15th International Conference and Exhibition on

WekoPa Resort
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 5-7, 2019
Exhibition and Technology Showcase
March 5-6, 2019
Professional Development Courses
March 4, 2019
GBC Plenary Session
March 6, 2019
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Jon Aday
Illumina, Inc.

General Chair-Elect:
Rama Puligadda
Brewer Science

Past General Chair:
Peter Ramm
Fraunhofer EMFT Munich



Exhibit Booths SOLD OUT

Device Homepage | Floorplan | 2019 Exhibitors


IMAPS is pleased to organize the 15th International Conference and Exhibition on Device Packaging. This conference is dedicated to the challenges and technologies for packaging and devices of all types. The 2019 conference format features four tracks concentrating on Heterogeneous Integration & 3D IC; Fan-Out, Wafer Level Packaging & Flip Chip; Engineered Micro Systems/Devices (MEMS/Sensors); and Automotive Packaging (new!).

Device Packaging 2019 will also offer one collective Exhibition and Technology Showcase for vendors and suppliers who support the many aspects of Device Packaging and each of the topical areas addressed during the Conference. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Sixty-five 8' by 10' exhibit spaces were sold out again in 2019. The exhibit hall has sold out every year since 2006!

Exhibitors had this to say about past Device Packaging Conferences:

  • "Best show for wafer level packaging."
  • “The IMAPS Device Packaging Conference has quickly grown into one the most important and comprehensive events covering all the major packaging topics.”
  • “This conference attracts the right audience for our business/products.”
  • “Some quality contacts that given the nature of the "Design Cycle" for the types of products that we offer will come to fruitiion in 3 - 6 months.”
  • “We feel the leads generated at the conference will lead to the sale of our low alpha materials.”
  • “Leads will develop into product sales of reworkable underfill materials.”
  • "Strong technical sessions brought quality leads."
  • "Good booth traffic."


Thank you to our Premier PLATINUM Sponsor:

Thank you to our Premier GOLD Sponsors:

Premier Gold 
Sponsor - EMD Performance Materials
Premier Gold Sponsor - XYZTEC
Premier Gold Sponsor - JCET Group

Thank you to our Premier SILVER Sponsors:

Premier Silver Sponsor: Amkor Technology
Premier Silver Sponsor: NAMICS
Premier Silver Sponsor: Cadence
Premier Silver Sponsor: Mentor Graphics
Premier Silver Sponsor: Xperi / Invensas


Exhibit Hours:

Show Hours:

Tuesday, March 5, 2019 - 10:00 AM - 6:30 PM (Subject to Change)
Lunch, Breaks and a Reception will be held in the Exhibit Hall

Wednesday, March 6, 2019 - 10:00 AM - 4:00 PM (Subject to Change)
Lunch, and Breaks will be held in the Exhibit Hall


Installation Hours:
Monday, March 4: 12 PM (noon) to 8:00 PM
Tuesday, March 5: 7:00 AM to 9:00 AM

*Dismantle Hours:
Wednesday, March 6 - 4:01 PM - 8:00 PM

*Dismantling and move-out of exhibits may begin at 4:01 pm, Wednesday, March 6, 2019, and must be completed by 8:00 PM, the same day. No exhibitor will be permitted to pack or remove articles on display or any part of their exhibit prior to the closing of the exposition. Exhibitors who fail to comply with this rule risk being barred from exhibiting at the next year’s event and/or losing any priority for choosing booth space for Device Packaging 2020.


Booth Rental Fees for one (1) 8' x 10' Booth:*

On/Before 12/1/18
After 12/1/18
IMAPS Corporate Member - SOLD OUT
Non-Corporate Member * - SOLD OUT
* Includes a one-year IMAPS Corporate Membership with each Non-Member Registration.

Full IMAPS credit, not subject to a processing fee, will be issued toward a future IMAPS show for booth cancellations if cancellation is requested by December 1, 2018. Refunds, minus a $250 processing fee, will be made for booth cancellations if cancelled by December 1, 2018 if there is not an exhibitor wait list. If IMAPS is able to fill your cancelled booth space from a wait list, the cancelling exhibitor will not incur the processing fee. Neither refunds nor credits will be issued for cancellations after December 1, 2018.

Each Exhibiting Company will receive with their booth rental:

  • One (1) 8’x10’ pipe-and-drape booth space (Backwall Drape: 8' High Blue & Sidewall Drape: 3' High Blue)
  • Exhibition hall is carpeted, so exhibitors do not need to order carpeting unless they prefer customer colors/styles
  • One (1) 6’ blue skirted table, two (2) contour chairs, one (1) ID sign, and one (1) wastebasket (provided by GES)
  • Basic WiFi Internet access
  • Pre- and post-event attendee lists
  • Two staff badges, either:
    • One (1) full conference badge and one (1) booth personnel badge OR:
    • Two (2) booth personnel badges
    • All additional badges for booth personnel or the full conference will be an additional charge.
  • One (1) DOWNLOAD of Technical Presentations (about 1-2 weeks after the Conference)
  • Exhibitor Presentation Participation (exhibitors can provide marketing PDFs to be included on the Conference DOWNLOAD)
  • ADDITIONAL FEES: Please note that the venue is already carpeted. Electrical, plumbing, labor, freight, additional furniture and further services not detailed above are not included in the package. More information about vendors, rentals, and other services will be provided in the GENERAL CONTRACT SERVICE MANUAL ("EXHIBITOR KIT")




WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264





Device Packaging Sponsorship (Need to be ahead of your competition? Join this list today!)


Premier Gold 
Sponsor - EMD Performance Materials
Premier Gold Sponsor - XYZTEC
Premier Gold Sponsor - JCET Group
Premier Silver Sponsor: Amkor Technology
Premier Silver Sponsor: NAMICS
Premier Silver Sponsor: Cadence
Premier Silver Sponsor: Mentor Graphics
Premier Silver Sponsor: Xperi / Invensas
Corporate Sponsors
Corporate Sponsor - NGK NTK
Corporate Sponsor - DuPont Electronics & Imaging
SPTS - Corporate Sponsor
Mobile APP Sponsor: SETNA
MacDermid Alpha Electronics Solutions - Corporate Sponsor
Corporate Sponsor - Technic
Corporate Sponsor: Pac Tech
Corporate Sponsor: Evatec
Corporate Sponsor: Applied Materials
Additional Event Sponsors

Break Sponsor: Metalor

Coffee Break

Exhibit Reception Sponsor: JX Nippon Mining & Metals

Exhibit Reception

Notebook Sponsor: SMART Microsystems

Session Notebooks/Pens

Golf/Foundation Sponsors

"Birdie" Sponsor:

DPC/GBC Premier Sponsor: ASE US, Inc.

Hole: 5 - Closest to Pin

"Birdie" Sponsor:

EMD Performance Materials - Corporate Sponsor

Hole: 9 - Closest to Pin

"Birdie" Sponsor:

Premier Gold Sponsor - XYZTEC

Hole: 15 - Closest to Pin

"Birdie" Sponsor:

Premier Gold Sponsor - JCET Group

Hole: 7 - Closest 2ND SHOT

"Birdie" Sponsor:

Golf Hole Sponsor: Amkor Technology

Hole: 18 - Longest Putt

"Birdie" Sponsor:

DPC/GBC Premier Sponsor: NAMICS

Hole: 12 - Longest Drive

"Birdie" Sponsor:

DPC Premier Gold Sponsor: Cadence

Hole: 1

"Birdie" Sponsor (1 hole):

Premier Silver Sponsor: Mentor Graphics

Hole: 2

"Birdie" Sponsor:

Premier Silver Sponsor: Xperi / Invensas

Hole: 3

ASM Pacific - Hole Sponsor

Hole: 13

Golf Hole Sponsor: Advance Reproductions

Hole: 6

Golf Sponsor: NxQ
Mask Aligners

Hole: 8

Golf Hole Sponsor: Nikon

Hole: 10

Exhibit Reception Sponsor: JX Nippon Mining & Metals

Hole: 14

Golf Sponsor - Kite Rocket

Hole: 16

Golf Sponsor - SUSS Microtec

Hole: 17

Golf Hole Sponsor: Dixon Golf

Hole: 4 - Straight Drive Competition
Hole: 11 - Hole-in-One Competition

Official Media Sponsors
3D Incites - Media Sponsor
Media Sponsor: MEPTEC


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic