IMAPS - MEMS and Associated Microsystems Workshop of Device Packaging 2010 Conference

Announcement and Call for Abstracts
Topical Workshop on
MEMS & Associated Microsystems
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This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline Extended To: December 14, 2009

Technical Chair: Robert Dean Auburn University Auburn, AL 36849 Phone: 334-844-1838 rdean@eng.auburn.edu	Technical Chair: Tracy Hudson U.S. Army RDEDCOM AMRDEC Redstone Arsenal, AL 35898 Phone: 256-876-6242 tracy.hudson@us.army.mil

MEMS Organizing Committee: Thomas Baginski, Ph.D., Auburn University Li-Anne Liew, Ph.D., NIST Ajay Malshe, Ph.D., University of Arkansas Mathias Nowottnick, Ph.D., University of Rostock Phil Reiner, Ph.D., Stanley Associates Peter Tortorici, Ph.D., Medtronic Keith Warren, PE, MEMS Consultant

Workshops: 3D Packaging | Flip Chip Technologies | MEMS & Associated Microsystems |
Wafer Level Packaging | Emerging Technology (LEDs & Passive Integration)

MEMS & Associated Microsystems Workshop Focus:
The objective of the MEMS & Associated Microsystems Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of MEMS and associated microsystems. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to MEMS technology.

Abstracts are being requested on the following topics:

MEMS Inertial Sensors
MEMS RF Devices
MEMS Sensors (non-inertial)
Microfluidic and Bio-MEMS
MEMS Reliability and Failure Analysis
Optical MEMS (MOEMS)
Multi-Sensor Integration
MEMS Packaging and Testing
Innovative Materials and Processing
MEMS Operation in Harsh Environments
Polymer and Laminated MEMS Devices
System Integration of MEMS Devices
Energy Scavenging
Thermal Management Devices

Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than December 14, 2009, using the on-line submittal form at: www.imaps.org/abstracts.htm. No formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 29, 2010. A post-conference CD containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

In addition, this year, the track Technical Chairs will be choosing select papers from the Conference for inclusion in a volume entitled “Advanced Microelectronic Packaging 2010”. Participation is not mandatory, but we’re sure many of you will want to participate in this highly exciting new concept. Papers not selected for this volume may consider submission to the annual IMAPS Sympoisum or may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. The Exhibit Hall sold out each year since 2006. Please review the exhibit information or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 9th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line or contact Jackki Morris-Joyner by email at jmorris@imaps.org no later than December 14, 2009.

Interested in Exhibits? Contact Ann Bell - abell@imaps.org
Interested in helping organize the 2010 Conference? Contact Brian Schieman - bschieman@imaps.org

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to present his or her work and receive the award.

HOUSING
Hotel Reservation Deadline - February 2010

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

On-line Reservations - Available Soon

Speaker Dates/Information:

Abstract Deadline Extended To: December 14, 2009
Extended Abstract or Abstract Book Materials due: January 29, 2010
Hotel Reservation/Early RegistrationDeadline: February 2010
Powerpoint/Presentation file for CD-Rom due not later than: March 11, 2010 (Last day of Conference)
Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)