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9th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 12-14, 2013
Exhibition and Technology Showcase
March 12-13, 2013
Professional Development Courses
March 11, 2013
GBC Spring Conference
March 10-11, 2013

In conjunction with the Global Business Council (GBC) Spring Conference, March 10-11


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

James Lu
Rensselaer Polytechnic Institute

General Chair-elect (PDCs):
Ron Huemoeller
Amkor Technology
Past General Chair (Panels):
Peter Elenius
E&G Technology Partners

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
LED Packaging for SSL
Topical Workshop
Technical Chair:
Rozalia Beica
Lam Research AG
Technical Chair:
Linda Bal
Freescale Semiconductor
Technical Chair:
Tracy Hudson
US Army
Technical Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT
Technical Co-Chair:
Luu Nguyen
Texas Instruments
Technical Co-Chair:
Russell Shumway
Amkor Technology
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute


Abstracts Now Accepted Until: December 7, 2012


Submit Abstract(s)
Speaker Information
| Student Competition | Professional Development Courses (PDCs)
Exhibition |
Reserve Exhibits On-line |
Floorplan | 2013 Exhibitors | 2012 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational


Workshop Announcements: Advanced 3D Packaging | Flip Chip & Wafer Level Packaging | MEMS & Microsystems |
Packaging LEDs for SSL


Announcement and Call for Abstracts
Topical Workshop on

Flip Chip & Wafer Level Packaging

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Technical Chair:
Linda Bal
Freescale Semiconductor
Linda.Bal@freescale.com
Technical Co-Chair:
Luu Nguyen
Texas Instruments
luu.nguyen@ti.com

Flip Chip & Wafer Level Packaging Organizing Committee:
Lars Boettcher, Fraunhofer IZM
Eric Huenger, Dow Chemical
Alan Huffman, RTI International
Jamin Ling, Kulicke & Soffa Industries, Inc.
Gilles Poupon, LETI
Andy Strandjord, PacTech USA
Ted Tessier, Flip Chip International


Flip Chip & Wafer Level Packaging Workshop Focus:
The objective of the FC & WLP Workshop is to have a unique forum that brings together scientists, engineers, and business professionals from commercial and R&D sectors around the world to discuss the most recent developments in flip chip and wafer level packaging technology. This workshop has been specifically organized to allow for the presentation and debate of all aspects of flip chip and wafer level packaging in an environment that encourages interaction and discussion among the participants.

Abstracts are being requested on the following topics:

  • Wafer Level Materials and Processes including
    • Bumping: Cu Pillar, Pb-Free, micro bumps & Fine Pitch
    • Redistribution and Repassivation
    • Underbump metalizations
    • Wafer Thinning
    • Backside Coatings
    • Laser Marking
    • Dicing (wafer saw, laser grooving, stealth)
    • Die Storage ( Tape/Reel, reconstituted wafer, etc)
  • Wafer level Packaging Technology
    • Fan-out CSP /Re-Constituted Wafer Processing
    • Tight Pitch (0.3mm pitch) WLP technology
    • Ultra Thin WLP technology
    • Enhanced WLP technology
  • Flip Chip Packaging Technology
    • Die Attach (Mass Reflow, Thermal Compression Bonding, etc.)
    • Substrates, Lids, and Lid Attach
    • Capillary & molded underfill, Non Conductive Paste/film
    • Thermal Interface & Conductive Adhesives
    • Sphere attach and fluxless assembly processes
    • Non-solder based flip chip
  • Design for WLP and Flip chip advancements in:
    • Substrates and board technologies
    • Substrate design, Layout and Simulation Tools
    • Thermo-mechanical Modeling
    • Die-Package Co-design
  • Board and Component Level reliability including electromigration, inter-metallic effects, temperature cycling, HAST, HTS
  • RoHS Compliance
  • FC and WLP End Use Applications (ie. OEM products)

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically IMMEDIATELY, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 25, 2013. A post-conference USB or CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 if you have questions.

The track Technical Chairs will be choosing select papers from the Conference for inclusion in a post-conference Compendium book or a special issue of the IMAPS Journal of Microelectronics and Electronic Packaging. Speakers wishing to participate in this post-conference publication must submit a the written paper ("Extended Abstract") as noted above.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. A maximum of 65 full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 11th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Brian Schieman by email at bschieman@imaps.org or by phone at 202-548-8715 no later than November 16, 2012.

 

Interested in Exhibits? Contact Brian Schieman - bschieman@imaps.org
Interested in helping organize the 2013 Conference? Contact Brian Schieman - bschieman@imaps.org

 


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student with "best presentation". The selected student must attend the event to present his or her work and receive the award.

The Microelectronics Foundation



Housing
Hotel Reservation Deadline - February 1, 2013

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$155 single/double

Online Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone0

Hotel Scams Alert!
Beware of Hotel Scams! Exhibition Housing Services has been soliciting several exhibitors indicating that they are the official housing vendor for IMAPS Device Packaging 2013 Please note that they are NOT affiliated with the show at all and are not working in your best interest. Booking rooms through companies such as Exhibition Housing Services could result in false reservations and a loss of deposit money.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.



Speaker Dates/Information:

  • Abstracts Deadline: December 7, 2012
  • Speaker Notification Emails: December 14, 2012
  • Extended Abstract or Abstract Book Materials due: January 25, 2013
  • Hotel Reservation Deadline: February 1, 2013
  • Early Registration Deadline: February 1, 2013
  • Powerpoint/Presentation file for CD-Rom due not later than: March 14, 2013 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)






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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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