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5th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 10-12, 2009
Exhibition and Technology Showcase
March 10-11, 2009
Professional Development Courses
March 9, 2009
GBC Spring Conference
March 8-9, 2009

In conjunction with the Global Business Council (GBC) Spring Conference, March 8-9

Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute
General Chair:
Ted Tessier
FlipChip International
Chief Technical Officer

Announcement and Call for Abstracts
Topical Workshop on

MEMS & Associated Microsystems

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline:  December 5, 2008

Technical Chair:
Victor Bright
University of Colorado at Boulder
Boulder, CO 80309-0427
Phone: 303-735-1734
Technical Chair:
Robert Dean
Auburn University
Auburn, AL 36849
Phone: 334-844-1838

MEMS Organizing Committee:
Thomas Baginski, Ph.D., Auburn University
Nick Barbosa, Ph.D., NIST
Tracy, Hudson Ph.D., U.S. Army
Ajay Malshe, Ph.D., University of Arkansas
Lienhard Pagel, Ph.D., University of Rostock
Keith Warren, PE, MEMS Consultant

Submit Abstract(s) | Student Competition
Hotel Information | Speaker Information | Exhibit Information | Reserve Booth(s) |
Professional Development Courses (PDCs)

Workshops: 3D Packaging | Flip Chip Technologies | MEMS & Associated Microsystems |
Wafer Level Packaging/CSP | Packaging & Application of Power LED Devices | Electronic Packaging for Medical Devices

MEMS & Associated Microsystems Workshop Focus:
The objective of the MEMS & Associated Microsystems Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of MEMS and associated microsystems. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to MEMS technology.

Attendees and presenters in the past have found that the MEMS & Associated Microsystems Workshop is a great opportunity to meet old colleagues and to form new relationships with people in the industry. If you are working in any area of electronics packaging or microelectronics, the Workshop on MEMS & Associated Microsystems technologies would be well worth attending. Abstracts are being requested on the following topics:

  • MEMS Inertial Sensors
  • MEMS RF Devices
  • MEMS Sensors (non-inertial)
  • Microfluidic and Bio-MEMS
  • MEMS Reliability and Failure Analysis
  • Optical MEMS (MOEMS)
  • Multi-Sensor Integration
  • MEMS Packaging and Testing
  • Innovative Materials and Processing
  • MEMS Operation in Harsh Environments
  • Polymer and Laminated MEMS Devices
  • System Integration of MEMS Devices
  • Energy Scavenging
  • Thermal Management Devices

Those wishing to present in the MEMS & Associated Microsystems sector of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 5, 2008, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 30, 2009. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at or by phone at 305-382-8433 if you have questions.

Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. Reserve booth(s) on-line or please contact Ann Bell by email at or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at no later than December 5, 2008.


Interested in Exhibits? Contact Ann Bell -
Interested in helping organize the 2009 Conference? Contact Brian Schieman -

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.
The Microelectronics Foundation

Hotel Reservation Deadline - February 6, 2009

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Promotional Code: IMAPS9

Speaker Dates/Information:

  • Abstracts due: December 5, 2008
  • Extended Abstract or Abstract Book Materials due: January 30, 2009
  • Hotel Reservation Deadline: February 6, 2009
  • Powerpoint/Presentation file for CD-Rom due not later than: March 12, 2009 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)


Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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