KESTER

12th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 15-17, 2016
Exhibition and Technology Showcase
March 15-16, 2016
Professional Development Courses
March 14, 2016
NEW** GBC Plenary
Session

March 16, 2016

DEVICE PACKAGING 2016 TECHNICAL PROGRAM NOW AVAILABLE
Click here for PDF version!

Early Registration & Hotel Deadlines: February 10, 2016
*BOOTHS SOLD OUT*


Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Rozalia Beica
Yole Developpement

General Chair-elect:
Peter Ramm
Fraunhofer EMFT Munich
Past General Chair:
Ron Huemoeller
Amkor Technology

Interposers, 3D IC & Packaging
Flip Chip, Wafer Level Packaging & FAN-OUT
SiP & Engineered Micro Systems/Devices
(including MEMS & Sensors)
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
jcalvert@dow.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair (Engr. Micro Sys.):
Robert Dean
Auburn University
deanron@auburn.edu
Technical Co-Chair:
Kathy Cook
Ziptronix
k.cook@ziptronix.com
Technical Co-Chair:
John Hunt
ASE US
John.Hunt@aseus.com
Technical Co-Chair (Engr. Micro Sys.):
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Rahul Agarwal
GlobalFoundries
rahul.agarwal@globalfoundries.com
Technical Co-Chair:
Eric Huenger
Dow Advanced Packaging Materials
EHuenger@dow.com
Technical Co-Chair (SiP):
Nozad Karim
Amkor Technology
nozad.karim@amkor.com


 

Thank You to the DPC/GBC Premier Sponsors:
DPC/GBC Premier Sponsor: ASE US, Inc.
DPC/GBC Premier Sponsor: Amkor Technology
DPC/GBC Premier Sponsor: NAMICS



REGISTRATION INFO | REGISTER ONLINE | HOTEL
TECHNICAL PROGRAM | SHORT COURSES (PDCs) | SPEAKERS | SiP PANEL | POSTERS | GBC PLENARY/KEYNOTE
EXHIBITION | 2016 EXHIBITORS | SPONSORSHIP
CHARITY GOLF | CHARITY HOLD'EM TOURNEY


Amkor
Courtesy of Amkor Technology

The Largest 2016 Conference Dedicated to...

Interposers, 3D IC & Packaging;

Flip Chip, Wafer Level Packaging & Fan-Out;

SiP & Engineered Micro Systems/Devices (including MEMS & Sensors)

Amkor
Courtesy of Amkor Technology

At the 2015 conference we welcomed 606 total participants from 19 countries who contributed to the 2nd highest ever count for DPC. Attendance was up 13% over 2014 (and 20% growth over 2013). Additionally, IMAPS thanked more sponsors than ever, sold out our 10th consecutive exhibit hall (with nearly 20 companies on a wait-list), and enjoyed a successful technical program. All sessions were well attended - standing room only in many rooms, especially our keynotes.

2016 Conference Overview:

The 12th Annual Device Packaging Conference (DPC 2016) will be held in Fountain Hills, Arizona, on March 15-17, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring 3 Topical Workshop Tracks, with New Changes For 2016:

  • Interposers & 3D IC & Packaging;

  • Flip Chip, Wafer Level Packaging & Fan-Out; and

  • SiP & Engineered Micro Systems/Devices (including MEMS & Sensors)

 

 

 

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.

 

Device Packaging Poster Session

 


Registration Information: (Early Registration Deadline: February 10, 2016) -- REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 2/10/16
Advance/Onsite Fee
After 2/10/16
IMAPS Member
$700
$800
Non-Member
$800
$900
Speaker
$450
$550
Chair
$450
$550
Student
$275
$375
Chapter Officer
$450
$550
Exhibits Only Pass w/ Lunch Included
$30
$30
Exhibits Only Pass NO Lunch Included
$0
$0
8x10 Exhibit (Member)
$1600
$1900
8x10 Exhibit (Non-Member)
$2300
$2600
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.
$400
$450

REGISTER ONLINE


Speaker Dates/Information:

  • Abstracts Deadline Extended to: December 15, 2015
  • Speaker Notification Emails: January 14, 2016
  • Extended Abstract Materials due: February 12, 2016
  • Hotel Reservation Deadline: February 10, 2016
  • Early Registration Deadline: February 10, 2016
  • Speaker Bios Due: March 1, 2016
  • Powerpoint/Presentation file for DOWNLOAD due not later than: March 17, 2016 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Housing
Hotel Reservation Deadline - February 10, 2016

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $169+ taxes/fees

ONLINE RESERVATIONS

Feel free to continue to try: Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Book your hotel reservation today! We have reserved a block of rooms at the host hotel to accommodate our attendees. The discounted room rates are only available until the hotel deadline listed above, or until the room block sells out (and they often sell out early - before the expire dates). Reservations received after the noted deadline or after the room block has been filled may be subject to significantly higher rates. IMAPS room blocks at most hotels historically sell out ahead of the discount deadline, so we encourage you to make your hotel reservations quickly for the best price and availability.

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.


 

Device Packaging/GBC Sponsorship
(Need to be ahead of your competition? Join this list today! A few spots remain)

Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.

Premier Sponsor:
Golf Hole Sponsor: Amkor Technology

Premier Sponsor:
DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors

SPTS - Corporate Sponsor

Mentor Graphics - Corporate Sponsor
Event Sponsors
sponsorships
available
     
Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor (1 hole):

Golf Hole Sponsor: Amkor Technology

"Eagle" Sponsor (3 holes):DPC/GBC Premier Sponsor: NAMICS

available
Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor
     



CORPORATE PREMIER MEMBERS
  • Amkor
  • Canon
  • Corning
  • Fastech Synergy Philippines
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems