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8th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 6-8, 2012
Exhibition and Technology Showcase
March 6-7, 2012
Professional Development Courses
March 5, 2012
GBC Spring Conference
March 4-5, 2012

In conjunction with the Global Business Council (GBC) Spring Conference, March 4-5

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Peter Elenius
E&G Technology Partners

General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute
Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Passive Integration
Topical Workshop
LED Packaging
Topical Workshop
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Franck Murray
Technical Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Rozalia Beica
Lam Research AG
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Kai Liu
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

EARLY REGISTRATION/EXHIBIT/Hotel Deadlines: February 2012

Submit Abstract(s)
Speaker Information
| Student Competition | Professional Development Courses (PDCs)
Exhibition |
Reserve Exhibits On-line |
Floorplan | 2012 Exhibitors | 2011 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament

Announcement and Call for Abstracts
Topical Workshop on

Flip Chip & Wafer Level Packaging

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Technical Chair:
Rey Alvarado
Maxim Integrated Products
San Jose, CA
Phone: 480-965-8104
Technical Chair:
Alan Huffman
RTI International
Research Triangle Park, NC
Phone: 919-248-9216

Flip Chip Technologies Organizing Committee:
Linda Bal, Freescale Semiconductor
Lars Boettcher, Fraunhofer IZM

Ravi Chilukuri, Amkor Technologies
Jamin Ling, Kulicke & Soffa Industries
Luu Nguyen, National Semiconductor Corp.
Gilles Poupon, LETI
Andy Strandjord, PacTech USA
Ted Tessier, FlipChip International
Michael Toepper, Fraunhofer IZM

Workshops: 2.5D & 3D IC & Packaging | Flip Chip & Wafer Level Packaging | MEMS & Microsystems |
High Brightness LEDs | Passive Integration

Flip Chip & Wafer Level Packaging Workshop Focus:
The objective of the FC & WLP Workshop is to have a unique forum that brings together scientists, engineers, and business professionals from commercial and R&D sectors around the world to discuss the most recent developments in flip chip and wafer level packaging technology. Held over three days, March 5-8, 2012, the Workshop offers multiple technical sessions on all aspects of flip chip and wafer level packaging in an environment that encourages interaction and discussion among the participants.

Abstracts are being requested on the following topics:

  • Pb-Free Flip Chip Implementations including Assembly, Bumping, Testing, and Reliability
  • Backend Materials & processes Improvements for:
    • Wafer Saw and Die Attach
    • Substrates, Lids and Lid Attach
    • Capillary and molded underfill
    • Thermal Interface and Conductive Adhesives
    • Sphere Attach & Fluxless Assembly Processes
    • Design for flip chip advancements in Substrates and Board Technologies, Substrate Design, Layout and Simulation Tools, Thermo-mechanical modeling
    • Non-solder based flip chips
    • Board and component level reliability, including electromigration, inter-metallic effects, temperature cycling, HAST, HTS
    • FC and WLP End Use Applications (i.e. OEM products)
  • Wafer bumping materials and processes
  • Cu Pillar Bumping
  • Pb-Free Bumping
  • Fine Pitch Bumping
  • Redistribution and Repassivation
  • Fan out CSP Technology
  • Under Bump Metallization
  • WLSCP Solder Bumping
  • Wafer Thinning
  • Backside Coating
  • Laser Marking
  • Dicing and Tape/Reel
  • Re-Constituted Wafer Processing
  • Tight Pitch (0.3mm pitch) WLP
  • Ultra Thin WLP
  • Enhanced WLP Technology
  • RoHS Compliance

The Wafer Level Packaging & Flip Chip evening Panel Session is being planned - TBD.

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 2, 2011, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 27, 2012. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Brian Schieman by email at or by phone at 202-548-8715.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 5th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at no later than November 18, 2011.


Interested in Exhibits? Contact Brian Schieman -
Interested in helping organize the 2012 Conference? Contact Brian Schieman -


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student with "best presentation". The selected student must attend the event to present his or her work and receive the award.

As a result of the successful foundation fundraising that took place at IMAPS 2011 Long Beach (golf outing, Ca-Si-No night and various donations), the Microelectronics Foundation is able to provide increased awards for the 2011 Device Packaging Conference. The Foundation is awarding 3 students with the "best presentations" of the Conference: $1500 (1st place), $1000 (2nd), and $500 (3rd). The first place winner will also be able to submit their updated paper for IMAPS Annual Symposium - IMAPS 2012 in San Diego.

The Microelectronics Foundation

Hotel Reservation Deadline - February 2012

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$TBD single/double

Phone Reservations: (480) 789-5300

Online Reservations:

Speaker Dates/Information:

  • Abstracts Deadline Extended To: December 2, 2011
  • Hotel Reservation Deadline: February 2012
  • Extended Abstract or Abstract Book Materials due: January 27, 2012
  • Early Registration Deadline: February 2012
  • Powerpoint/Presentation file for CD-Rom due not later than: March 8, 2012 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)

© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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