IMAPS - 15th International Conference and Exhibition on Device Packaging 2019

15th International Conference and Exhibition on
DEVICE PACKAGING
www.imaps.org/devicepackaging

WekoPa Resort
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 5-7, 2019

Exhibition and Technology Showcase
March 5-6, 2019

Professional Development Courses
March 4, 2019

GBC Plenary Session
March 6, 2019

Courtesy of Amkor Technology

Courtesy of US Army RDEDCOM AMRDEC

General Chair: Jon Aday Illumina, Inc.	General Chair-Elect: Rama Puligadda Brewer Science
Past General Chair: Peter Ramm Fraunhofer EMFT Munich

DOWNLOAD FINAL PROGRAM & EXHIBIT DIRECTORY PDF
(Website program will continue to updated if changes occur)

TECHNICAL PROGRAM | PROFESSIONAL DEVELOPMENT COURSES (PDCs) | SPEAKER DETAILS
EXHIBITING COMPANIES | EXHIBITOR INFORMATION | EXHIBIT HALL FLOORPLAN
CHARITY GOLF OUTING

Thank you to our Premier PLATINUM Sponsor:

Thank you to our Premier GOLD Sponsors:

Thank you to our Premier SILVER Sponsors:

Premier Silver Sponsor: Xperi / Invensas

2019 Conference Overview:

The 15th Annual Device Packaging Conference (DPC 2019) was held in Fountain Hills, Arizona, on March 4-7, 2019. The 2019 conference welcomed nearly 600 attendees from 15 countries, in addition to a 14th consecutive sold-out exhibition hall! It was an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). Featuring 4 Topical Tracks: 3D Applications & Technologies; Flip Chip, Wafer Level Packaging & Fan-Out; Engineered Micro Systems/Devices (including MEMS, Sensors & 3D Printing); and AUTOMOTIVE PACKAGING (new track in 2019!).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

70+ presentations on FOWLP, 3D, Automotive, Microsystems...

Poster Session featuring 20+ presentations & Happy Hour!

5 Keynotes from ST Micro, NXP, Intel, Samsung, Facebook...

9 short courses on: 3D, Fanout, SiP, Cu Pillars, FC, 5G, & more...

A sold-out exhibition: 66 booths...the companies you need to see

Receptions, happy hour in the desert, and more networking & fun!

Courtesy of Amkor Technology

The Largest 2019 Conference Dedicated to...

Interposers, 3D IC & Packaging;

Fan-Out, Wafer Level Packaging
& Flip Chip;

AUTOMOTIVE PACKAGING
(New Track in 2019!); and

Engineered Micro Systems/Devices
(including MEMS/Sensors, 3D Printing...)

More technical papers, keynotes, and coverage of FOWLP, 3D, Automotive, and Micro Systems/Devices than any other competing Conference! If you can only attend one FOWLP/3D conference this year, make sure you don't miss DPC 2019...

Courtesy of Amkor Technology

VIEW THE TECHNICAL PROGRAM

9 PROFESSIONAL DEVELOPMENT COURSES (PDCs)

Device Packaging Poster Session

Registration Information:

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type	Early Fee Through 2/1/19	Advance/Onsite Fee After 2/1/19
IMAPS Member	$800	$900
Non-Member	$900	$1000
Speaker	$550	$650
Chair	$550	$650
Student	$300	$400
Chapter Officer	$550	$650
Exhibits Only Pass w/ Lunch Included	$30	$30
Exhibits Only Pass NO Lunch Included	$0	$0
8x10 Exhibit (Member)	$1600	$1900
8x10 Exhibit (Non-Member)	$2300	$2600
Professional Development Course: Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.	$325	$425

Speaker Dates/Information:

Abstracts Deadline now due: November 21, 2018
Speaker Notification Emails: December 7, 2018
Extended Abstract Deadline: January 31, 2019
Hotel Reservation Deadline: February 1, 2019
Early Registration Deadline: February 1, 2019
Speaker Bios Due: February 15, 2019
Powerpoint/Presentation file for DOWNLOAD due not later than: March 7, 2019 (Last day of Conference)
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interruption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the entire session (Wednesday, March 6 from 5:30pm-6:30pm TBD). You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on. Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 4PM UNTIL 5:00PM on Wednesday, March 6 (TBD).

Dress Code:
There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.