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8th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 6-8, 2012
Exhibition and Technology Showcase
March 6-7, 2012
Professional Development Courses
March 5, 2012
GBC Spring Conference
March 4-5, 2012

In conjunction with the Global Business Council (GBC) Spring Conference, March 4-5


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Peter Elenius
E&G Technology Partners

General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute
Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC


3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Passive Integration
Topical Workshop
LED Packaging
Topical Workshop
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Franck Murray
IPDIA
Technical Co-Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Rozalia Beica
Lam Research AG
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Kai Liu
STATS ChipPAC
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

2012 IMAPS Microelectronics Foundation Spring Golf Invitational
1:00pm Shotgun Start – “Best Ball” Scramble

Golf Registration | About the Foundation
Device Packaging Conference |
Hotel Reservations
Texas Hold'em Tournament


Desert Canyon Golf Club - Hole 16
Desert Canyon Golf Club - Hole 16

Desert Canyon Golf Club - Hole 18
Desert Canyon Golf Club - Hole 18

Desert Canyon Golf Club - Hole 9
Desert Canyon Golf Club - Hole 9

IMAPS Microelectronic Foundation
Mission Statement:

The Foundation's role is to support student activities related to the study of Microelectronic Packaging, Interconnect and Assembly.


Foundation Golf Chair:
David Virissimo, Coining Inc/Ametek

Thursday, March 8, 2012
1:00pm Shotgun Start – “Best Ball” Scramble
Desert Canyon Golf Club
10440 Indian Wells Drive
Fountain Hills, AZ

The IMAPS Microelectronics Foundation Spring Golf invitational will be held at the Desert Canyon Golf Club. Desert Canyon was named 2009 “Best Places to Play” by Golf Digest and has been voted “Best Public Golf Course” in Fountain Hills for six consecutive years. Desert Canyon Golf Club’s eighteen hole championship course features elevated tees coupled with a variety of elevation changes. Fairways, though open, play tight and prove challenging with strategically placed doglegs.

Cost: $125/golfer -- $450/four-some
The cost includes: Transportation to and from the course, greens/cart fees, shotgun start, lunch in cart, and awards reception following your round.

A shuttle will pick up golfers at the Radisson Fort McDowell at 12:00pm. Golfers will tee off shortly after arriving at the course – 1:00pm shotgun start. Golfers are welcome to drive themselves to arrive earlier. An awards presentation and reception will be held immediately following golf.

All proceeds from this event will benefit the IMAPS Microelectronics Foundation.

Special Awards and Activities tentatively planned:

  • Closest to the Pin;
  • Longest Drive

Sponsorship Opportunities:

Eagle Sponsor - $3,000 -- SOLD

  • Company logo/name displayed as Awards Reception Sponsor.
  • Entrance of two four-somes.
  • Includes three hole sponsorships with signage.
  • Company logo/name on all event promotional signs, materials and website.
  • Company may provide take-away products to be handed to all golfers. Golf-related items usually most appropriate (e.g., golf towels, balls, tees, etc.). At expense of sponsor.

Birdie Sponsor - $1,500 -- SOLD

  • Company logo/name displayed as Lunch Sponsor - in/on boxed lunches.
  • Entrance of one four-some.
  • Includes one hole sponsorship with signage.
  • Company logo/name on all event promotional signs, materials and website.

Hole Sponsor - $400 ($750 w/ four-some) -- 5 Holes Remain

  • Sponsorship of one hole with signage.
  • Entrance of one golfer ($400 or $750 includes 4-some).
  • Company logo/name on promotional materials and website.

 

Register On-line
Questions or request teams/partners:
David Virissimo, Foundation Golf Chair - david.virissimo@ametek.com or 619-464-5430

 

Golf Sponsors

Premier - "Eagle" Sponsor:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

Premier - "Eagle" Sponsor:

DPC/GBC Premier Sponsor: ASE US, Inc.
Premier - "Birdie" Sponsor:

Premier "Birdie" Sponsor: Amkor Technology
Premier - "Birdie" Sponsor:

Premier "Birdie" Sponsor: Invensas
 
Golf Hole Sponsor: Amkor Technology
Hole #1
DPC/GBC Premier Sponsor: Solid State Equipment Corp.
Holes #8 (Closest to Pin), #3, and #14
DPC/GBC Premier Sponsor: ASE US, Inc.
Hole #2 (Closest to Pin), #15, and #18
Hole Sponsor: NAMICS
Hole #12 (Longest Drive)
Golf Hole Sponsor: LORD Corporation
Hole #13 (Closest to Pin)
Golf Hole Sponsor: Coining Inc/SPM
Hole #16 (Closest to Pin)
Golf Hole Sponsor: AGC Electronics America
Hole #10
Golf Hole Sponsor: Kyzen Corp.
Hole #5
Premier "Birdie" Sponsor: Invensas
Hole #17
     

 

DPC/GBC Premier & "Eagle" Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.


DPC/GBC Premier & "Birdie" Sponsors:

DPC/GBC Premier Sponsor: Amkor Technology

Premier "Birdie" Sponsor: Invensas


Golf Hole Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

Hole Sponsor: NAMICS

Golf Hole Sponsor: LORD Corporation

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: Kyzen Corp.

Premier "Birdie" Sponsor: Invensas



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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