitors | 2015 Exhibitors

HOURS | FEES | BOOTH INCLUDES | EXHIBIT KIT | HOTEL


IMAPS is pleased to organize the 12th International Conference and Exhibition on Device Packaging. This will be a focused Conference dedicated to the challenges and technologies for packaging and devices of all types. The format is similar to previouis Conferences, featuring four tracks/workshops concentrating on: 3D IC & Packaging; Flip Chip & Wafer Level Packaging & FAN-OUT; Engineered Micro Systems/Devices (includes MEMS & Sensors); and SiP. These workshops are a continuation of past successful IMAPS Advanced Technology Workshops.

Device Packaging 2016 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Sixty-five 8' by 10' exhibit spaces will be available. The 2006-2015 exhibitions were sold out early and the hall has again sold out in 2016!

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."

The 2016 Device Packaging Conference and Exhibition will be held again at the WeKoPa Resort in Fountain Hills, AZ. Due to an increase in the number of attendees and the size of the technical program, we have reconfigured the exhibit hall to allow for an additional meeting room.

Thank You to the DPC/GBC Premier Sponsors:
DPC/GBC Premier Sponsor: ASE US, Inc.
DPC/GBC Premier Sponsor: Amkor Technology
DPC/GBC Premier Sponsor: NAMICS

 


Exhibit Hours:

Show Hours:

Tuesday, March 15, 2016 - 10:00 AM - 6:30 PM (Subject to Change)
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 16, 2016 - 10:00 AM - 4:00 PM (Subject to Change)
Lunch, and Breaks will be held in the Exhibit Hall

 

Installation Hours:
Monday, March 14: 12 PM (noon) to 8:00 PM
Tuesday, March 15: 7:00 AM to 9:30 AM

*Dismantle Hours:
Wednesday, March 16 - 4:00 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 4:01 pm, Wednesday, March 16, 2016, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2017.

 

Booth Rental Fees for one (1) 8' x 10' Booth:*


On/Before 12/1/15
After 12/1/15
IMAPS Corporate Member - SOLD OUT
$1,600
$1,900
Non-Corporate Member * - SOLD OUT
$2,300
$2,600
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

CANCELLATION POLICY: booths may be cancelled with full refund if written request is received
by IMAPS HQ not later than 2/15/2016 and IMAPS is able to re-sell your cancelled booth space.

IMAPS reserves the right to refuse any potential exhibitor or advertiser should IMAPS
deem the promotion of a company or organization inappropriate for any reason.

Each Exhibiting Company will receive with their booth rental:

  • Pipe and drape around the booth
  • Exhibition hall is carpeted, so exhibitors do not need to order carpeting unless they prefer customer colors/styles
  • one (1) company ID sign hung on pipe and drape (provided by GES)
  • one (1) six-foot skirted table, 2 plastic contour chairs and 1 wastebasket (provided by GES)
  • one (1) Full Conference Registration
  • two (2) Booth Personnel including Tuesday & Wednesday Lunches (additional booth personnel can be signed up at no charge. If additional personnel wish to have access to lunches, they must pay for meal tickets separately)
  • one (1) DOWNLOAD of Technical Presentations (about 2 weeks after the Conference)
  • one (1) List of Attendees (sent the week following the conference)
  • Exhibitor Presentation Participation (exhibitors can provide marketing PDFs to be included on the Conference DOWNLOAD)
  • ADDITIONAL FEES: Electricity, additional furniture needs, etc are all separate and need to be discussed directly with our show decorator, GES.
    • See GES Exhibitor Kit for further details
    • Key information in the full PDF kit:
      Key show dates and times:                         Page 4
      Freight/shipping details:                              Page 6  
      A/V Ordering Form:                                      Page 73  
      Electrical, Internet/Telephone:                  Page 75
      Lead Retrieval Order Form:                        Page 76
      *These forms are found in the Additional Show Services tab of the ordering website, as well.

Additional booth personnel are welcome at an extra cost of $30 per person for food/beverage. Additional registrations for the full conference are not included, but are available at an additional cost.

Conference Exhibitor Presentation Participation:
IMAPS is offering Exhibiting Companies the opportunity to have an unlimited amount of product promotion information on the Conference Presentation DOWNLOAD containing all technical presentations. You must submit ONE pdf or Word file, via e-mail, containing the information you want to appear to bschieman@imaps.org on or before 3/1/16. Submisions must be as stated and make the deadline. There is no charge for participation.

HOUSING

Hotel Reservation Deadline - February 10, 2016

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $169+ taxes/fees

ONLINE RESERVATIONS

Feel free to continue to try: Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

 

For more information, please contact Brian Schieman - E-Mail: bschieman@imaps.org

 

Device Packaging/GBC Sponsorship
(Need to be ahead of your competition? Join this list today! A few spots remain)

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: ASE US, Inc.

PREMIER SPONSOR:
Golf Hole Sponsor: Amkor Technology

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors
SPTS - Corporate Sponsor
Mentor Graphics - Corporate Sponsor
EMD Performance Materials - Corporate Sponsor
Event Sponsors

Mobile APP Sponsor: SETNA

Mobile "App" Sponsor

Applied Materials - Event Sponsor

Mobile Charging Station &
Evening Panel / Reception

VEECO - Mobile Charging Station & Golf Sponsor

Mobile Charging Station

Shenmao - Event Sponsor

Refreshment Breaks &
Attendee Bag Insert

Poster Session / Happy Hour Sponsor: XIA

Poster Session & Happy Hour Sponsor

 

 

 

Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Birdie" Sponsor (1 hole):
Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Eagle" Sponsor (3 holes):DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

EMD Performance Materials - Corporate Sponsor

Hole #14 - Closest to Pin

Golf Hole Sponsor: Infinite Graphics

Hole #6 - Closest to Pin

MRSI - Break Sponsor

Hole #10

Golf Hole Sponsor: Coining Inc/SPM

Hole #5

Technic - Sponsor - Mobile Charging Station

Hole #7

VEECO - Golf Sponsor

Holes #4 - Longest Putt, #15

ASM Pacific - Hole Sponsor

Hole #11

Golf Hole Sponsor: AGC Electronics America

Hole #13

Golf Hole Sponsor: Dixon Golf

Hole #9 - Straight Drive Competition
Hole #17 - Hole-in-One Competition

Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor
     

 


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems