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10th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 11-13, 2014
Exhibition and Technology Showcase
March 11-12, 2014
Professional Development Courses
March 10, 2014
GBC Spring Conference
March 9-10, 2014

In conjunction with the Global Business Council (GBC) Spring Conference, March 9-10

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

General Chair:

Ron Huemoeller
Amkor Technology

General Chair-elect
(Panels & Keynotes):

Paul Siblerud
Strategic Tech Analysis, LLC
Past General Chair

James Lu
Rensselaer Polytechnic Institute

3D & 2.5D Packaging
Topical Workshop
Flip Chip & Wafer Level Packaging
Topical Workshop
Packaging Innovations & System Challenges for:
Microsystems & Devices
Topical Workshop
Photonics & LED Packaging
Topical Workshop
Technical Co-Chair:
Rozalia Beica
Yole Developpement
Technical Co-Chair:
John Aday
Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
John Mazurowski
Penn State Electro Optics Center
Technical Co-Chair:
Peter Ramm
Fraunhofer EMFT Munich
Technical Co-Chair:
Linda Bal
Freescale Semiconductor
Technical Co-Chair:
Russell Shumway
Amkor Technology
Technical Co-Chair:
Bob Kuo
Amkor Technology

Abstract Deadline Extended to: December 20, 2013

Early Registration & Hotel Deadlines: February 7, 2014

Exhibit Booths, PDCs, Registration: Available Soon

Announcement and Call for Abstracts
Topical Workshop on

Micro Systems & Devices

Download PDF
This workshop is being held as a part of the Device Packaging Conference

Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Russell Shumway
Amkor Technology

MEMS Organizing Committee:
Thomas Baginski, Auburn University
David Fries, Univ. South Florida
Silvia Garre, Freescale Semiconductor
Li-Anne Liew, NIST
Phil Reiner, CGI Federal Systems
Peter Tortorici, Medtronic

Submit Abstracts | Submit PDC Proposals
Registration Information | Hotel Reservations

Speaker Info | Student Competition
Exhibition Details | Floorplan | 2014 Exhibitors | 2013 Exhibitors
Global Business Council (GBC) Spring Conference
Spring Golf Invitational | Texas Hold'em Tournament

Workshop Announcements: Advanced 3D Packaging | Flip Chip & Wafer Level Packaging | Microsystems & Devices |
Photonics & LED Packaging

Microsystems & Devices Workshop Focus:
The objective of the Micro Systems & Devices Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of miniaturized systems, including meso-scale, MEMS, NEMS and other miniaturized electromechanical systems and devices. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies related to advanced miniaturized electromechanical technology.

Abstracts are being requested on the following topics:

  • MEMS Sensors & Actuators
  • Meso-Scale Devices
  • Microfluidics & Bio-MEMS
  • Deployable Environmental Sensors
  • NEMS devices & Systems
  • Optical MEMS (MOEMS)
  • Integrating MEMS and NEMS
  • Micromachined Passive Devices
  • Crawling & Flying Micro-Robots
  • Innovative Materials and Processing
  • Sensors for Precision Agriculture
  • Polymer and Laminated Micro Devices
  • System Integration of Micro Devices
  • Energy Scavenging
  • Thermal Management Devices
  • Automotive & Aircraft Sensors

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than December 20, 2013, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 24, 2014. A post-conference USB containing the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please contact Brian Schieman by email at or by phone at 412-368-1621 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before January 10, 2014 at: or contact Brian Schieman by email at or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2014 - so book early!

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 10th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line at no later than December 20, 2013.

Please contact Brian Schieman by email at or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.



ALLVIA - Event Sponsor


Registration Information: (Early Registration Deadline: February 1, 2014)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) USB of presentations; USB will contain the extended abstract and presentation as submitted by the presenter. USB will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 2/1/14
Advance/Onsite Fee
After 2/1/14
IMAPS Member
Chapter Officer
Exhibits Only Pass w/ Lunch Included
Exhibits Only Pass NO Lunch Included
8x10 Exhibit (Member)
8x10 Exhibit (Non-Member)
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions..


Hotel Reservation Deadline - February 7, 2014

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate: $162 + Taxes

On-Line Reservations

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.


Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions.

The Device Packaging student review committee will evaluate all student papers/posters and award at a total of $3,000 in awards checks at/following the Conference: $1500 first prize, $1000 second prize, and $500 third prize. The selected student(s) must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


Speaker Dates/Information:

  • Abstracts Deadline: December 20, 2013
  • Speaker Notification Emails: January 6, 2014
  • Extended Abstract or Abstract Book Materials due: January 24, 2014
  • Hotel Reservation Deadline: February 1, 2014
  • Early Registration Deadline: February 1, 2014
  • Speaker Bios Due: March 1, 2014
  • Powerpoint/Presentation file for CD-Rom due not later than: March 13, 2014 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

DPC/GBC Premier Sponsors:

DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: Amkor Technology

DPC/GBC Premier Sponsor: ASE US, Inc.

Event Sponsors:

Post-Conference Presentations USB Drives:

ALLVIA - Event Sponsor

Sponsor - Conference Lanyards:
Hole Sponsor: NAMICS


Golf Sponsors:

"Eagle" Sponsors:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.

DPC/GBC Premier Sponsor: ASE US, Inc.

"Birdie" Sponsor:
"Birdie" Golf Sponsor: Amkor Technology

Golf Hole Sponsors:


Student Paper Competition

Student Paper Competition Sponsor - The Microelectronics Foundation


Media Sponsors:

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IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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