11th International Conference and Exhibition on
Device Packaging

Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona USA

Conference and Technical Workshops
March 17-19, 2015
Exhibition and Technology Showcase
March 17-18, 2015
Professional Development Courses
March 16, 2015
GBC Spring Conference
March 15-16, 2015

In conjunction with the Global Business Council (GBC) Spring Conference, March 15-16

Courtesy of Rensselaer Polytechnic Institute

Courtesy of US Army RDEDCOM AMRDEC

Announcement and Call for Abstracts
Device Packaging 2015 Technical Track on

Engineered Micro Systems & Devices
(Including MEMS & Sensors)

Abstract Deadline Extended: December 5, 2014
Early Registration & Hotel Deadlines: February 2015

Technical Co-Chair:
Robert Dean
Auburn University
Technical Co-Chair:
Russell Shumway
Amkor Technology

MEMS Organizing Committee:
David Fries, Univ. South Florida
Silvia Garre, Freescale Semiconductor
Tracy Hudson, U.S. Army AMRDEC
Bruce Kim City, Univ. of New York
Li-Anne Liew, UC Boulder / NIST
Eric Macdonald, Univ. Texas El Paso
Dragica Vasileska, Arizona State Univ

Submit Abstracts | Submit PDC Proposals
Registration Information | Hotel Reservations

Speaker Info | Student Competition

DPC Technical Tracks:
Advanced 3D Packaging | Flip Chip & Wafer Level Packaging | Microsystems & Devices | Photonics, LEDs & Emerging

Engineered Microsystems & Devices Workshop Focus:
The objective of the Engineered Micro Systems & Devices Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of engineered miniaturized systems, including 3-D printing, laser machining, plating, MEMS/NEMS, fractal-enhanced, biomimicry and other miniaturized electro- and/or mechanical systems and devices.

Abstracts are being requested on the following topics:

  • MEMS/NEMS Devices & Systems
  • Sensors & Actuators
  • Crawling & Flying Micro-Robots
  • Deployable Environmental Sensors
  • Fractals/Chaos Enhanced Devices
  • Microfluidics & Bioengineering
  • 3-D Printing
  • Advanced Photovoltaics
  • Harsh Environment Applications
  • Innovative Materials and Processing
  • Laser Machining
  • Plated Structures and Devices
  • Biomimetics
  • Energy Scavenging
  • Thermal Management Devices
  • Selective Laser Sintering

Those wishing to present their work at the Device Packaging Conference must submit a ~500 word abstract electronically no later than December 5, 2014, using the on-line submittal form at: No formal technical paper is required. A reproduction-ready two- to six-page concise summary ("extended abstract") with text (figures and graphs included if necessary) will be required for the abstract booklet on Friday, January 23, 2015. A post-conference USB containing the full presentation material as supplied by authors will be mailed after the event to all attendees. Please contact Brian Schieman by email at or by phone at 412-368-1621 if you have questions.

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Device Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space, please fill out the application form before February 1, 2015 at: or contact Brian Schieman by email at or by phone at 412-368-1621. The exhibits have sold out every year since 2006 and we expect a sell-out again in 2015! We advise you to book early - before January 1 - as we had more than 13 exhibitors on a wait-list in 2014!

Device Packaging Professional Development Courses (PDCs):

For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 16th, preceding the technical conference. PDC details and registration on-line soon.

If you would like to participate as an instructor, please submit a description of your short course on-line at no later than December 5, 2014.


Please contact Brian Schieman by email at or by phone at 412-368-1621 if you have questions about the technical program, exhibits, golf or PDCs.



Registration Information: (Early Registration Deadline: February 1, 2015)

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, exhibits, meals, refreshment breaks, and one (1) USB of presentations; USB will contain the extended abstract and presentation as submitted by the presenter. USB will be mailed 15 business days after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Early Fee
Through 2/1/15
Advance/Onsite Fee
After 2/1/15
IMAPS Member
Chapter Officer
Exhibits Only Pass w/ Lunch Included
Exhibits Only Pass NO Lunch Included
8x10 Exhibit (Member)
8x10 Exhibit (Non-Member)
Professional Development Course:
Each Course Registration is additional to the conference registration. Maximum of 1 morning course and one afternoon course can be selected. Attendees can opt for $0 exhibits only pass if they wish to take a PDC but NOT attend the conference/sessions..

Hotel Reservation Deadline - February 2015

Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
(The Fort McDowell Yavapai Nation will re-launch the Radisson Fort McDowell Resort as the new We-Ko-Pa Resort & Conference Center effective October 1, 2014)
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264

IMAPS Discounted Single/Double Room Rate:SOON

On-Line Reservations - SOON

Phone Reservations: (480) 789-5300
Mention IMAPS or IMAPS Device Packaging when booking by phone

Hotel Scams Alert!
All reservations should be made directly with the hotel and within the IMAPS room block. We are not using a housing company. If any person or firm contacts you and offers to handle your reservations, please beware. They are completely unauthorized and possibly fraudulent. The convention industry is currently plagued by such groups. If you use one of them and experience any problems, including lost deposits and no reservation when you arrive, IMAPS may not be able to assist you. Please be aware in particular of one of these unauthorized firms – Exhibition Housing Services – whose salespeople have falsely claimed to be calling from IMAPS.

The only way to book a room in the official IMAPS Housing Block using the reservations information above.

Student Competition sponsored by The Microelectronics Foundation:

The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops (ATWs) and Conferences. Students submitting their work and identifying that "Yes, I'm a full-time student" on the abstract submission form, will automatically be considered for these competitions.

The Device Packaging student review committee will evaluate all student papers/posters and award at a total of $3,000 in awards checks at/following the Conference: $1500 first prize, $1000 second prize, and $500 third prize. The selected student(s) must attend the event to present his or her work and receive the award.

The Microelectronics Foundation


Speaker Dates/Information:

  • Abstracts Deadline Extended: December 5, 2014
  • Speaker Notification Emails: December 19, 2014
  • Extended Abstract or Abstract Book Materials due: January 23, 2015
  • Hotel Reservation Deadline: February 1, 2015
  • Early Registration Deadline: February 1, 2015
  • Speaker Bios Due: March 1, 2015
  • Powerpoint/Presentation file for CD-Rom due not later than: March 19, 2014 (Last day of Conference)
  • Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to prior to event)
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A) - Keynotes: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no officially "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. Most speakers tend to be in business pants and button down/company logo shirts (Women in dresses or the same). Suits, sport coats and ties are common as well. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

Device Packaging/GBC Sponsors

Premier Sponsor:
DPC/GBC Premier Sponsor: Solid State Equipment Corp.

Premier Sponsor:

Golf Hole Sponsor: Amkor Technology

Premier Sponsor:
DPC/GBC Premier Sponsor: ASE US, Inc.

Sponsor - Badge Lanyards:
Hole Sponsor: NAMICS


  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic
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