8th International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
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Conference and Technical Workshops
March
6-8, 2012
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Exhibition and Technology Showcase
March
6-7, 2012 |
Professional
Development Courses
March 5, 2012 |
GBC
Spring Conference
March
4-5, 2012 |
In conjunction with
the Global Business Council (GBC) Spring
Conference, March 4-5
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Courtesy of Rensselaer Polytechnic Institute |
Courtesy of US Army RDEDCOM AMRDEC |
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General Chair:
Peter Elenius
E&G Technology Partners
General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute
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Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC
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3D & 2.5D Packaging
Topical Workshop
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Flip Chip & Wafer Level Packaging
Topical Workshop
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MEMS & Microsystems
Topical Workshop
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Passive Integration
Topical Workshop
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LED Packaging
Topical Workshop
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Technical
Co-Chair:
Ron Huemoeller
Amkor Technology
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Technical
Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
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Technical
Co-Chair:
Robert Dean
Auburn University
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Technical
Co-Chair:
Franck Murray
IPDIA
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Technical
Co-Chair:
Thomas Goodman
E&G Technology Partners
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Technical
Co-Chair:
Rozalia Beica
Lam Research AG
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Technical
Co-Chair:
Alan Huffman
RTI International
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Technical
Co-Chair:
Tracy Hudson
US Army
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Technical
Co-Chair:
Kai Liu
STATS ChipPAC
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Technical
Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute
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EARLY REGISTRATION/EXHIBIT/Hotel Deadlines: February 10, 2012
On-line Registration | Hotel Reservations
Technical Program | Professional Development Courses (PDCs) | Download Program PDF
Exhibition Details | Reserve Exhibits
On-line | Floorplan | 2012 Exhibitors | 2011 Exhibitors
Global Business Council (GBC) Spring
Conference
Spring Golf Invitational | Texas Hold'em Tournament
** Only 2 Exhibit Booths Still Available **
Download 2012 Advance Program Draft (PDF)
Conference Overview:
The eigth Annual Device Packaging Conference (DPC2012) will be held in Scottsdale, Arizona, on March 5-8, 2012. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
The 2012 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging 2.5D & 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; High Brightness LEDs; and Passive Integration.
Student Competition sponsored by The Microelectronics Foundation:
The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student with "best presentation". The selected student must attend the event to present his or her work and receive the award.
As a result of the successful foundation fundraising that took place at IMAPS 2011 Long Beach (golf outing, Ca-Si-No night and various donations), the Microelectronics Foundation is able to provide increased awards for the 2011 Device Packaging Conference. The Foundation is awarding 3 students with the "best presentations" of the Conference: $1500 (1st place), $1000 (2nd), and $500 (3rd). The first place winner will also be able to submit their updated paper for IMAPS Annual Symposium - IMAPS 2012 in San Diego. |
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Housing
Hotel Reservation Deadline - February 10, 2012
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
$149 single/double
Phone Reservations: (480) 789-5300 - Mention IMAPS or IMAPS1 when booking
Online Reservations:
www.radisson.com/imaps
Speaker Dates/Information:
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DPC/GBC Premier
Sponsors:
Event Sponsor - Exhibit Reception, Lunch & Break:
Post-Conference Presentations USB Drives:
Coffee Break Sponsor:
Student Paper Competition
Sponsor:
Golf Hole
Sponsors:
Media
Sponsors:
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