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8th International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA



Conference and Technical Workshops
March 6-8, 2012
Exhibition and Technology Showcase
March 6-7, 2012
Professional Development Courses
March 5, 2012
GBC Spring Conference
March 4-5, 2012

In conjunction with the Global Business Council (GBC) Spring Conference, March 4-5


Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC


General Chair:

Peter Elenius
E&G Technology Partners

General Chair-elect (PDCs):
James Lu
Rensselaer Polytechnic Institute
Past General Chair (Panels):
Phil Garrou
Microelectronic Consultants of NC


3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
MEMS & Microsystems
Topical Workshop
Passive Integration
Topical Workshop
LED Packaging
Topical Workshop
Technical Co-Chair:
Ron Huemoeller
Amkor Technology
Technical Co-Chair:
Rey Alvarado
Maxim Integrated Prod.
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Franck Murray
IPDIA
Technical Co-Chair:
Thomas Goodman
E&G Technology Partners
Technical Co-Chair:
Rozalia Beica
Lam Research AG
Technical Co-Chair:
Alan Huffman
RTI International
Technical Co-Chair:
Tracy Hudson
US Army
Technical Co-Chair:
Kai Liu
STATS ChipPAC
Technical Co-Chair:
Bob Karlicek
Rensselaer Polytechnic Institute

EARLY REGISTRATION/EXHIBIT/Hotel Deadlines: February 10, 2012


On-line Registration | Hotel Reservations
Technical Program | Professional Development Courses (PDCs) | Download Program PDF
Exhibition Details | Reserve Exhibits On-line | Floorplan | 2012 Exhibitors | 2011 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament


** Only 2 Exhibit Booths Still Available **

Download 2012 Advance Program Draft (PDF)

Conference Overview:

The eigth Annual Device Packaging Conference (DPC2012) will be held in Scottsdale, Arizona, on March 5-8, 2012. It is an international event sponsored and organized by the International Microelectronics And Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.

The 2012 conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 5 topical workshop areas related to microelectronic packaging 2.5D & 3D IC & Packaging; Flip Chip & Wafer Level Packaging; MEMS & Associated Microsystems; High Brightness LEDs; and Passive Integration.

 


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student with "best presentation". The selected student must attend the event to present his or her work and receive the award.

As a result of the successful foundation fundraising that took place at IMAPS 2011 Long Beach (golf outing, Ca-Si-No night and various donations), the Microelectronics Foundation is able to provide increased awards for the 2011 Device Packaging Conference. The Foundation is awarding 3 students with the "best presentations" of the Conference: $1500 (1st place), $1000 (2nd), and $500 (3rd). The first place winner will also be able to submit their updated paper for IMAPS Annual Symposium - IMAPS 2012 in San Diego.

The Microelectronics Foundation



Housing
Hotel Reservation Deadline - February 10, 2012

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

$149 single/double

Phone Reservations: (480) 789-5300 - Mention IMAPS or IMAPS1 when booking

Online Reservations:
www.radisson.com/imaps



Speaker Dates/Information:

  • Abstracts Deadline Extended To: December 2, 2011
  • Hotel Reservation Deadline: February 10, 2012
  • Extended Abstract or Abstract Book Materials due: February 6, 2012
  • Early Registration/Exhibit Deadline: February 10, 2012
  • Powerpoint/Presentation file for Conference USB due not later than: March 8, 2012 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A); Keynote: 45 minutes (40 to present; 5 for Q&A)



DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

DPC/GBC Premier Sponsor: Amkor Technology

Event Sponsor - Exhibit Reception, Lunch & Break:

Applied Materials - Event Sponsor

Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Coffee Break Sponsor:
Sikama - Coffee Break Sponsor

Student Paper Competition
Sponsor:


Student Paper Competition Sponsor - The Microelectronics Foundation

Golf Hole Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

Golf Hole Sponsor: Amkor Technology

Hole Sponsor: NAMICS

Golf Hole Sponsor: LORD Corporation

Golf Hole Sponsor: Coining Inc/SPM

Golf Hole Sponsor: AGC Electronics America

Golf Hole Sponsor: Kyzen Corp.

Media Sponsors:

MEPTEC

Yole Developpement

I-Micronews

3D InCites - Media Sponsor



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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