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10th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 11-13, 2014
Exhibition and Technology Showcase
March 11-12, 2014
Professional Development Courses
March 10, 2014
GBC Spring Conference
March 9-10, 2014

In conjunction with the Global Business Council (GBC) Spring Conference, March 9-10


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Paul Siblerud
Strategic Tech Analysis, LLC
Past General Chair
(PDCs):

James Lu
Rensselaer Polytechnic Institute

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
Packaging Innovations & System Challenges for:
Microsystems & Devices
Topical Workshop
Photonics & LED Packaging
Topical Workshop
Technical Co-Chair:
Rozalia Beica
Yole Developpement
rbeica@gmail.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair:
Robert Dean
Auburn University deanron@auburn.edu
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
jmazurowski@eoc.psu.edu
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
peter.ramm@emft.fraunhofer.de
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Linda.Bal@freescale.com
Technical Co-Chair:
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Bob Kuo
Amkor Technology
Bob.Kuo@amkor.com


Early Registration & Hotel Deadlines: February 7, 2014
Exhibit Booths SOLD OUT



Technical Program | Professional Development Courses (PDCs) | Speaker Info
Exhibition Details | Floorplan | 2014 Exhibitors | 2013 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament


ALLVIA - Event Sponsor

 

THANK YOU to the DPC/GBC Premier Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp. DPC/GBC Premier Sponsor: Amkor Technology DPC/GBC Premier Sponsor: ASE US, Inc.

 

2014 Conference Overview:

The 10th Annual Device Packaging Conference (DPC 2014) will be held in Fountain Hills, Arizona, on March 10-13, 2014. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

The 2014 Technical Program will feature Topical Workshop Tracks on: Advanced 3D Packaging; Flip Chip and Wafer Level Packaging; and Packaging Innovations & System Challenges for: MEMS, Microsystems & Devices; and Photonics Packaging. Device Packaging 2014 will offer 15 cutting-edge technical sessions over 2.5 days, more than 80 presentations from speakers from around the industry and globe, and 6 keynote presentations from: Steve Bezuk, Qualcomm; Brandon Prior, Prismark; Bryan Black, AMD; John Peddie, JPR; Glenn Daves, Freescale; and Yole.

Before the Conference begins, IMAPS will offer 8 Professional Development Courses (PDCs). For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 10th, preceding the technical conference:

8:00 am - 12:00 pm
Monday Morning Professional Development Courses (PDCs)
PDC1:Next Frontier in Electronics: Systems Scaling for Smart Mobile Systems
Course Leader: Rao R. Tummala, Georgia Tech 3D Systems Packaging Research Center
PDC2: nanoMEMS Frontiers
Course Leader: Slobodan Petrovic, Oregon Institute of Technology
PDC3: Mechanical Design and Reliability Analysis in Microelectronics Packaging
Course Leader: Amaneh Tasooji, Arizona State University
PDC4: Adhesion Fundamentals for Microelectronic Packaging
Course Leader: Raymond A. Pearson, Lehigh University
1:00 pm - 5:00 pm
Monday Afternoon Professional Development Courses (PDCs)
PDC5: Industry Updates/Trends: 2.5D/3D, Flip Chip, MEMS, LED & Photonics (1Q2014-2Q2013)
Course Leader: Phil Creter, Creter & Associates
PDC6: Package Level Integration - 2-D, 2.5-D and 3-D : Impact on Handheld Systems
Course Leaders: Dev Gupta, APSTL
PDC7: Basics of Conventional and Advanced Chip Packaging
Course Leader: Syed Sajid Ahmad, Center for Nanoscale Science and Engineering, NDSU
PDC8: Polymer Challenges in 2.5D and 3D Packaging
Course Leader: Jeffrey Gotro, InnoCentrix, LLC
Rao Tummala - PDC New Course by Rao Tummala...
Next Frontier in Electronics: Systems Scaling for Smart Mobile Systems


In addition to this great list of short courses again this year, IMAPS is very happy to announce this new PDC being presented for the first time by Rao R. Tummala from 3D Systems Packaging Research Center at the Georgia Institute of Technology.

 

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Sixty-Five full 8' by 10' exhibit spaces will be on display .The exhibits have sold out every year since 2006 and have sold out again in 2014.

 

Don't forget to have a little fun while you're visiting Arizona and Device Packaging! The IMAPS Microelectronic Foundation is holding its Fourth Annual Charity Texas Hold'em Tournament in conjunction with the IMAPS Device Package Conference on Monday, March 10 at 7:00pm. The number of seats at the tables is limited to the first 30 players. The Tournament will be held in the Ft McDowell Resort with all entry fees going to the Foundation.

And at the conclusion of the Conference on Thursday, March 13, be sure to join the 2014 IMAPS Microelectronics Foundation Spring Golf Invitational. The 2014 outing will be held at SunRidge Canyon's 6,823-yard, par-71, Keith Foster-designed golf course unfolds around the rugged ridges and shady canyons unique to the desert mountains that divide Fountain Hills from Scottsdale, Arizona. This "best ball" scramble raises funds for a great cause, and welcomes 60+ golfers to enjoy the weather, great golf course, and have a little fun. It's a very relaxed and fun event for even the beginner golfer!

 

Please contact Brian Schieman by email at bschieman@imaps.org or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.

Technical Program


Registration Information: (Early Registration Deadline: February 7, 2014)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) USB of presentations; USB will contain the extended abstract and presentation as submitted by the presenter. USB will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 2/7/14
Advance/Onsite Fee
After 2/7/14
IMAPS Member
$675
$775
Non-Member
$775
$875
Speaker
$425
$525
Chair
$425
$525
Student
$275
$375
Chapter Officer
$425
$525
Exhibits Only Pass w/ Lunch Included
$30
$30
Exhibits Only Pass NO Lunch Included
$0
$0
8x10 Exhibit (Member)
$1300
$1500
8x10 Exhibit (Non-Member)
$2000
$2200
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions..
$400
$450

 


Housing
Hotel Reservation Deadline - February 7, 2014

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $162 + Taxes

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.



Speaker Dates/Information:

  • Abstracts Deadline Extended to: December 20, 2013
  • Speaker Notification Emails: January 22, 2014
  • Extended Abstract (2-4 pgs) / Abstract Book Materials due: February 7, 2014
  • Hotel Reservation Deadline: February 7, 2014
  • Early Registration Deadline: February 7, 2014
  • Speaker Bios Due: March 1, 2014
  • Powerpoint/Presentation file for CD-Rom due not later than: March 13, 2014 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.



DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: ASE US, Inc.


Corporate Sponsor:

SPTS - Corporate Sponsor

 


Event Sponsors:

Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Exhibit Hall Reception Sponsor:
Sikama - Coffee Break Sponsor

Keynote Sessions &
Lunch Sponsor:

Applied Materials - Corporate Sponsor

Sponsor - Conference Lanyards:
Hole Sponsor: NAMICS

Sponsor - 3D Panel:
3D Panel Sponsor: Invensas

Poster Session "Happy Hour" & Conference Pens Sponsor:
Sponsor: Lam Research

Event Sponsor:
STATSChipPAC - Coffee Break Sponsor

Supporting Sponsor: GA Tech 3D PRC

 


Golf Sponsors:

"Eagle" Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor:
"Birdie" Golf Sponsor: Amkor Technology


Golf Hole Sponsors:

Golf Hole Sponsor: NAMICS

Golf Hole Sponsor: Infinite Graphics

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: PUTTIST, 3-Putt Killer

Golf Hole Sponsor: Dixon Golf


Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation


Official Media Sponsors:

Chip Scale Review - Media Sponsor

3D InCites - Media Sponsor

MEPTEC - Media Sponsor

 




© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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