KESTER

12th International Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging

WekoPa Resort and Casino
Fountain Hills, Arizona USA

IMAPS Device Packaging

Conference and Technical Workshops
March 15-17, 2016
Exhibition and Technology Showcase
March 15-16, 2016
Professional Development Courses
March 14, 2016
GBC Plenary Session
March 16, 2016
Device Packaging (Amkor Image)
Courtesy of Amkor Technology
Device Packaging (RDEDCOM image)
Courtesy of US Army RDEDCOM AMRDEC

General Chair:
Rozalia Beica
Yole Developpement

General Chair-elect:
Peter Ramm
Fraunhofer EMFT Munich
Past General Chair:
Ron Huemoeller
Amkor Technology

Interposers, 3D IC & Packaging
Flip Chip, Wafer Level Packaging & FAN-OUT
SiP & Engineered Micro Systems/Devices
(including MEMS & Sensors)
Technical Co-Chair:
Jeff Calvert
Dow Electronic Materials
jcalvert@dow.com
Technical Co-Chair:
Jon Aday
Qualcomm
jaday@qti.qualcomm.com
Technical Co-Chair (Engr. Micro Sys.):
Robert Dean
Auburn University
deanron@auburn.edu
Technical Co-Chair:
Kathy Cook
Ziptronix
k.cook@ziptronix.com
Technical Co-Chair:
John Hunt
ASE US
John.Hunt@aseus.com
Technical Co-Chair (Engr. Micro Sys.):
Russell Shumway
Amkor Technology
russell.shumway@amkor.com
Technical Co-Chair:
Rahul Agarwal
GlobalFoundries
rahul.agarwal@globalfoundries.com
Technical Co-Chair:
Eric Huenger
Dow Advanced Packaging Materials
EHuenger@dow.com
Technical Co-Chair (SiP):
Nozad Karim
Amkor Technology
nozad.karim@amkor.com


 

Thank You to the DPC/GBC Premier Sponsors:
DPC/GBC Premier Sponsor: ASE US, Inc.
DPC/GBC Premier Sponsor: Amkor Technology
DPC/GBC Premier Sponsor: NAMICS




TECHNICAL PROGRAM | SHORT COURSES (PDCs) | SPEAKERS | SiP PANEL | POSTERS | GBC PLENARY/KEYNOTE
EXHIBITION | 2016 EXHIBITORS


Amkor
Courtesy of Amkor Technology

The Largest 2016 Conference Dedicated to...

Interposers, 3D IC & Packaging;

Fan-Out, Wafer Level Packaging
& Flip Chip;

System-in-Package (SiP);

Engineered Micro Systems/Devices
(including MEMS & Sensors)

Amkor
Courtesy of Amkor Technology

The 12th International Conference and Exhibition on Device Packaging welcomed 526 total participants from 19 countries, sold out an 11th consecutive exhibit hall, and enjoyed a successful technical program! The conference also proudly welcomed: • A 10% increase in full conference attendees • 15% international attendees • 3 new sponsoring companies • Standing room only in the brand new SiP track • Plus, much more!

**2016 Conference presentations available at WWW.IMAPSOURCE.ORG in APRIL**

We hope to see you March 6-9, 2017 for next year’s Device Packaging Conference! DETAILS THIS SPRING...

2016 Conference Overview:

The 12th Annual Device Packaging Conference (DPC 2016) will be held in Fountain Hills, Arizona, on March 15-17, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).

The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.


The 12th Device Packaging Conference Features:
(with New Changes For 2016)

 

Device Packaging Poster Session

 


Registration Information: (Early Registration Deadline: February 19, 2016)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; DOWNLOAD will contain the extended abstract and presentation as submitted by the presenter. DOWNLOAD will be emailed 15 approximately business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 2/19/16
Advance/Onsite Fee
After 2/19/16
IMAPS Member
$700
$800
Non-Member
$800
$900
Speaker
$450
$550
Chair
$450
$550
Student
$275
$375
Chapter Officer
$450
$550
Exhibits Only Pass w/ Lunch Included
$30
$30
Exhibits Only Pass NO Lunch Included
$0
$0
8x10 Exhibit (Member)
$1600
$1900
8x10 Exhibit (Non-Member)
$2300
$2600
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions.
$400
$450

 


Speaker Dates/Information:

  • Abstracts Deadline Extended to: December 15, 2015
  • Speaker Notification Emails: January 14, 2016
  • Extended Abstract Materials due: February 19, 2016
  • Hotel Reservation Deadline: February 10, 2016
  • Early Registration Deadline: February 19, 2016
  • Speaker Bios Due: March 1, 2016
  • Powerpoint/Presentation file for DOWNLOAD due not later than: March 17, 2016 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB (recommended to have back-up on personal laptop or email to bschieman@imaps.org prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo
.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Poster Session/Information
The poster session is planned to be an INTERACTIVE presentation. This means you do not start and complete a scheduled talk without interuption like in a regular/oral session. Speakers should have talking points and be at their poster throughout the session. You can "present" your scheduled materials, but more often the attendees will review your slides and ask questions. Or you can watch them and talk to them depending on which slide they are on.

Authors may either print out each of their powerpoint slides on regular paper and tack them up in order, or prepare a large poster (or 2 even). Recommended poster size is typically 3x4 feet, with the max space on the board being 4 ft high x 8 ft wide. IMAPS staff will provide tacks to secure your print outs. The session is first-come-first-serve so there are not assigned poster boards/locations. POSTER SETUP FROM 4PM UNTIL 5PM.

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.


Housing
Hotel Reservation Deadline - February 10, 2016

Housing accommodations must be made directly to:

WeKoPa Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

 

 

Device Packaging/GBC Sponsorship
(Need to be ahead of your competition? Join this list today! A few spots remain)

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: ASE US, Inc.

PREMIER SPONSOR:
Golf Hole Sponsor: Amkor Technology

PREMIER SPONSOR:
DPC/GBC Premier Sponsor: NAMICS

Corporate Sponsors
SPTS - Corporate Sponsor
Mentor Graphics - Corporate Sponsor
EMD Performance Materials - Corporate Sponsor
Event Sponsors

Mobile APP Sponsor: SETNA

Mobile "App" Sponsor

Applied Materials - Event Sponsor

Mobile Charging Station &
Evening Panel / Reception

VEECO - Mobile Charging Station & Golf Sponsor

Mobile Charging Station

Shenmao - Event Sponsor

Refreshment Breaks &
Attendee Bag Insert

Poster Session / Happy Hour Sponsor: XIA

Poster Session & Happy Hour Sponsor

 

 

 

Golf/Foundation Sponsors

"Eagle" Sponsor (3 holes):
DPC/GBC Premier Sponsor: ASE US, Inc.

Holes: #1, #12 - Closest to Pin, #16

"Birdie" Sponsor (1 hole):
Golf Hole Sponsor: Amkor Technology

Hole #3 - Longest Drive

"Eagle" Sponsor (3 holes):DPC/GBC Premier Sponsor: NAMICS

Holes: #2, #8 - Closest to Pin, #18

EMD Performance Materials - Corporate Sponsor

Hole #14 - Closest to Pin

Golf Hole Sponsor: Infinite Graphics

Hole #6 - Closest to Pin

MRSI - Break Sponsor

Hole #10

Golf Hole Sponsor: Coining Inc/SPM

Hole #5

Technic - Sponsor - Mobile Charging Station

Hole #7

VEECO - Golf Sponsor

Holes #4 - Longest Putt, #15

ASM Pacific - Hole Sponsor

Hole #11

Golf Hole Sponsor: AGC Electronics America

Hole #13

Golf Hole Sponsor: Dixon Golf

Hole #9 - Straight Drive Competition
Hole #17 - Hole-in-One Competition

Official Media Sponsors
Media Sponsor: MEMS Journal
Media Sponsor: Semiconductor Packaging News
Media Sponsor: Chip Scale Review
Media Sponsor: MEPTEC
Media Sponsor: Webcom - Antenna Systems & Technology
Media Sponsor: Webcom - Electronics Protection
Media Sponsor: Webcom - Thermal News
3D Incites - Media Sponsor
Solid State Technology - Media Sponsor
     



CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Fastech Synergy Philippines
  • GaN Systems
  • Honeywell
  • Indium
  • Isola Group
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NEO Tech
  • NGK NTK
  • Palomar
  • Plexus
  • Qualcomm
  • Specialty Coating Systems