Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA
General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer
602-431-4764 |
ted.tessier@flipchip.com
Conference and Technical Workshops March
17-20, 2008
Exhibition and Technology Showcase March
18-19, 2008
Professional
Development Courses March 17, 2008
GBC
Spring Conference March
16-17, 2008
Announcement and Call for Abstracts Advanced Technology Workshop on MEMS & Associated Microsystems Download PDF This workshop is being held as a part of the Device Packaging Conference
Abstract Deadline: November 30, 2007
Technical Chair: Robert Dean
Auburn University
Auburn, AL 36849
Phone: 334-844-1838
rdean(AT)eng.auburn.edu
Technical Chair: Ajay P. Malshe
University of Arkansas
Fayetteville, AR 72701
Phone: 479-575-6561
apm2(AT)engr.uark.edu
MEMS Organizing Committee:
David Coe, PhD, UAH; coe(AT)ece.uah.edu
Ron Foster, Axept; foster(AT)axept.com
Brian Grantham, PE, U. S. Army; brian.e.grantham(AT)us.army.mil
Matt Perry, ENGENT, Inc.; matt.perry(AT)engentaat.com
Keith Warren, PE, MEMS Consultant; kwarren(AT)ieee.org
MEMS & Associated Microsystems Workshop Focus:
The objective of the MEMS & Associated Microsystems Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of MEMS and associated microsystems. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to fabrication, packaging and applications of MEMS devices. Abstracts are being requested on the following topics:
MEMS Inertial Sensors
MEMS RF Devices
MEMS Sensors (non-inertial)
Microfluidic and Bio-MEMS
MEMS Reliability and Failure Analysis
Optical MEMS (MOEMS)
Multi-Sensor Integration
MEMS Packaging and Testing
Innovative Materials and Processing
MEMS Operation in Harsh Environments
Polymer and Laminated MEMS Devices
System Integration of MEMS Devices
Energy Scavenging
Thermal Management Devices
Near Hermetic MEMS Packaging
Vacuum Packaging of MEMS Devices
Those wishing to present in the MEMS & Associated Microsystems sector of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.
Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of MEMS. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.
Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2007.
Interested in Exhibits? Contact Ann Bell - abell@imaps.org Interested in becoming a Speaker/Chair? Contact Jackki Morris-Joyner - jmorris@imaps.org Interested in helping organize the 2008 Conference? Contact Brian Schieman - bschieman@imaps.org
HOUSING Hotel Reservation Deadline - February 12, 2008
Housing accommodations must be made directly to:
For reservations, call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference
Hotel availability and rates will not be guaranteed after February 12, 2008.
Speaker Dates/Information:
Abstracts due: November 30, 2007
Extended Abstract or Abstract Book Materials due: February 8, 2008
Hotel Reservation Deadline: February 12, 2008
Powerpoint/Presentation file for CD-Rom due not later than: March 20, 2008 (Last day of Conference)
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 |
E-mail: imaps@imaps.org