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4th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer
602-431-4764 |

Conference and Technical Workshops
March 17-20, 2008
Exhibition and Technology Showcase
March 18-19, 2008
Professional Development Courses
March 17, 2008
GBC Spring Conference
March 16-17, 2008

Announcement and Call for Abstracts
Advanced Technology Workshop on

Flip Chip Technologies

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline:  November 30, 2007

Technical Chair:
Beth Keser
Freescale Semiconductor
Tempe, AZ 85284
Phone: 480-413-8022
Technical Chair:
Lou Nicholls
Amkor Technology, Inc.
Chandler, AZ 85248
Phone: 480-821-5000
Flip Chip Organizing Committee:

Robert Hubbard, Lambda Technologies, Inc.; bhubbard(AT)
Michael Toepper, Fraunhofer IZM; toepper(AT)
Thorsten Teutsch, PacTech; teutsch(AT)  
Christo Bojkov, MAXIM-DallasSemi; Christo.Bojkov(AT)
Hong Yang, Applied Micro Circuits Corporation; hyang(AT)
Chunho Kim, Intel Corporation;

Hotel Information | Speaker Information | Exhibit Information | Reserve Booth(s)

Flip Chip Technologies Workshop Focus:
The objective of the Flip Chip Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Flip Chip packaging and associated Pb-Free implementation challenges. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to Flip Chip Bumping including Pb-Free versions.
Abstracts are being requested on the following topics:

  • Wafer bumping materials and processes
  • Effect of Pb-Free process
  • Design for flip chip advancements
  • Substrate design for flip chip devices
  • Substrates and board technology
  • Testing of flip chip devices
  • Assembly processes and assembly issues
  • Underfill materials & processes & Pb-free compatibility
  • Pb-Free / Green flip chip bumping
  • Non-solder based flip chips
  • Reliability & Pb-Free
  • Thermo-mechanical modeling
  • End use applications (i.e., OEM products)
  • Electro-migration and Inter-metallic effects in Lead-Free
  • FC applications

Those wishing to present in the Flip Chip Technologies sector of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Flip Chip Technology. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at no later than November 30, 2007.

Interested in Exhibits? Contact Ann Bell -
Interested in becoming a Speaker/Chair? Contact Jackki Morris-Joyner -
Interested in helping organize the 2008 Conference? Contact Brian Schieman -

Hotel Reservation Deadline - February 12, 2008
Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
Rooms on hold March 15 – 20, 2008

For reservations, call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 12, 2008.

Speaker Dates/Information:

  • Abstracts due: November 30, 2007
  • Extended Abstract or Abstract Book Materials due: February 8, 2008
  • Hotel Reservation Deadline: February 12, 2008
  • Powerpoint/Presentation file for CD-Rom due not later than: March 20, 2008 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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