5th International
Conference and Exhibition on
Device Packaging
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
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Conference and Technical Workshops
March
10-12, 2009
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Exhibition and Technology Showcase
March
10-11, 2009 |
Professional
Development Courses
March 9, 2009 |
GBC
Spring Conference
March
8-9, 2009 |
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Courtesy of FlipChip International, LLC |
Courtesy of Rensselaer Polytechnic Institute |
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General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer
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Technical
Co-Chair:
Christo Bojkov
Freescale Semiconductor |
Technical
Co-Chair:
Linda Bal
Freescale Semiconductor |
Technical
Co-Chair:
Robert Dean
Auburn University |
Technical
Co-Chair:
Peter Tortorici
Medtronic Microelectronics Center |
Technical
Co-Chair:
Beth Keser
Freescale Semiconductor |
Technical
Co-Chair:
Gene Dunn
Panasonic Factory Solutions Company |
Technical
Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute |
Technical
Co-Chair:
Lou Nicholls
Amkor Technology |
Technical
Co-Chair:
Victor Bright
University of Colorado at Boulder |
Technical
Co-Chair:
Steve Adamson
Asymtek |
Technical
Co-Chair:
Andrew Strandjord
Pac Tech USA |
Technical
Co-Chair:
Dave Saums
DS&A LLC |
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View the Technical Program | Register On-Line | Hotel Reservations | Transportation
Download Advance Program (pdf) | Professional Development Courses (PDCs) | Speaker Information
Exhibition | Floorplan | 2009 Exhibitors
Global Business Council (GBC) Spring
Conference
The Fifth Annual Device Packaging Conference (DPC2009) will be held in Scottsdale, Arizona, on March 9-12, 2009. It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
This year’s conference will feature technical sessions, panel discussions, a poster session, professional development courses and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological developments in 6 topic areas related to microelectronic packaging: 3D Packaging; Flip Chip; Wafer Level Packaging; MEMS; BioMedical Devices; and Power LED Devices. Technical presentations in these 6 topic areas cover a full range of issues from new developments and materials through manufacturing and reliability. The professional development courses offered are also focused on these topical areas of microelectronics and offer an additional valuable resource to attendees. The Global Business Council (GBC) will co-locate its Spring Conference March 8-9, focusing on the business aspects of these technologies. There will be several networking receptions and gatherings throughout the week, including the opening reception, meals, and other social events.
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, sales and marketing.
Technical Program | Register | Hotel | Professional Development Courses (PDCs) | 2009 Exhibitors | GBC Spring
Conference
HOUSING
Hotel Reservation Deadline - February 6, 2009
Housing accommodations must be made directly to:
Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
On-line Reservations - Promotional Code: IMAPS9
TRANSPORTATION
IMAPS preferred vendor for airport transportation:
Esquire Transportation offers competitive pricing. Please call to make a reservation.
(602) 790-8963
or
(480) 922-3171
www.rideesquire.com
Speaker Dates/Information:
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Abstract Deadline: December 5, 2008
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Extended Abstract or Abstract Book Materials due: January 30, 2009
- Hotel Reservation/Early RegistrationDeadline: February 6, 2009
- Powerpoint/Presentation file for CD-Rom due not later than: March 12, 2009 (Last day of Conference)
- Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
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Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
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