10th International Conference and Exhibition on Device Packaging www.imaps.org/devicepackaging Radisson Fort McDowell Resort and Casino Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops March 11-13, 2014 Exhibition and Technology Showcase March 11-12, 2014 Professional Development Courses March 10, 2014 GBC Spring Conference March 9-10, 2014 In conjunction with the Global Business Council (GBC) Spring Conference, March 9-10 Courtesy of Rensselaer Polytechnic Institute Courtesy of US Army RDEDCOM AMRDEC General Chair: Ron Huemoeller Amkor Technology General Chair-elect (Panels & Keynotes): Paul Siblerud Strategic Tech Analysis, LLC Past General Chair (PDCs): James Lu Rensselaer Polytechnic Institute 3D & 2.5D Packaging Topical Workshop Flip Chip & Wafer Level Packaging Topical Workshop Packaging Innovations & System Challenges for: Microsystems & Devices Topical Workshop Photonics & LED Packaging Topical Workshop Technical Co-Chair: Rozalia Beica Yole Developpement rbeica@gmail.com Technical Co-Chair: John Aday Qualcomm jaday@qti.qualcomm.com Technical Co-Chair: Robert Dean Auburn University deanron@auburn.edu Technical Co-Chair: John Mazurowski Penn State Electro Optics Center jmazurowski@eoc.psu.edu Technical Co-Chair: Peter Ramm Fraunhofer EMFT Munich peter.ramm@emft.fraunhofer.de Technical Co-Chair: Linda Bal Freescale Semiconductor Linda.Bal@freescale.com Technical Co-Chair: Russell Shumway Amkor Technology russell.shumway@amkor.com Technical Co-Chair: Bob Kuo Amkor Technology Bob.Kuo@amkor.com Abstract Deadline: December 6, 2013 Early Registration & Hotel Deadlines: February 7, 2014 Exhibit Booths, PDCs, Registration: Available Soon

Submit Abstracts | Submit PDC Proposals
Registration Information | Hotel Reservations
Speaker Info | Student Competition
Exhibition Details | Floorplan | 2014 Exhibitors | 2013 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament

2014 Conference Overview:

The 10th Annual Device Packaging Conference (DPC 2014) will be held in Fountain Hills, Arizona, on March 10-13, 2014. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Featuring Topical Workshop Tracks on:

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than December 6, 2013, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 24, 2014. A post-conference USB containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions.

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before January 10, 2014 at: www.imaps.org/devicepackaging or contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2014 - so book early!

Device Packaging Professional Development Courses (PDCs):

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 10th, preceding the technical conference. PDC details and registration on-line soon.

New Course by Rao Tummala... Next Frontier in Electronics: Systems Scaling for Smart Mobile Systems In addition a great list of short courses again this year, IMAPS is very happy to announce this new PDC being presented for the first time by Rao R. Tummala from 3D Systems Packaging Research Center at the Georgia Institute of Technology. PDC details available soon.

If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/pdc no later than December 6, 2013.

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.

Registration Information: (Early Registration Deadline: February 1, 2014)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) USB of presentations; USB will contain the extended abstract and presentation as submitted by the presenter. USB will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Housing
Hotel Reservation Deadline - February 7, 2014

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $162 + Taxes

On-Line Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

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Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The Device Packaging student review committee will evaluate all student papers/posters and award at a total of $3,000 in awards checks at/following the Conference: $1500 first prize, $1000 second prize, and $500 third prize. The selected student(s) must attend the event to present his or her work and receive the award.

Speaker Dates/Information:

• Abstracts Deadline: December 6, 2013
• Speaker Notification Emails: January 6, 2014
• Extended Abstract or Abstract Book Materials due: January 24, 2014
• Hotel Reservation Deadline: February 7, 2014
• Early Registration Deadline: February 7, 2014
• Speaker Bios Due: March 1, 2014
• Powerpoint/Presentation file for CD-Rom due not later than: March 13, 2014 (Last day of Conference)
• Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
• Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

DPC/GBC Premier Sponsors:

Event Sponsors:

Post-Conference Presentations USB Drives:

Sponsor - Conference Lanyards:

Golf Sponsors:

"Eagle" Sponsors:

"Birdie" Sponsor:

Golf Hole Sponsors:

Student Paper Competition
Sponsor:

Media Sponsors: