IMAPS Home
Members Only
Login
About IMAPS
Events Calendar
Online Store
Membership
Chapters/Committees
Global Business Council
Industry News
Publications
Careers
IMAPS Microelectronics Foundation
Contact Us

International Conference and Exhibition on
Device Packaging

www.imaps.org/devicepackaging

Doubletree Paradise Valley Resort
Scottsdale, Arizona USA


Conference and Technical Workshops
March 19-22, 2007
Exhibition and Technology Showcase
March 20-21, 2007
Professional Development Courses
March 19, 2007
GBC Spring Conference
March 18-19, 2007

EARLY REGISTRATION, EXHIBIT DISCOUNT, AND HOTEL DEADLINES:
FEBRUARY 9, 2007

In conjunction with the Global Business Council (GBC) Spring Conference, March 18th & 19th
$100 discount if attending both Device Packaging and GBC


Courtesy of FlipChip International, LLC

Courtesy of Rensselaer Polytechnic Institute
General Chair:
Andrew Strandjord
FlipChip International
andrew.strandjord@flipchip.com
Technical Co-Chair:
Beth Keser
Freescale Semiconductor
Beth.Keser@freescale.com
Technical Co-Chair:
Jon Aday
Amkor Technology Inc.
jaday@amkor.com
Technical Co-Chair:
Christo Bojkov
MAXIM-DallasSemi
christo.bojkov@dalsemi.com
Technical Co-Chair:
James J.-Q. Lu
Rensselaer Polytechnic Institute
luj@rpi.edu

Register On-Line | Hotel Reservations
Technical Program | Program PDF
Exhibition | Reserve Booth(s) On-line
| Floorplan | 2007 Exhibitors
Global Business Council (GBC) Spring Conference


Professional Development Course (PDCs)

Morning Professional Development Courses
8:00 am – Noon

Monday, March 19

Area Array Microelectronics Package Reliability (PDC1)
Course Leader: Amaneh Tasooji, Arizona State University

Course Description:
The objective of this workshop is to provide an overview on area array package reliability, analysis and tools and bestow awareness on critical factors impacting microelectronics packaging reliability.
 
Area Array microelectronic packages with small pitch and large I/O count grid array are used in commercial and military applications such as in aerospace, medical, telecommunication, transportation, etc. Reliability and risk assessment analysis of these widely used packages is a critical element of product design and field support. Current practice in reliability focuses on thermal cycling of manufactured components and monitors the component failure under the accelerated test conditions (ATC) representing the factory and OEM assembly, shipping and storage, and on/off environment of most electronic products (user interface). Acceleration Factor (AF) is then determined using ATC data and the performance of the package under “use condition;” hence, the package service reliability is predicted by extrapolation and application of AF. Statistical methods and life prediction methodologies are used in conjunction with local/global elastic and/or inelastic stress/strain analysis in component reliability assessment.

This workshop briefly reviews Area Array design and discusses reliability approach, analysis and tools. Solder joint reliability is discussed in detail by reviewing the published ball grid and column grid array (BGA/CGA) data, and evaluating the impact of various parameters (e.g., materials, design, and processing parameters) on it. Deformation and failure mechanisms influencing reliability of solder joints are discussed in detail and current life prediction models and failure modes such as brittle/ductile fracture, creep, fatigue, corrosion, and over-aging are discussed to further extend and reinforce the intended learning. Solder joint microstructure and the Inter-Metallic Compounds (IMC) evolutions that may take place during thermal processing and/or product application (isothermal and cyclic aging), and their impact on reliability are discussed by reviewing the Optical and Scanning Electron Microscopy images and characterization data. 
 
Who should attend?
Engineers in R&D, QA, QC, manufacturing, process development, and advanced technicians. It is assumed that participants have some familiarity with area array packages and general device assembly technologies.

Dr. Amaneh Tasooji has more than 23 years of industrial and academic experience in engineering, manufacturing, and e-business. She received her Ph.D. in Materials Science and Engineering from Stanford University in 1982 and has a B. S. degree in Physics. Dr. Tasooji has extensive/diverse technical knowledge in materials and processing, component design, manufacturing, quality, and supply chain in many industries such as microelectronics, aerospace, and nuclear. She has had many technical and leadership responsibilities while at Honeywell/AlliedSignal and has developed many materials behavior, deformation, and fracture models to improve life prediction and design capabilities, thereby increasing product reliability. Dr. Tasooji is the recipient of many technical/engineering and leadership awards including ASTM Sam Tour Award for distinguished contribution to research, development, and evaluation of corrosion testing and modeling. She holds a patent on “Adaptive Knowledge Management System for Vehicle Trend Monitoring, Health Management and Preventive Maintenance,” and has technical licenses for computer software on “Predicting Stress Corrosion Cracking in Nuclear Fuel Rods.” Dr. Tasooji has developed and delivered many graduate engineering courses (e.g., “Introduction to Micro-electronic Packaging,” “Overview of Materials Science and Engineering for Microelectronics Packaging,” “Advanced Packaging Analysis and Design: Material Considerations,” and “Nuclear Materials”) and many undergraduate courses (e.g., “Structure and Properties of Materials” and “Physical Metallurgy”) at Arizona State University. She has leveraged new technology and e-learning concepts in developing web-based learning tools to be used in conjunction with face-to-face teaching, while emphasizing Interactive Learning concept.

Hermeticity Testing, RGA and “Near Hermetic” Packaging (PDC2)
Course Leader: Thomas J. Green, TJ Green Associates LLC

Course Description:
Hermeticity of electronics packages and hermeticity test techniques continue to be of critical importance to the microelectronics packaging community.  Specifically, for MEMS, OLEDs, wafer scale packaging, optoelectronic devices, bio-medical implants and packaging for Military and Space.  In contrast to a hermetic cavity style package, "near hermetic" packages are being developed that rely on polymeric materials, such as LCP, to produce a package with just enough moisture protection to survive in the intended end use environment.

This course begins with an overview of hermetic sealing processes.  The class will then examine the accepted leak test techniques as prescribed in Mil Standard 883 Test Method 1014. This misunderstood test method is often a source of frustration.  The basic science behind helium fine leak testing (both the fixed and flexible methods) will be presented. Difficulties and limitations in fine leak testing of small volume packages is a major industry concern, especially among the Space community. Issues with bomb times and pressures, measured leak rate vs. air leak rates,  “one way leakers,” virtual leakers will be addressed, along with gross leak testing; bubble, weight gain, etc. In each case the focus will be on practical issues facing the industry. 

Recently techniques have been developed that measure both gross and fine leaks in the same pass. Optical Leak Test (OLT) is a method that employs a laser interferometer to measure out of plane deflection on a lid surface in response to a changing pressure and, relates these measurements to an equivalent helium leak rate.  Cumulative Helium Leak Detection (CHLD) is a variation on conventional leak detection that allows for gross and fine leak testing in the same pass and the potential for helium leak detection at leak rates several orders of magnitude lower than that available with conventional leak detection methods. The gas inside a package is measured using Residual Gas Analysis. What is RGA (Residual Gas Analysis)? How does it relate to hermeticity testing? Is the current 5,000 PPM level valid for next generation devices?  Besides moisture, what other gases are of concern? 

Packages made from polymeric materials as opposed to traditional hermetic seals (i.e. metal, glasses, and ceramics) require a different approach from a testing standpoint. The problem is now one of moisture diffusion through the barrier and package interfaces. A brief review of the techniques and methods to evaluate a "non-hermetic" approach is presented.

Special Course Material:
All attendees will receive a complimentary copy of “Hermeticity of Electronic Packages” by Hal Greenhouse, Noyes Publications 2000 (List price $167).
                               
Who Should Attend?          
This PDC is intended as an introductory to intermediate level course for process engineers, designers, quality engineers, and managers responsible for sealing, leak testing and RGA results and for those responsible for evaluating package designs requiring hermetic or "near hermetic" packages.

Thomas J. Green is the Principle at TJ Green Associates LLC, a Veteran owned small business devoted to providing world class teaching and consulting services in microelectronics packaging.  As an independent consultant Tom's been responsible for numerous successful projects in the area of wirebond, die attach and package seal and associated leak test.  As an Adjunct Professor at the National Training Center for Microelectronics he designs curriculum and teaches industry short courses relating to advanced microelectronics manufacturing processes. He has over twenty-five years of experience in the microelectronics industry at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified microcircuits (Hybrids, MCMs and RF modules) for military and commercial communication satellites. He has conducted experiments and presented technical papers at NIST and IMAPS on leak testing techniques and optimization of seam welding processes through statistical DOE methods. Tom is an active member of IMAPS and a Fellow of the Society. He has a B.S. in Materials Engineering from Lehigh University and a Masters from the University of Utah.

Advanced Thermal Management and Packaging Materials (PDC3)
Course Leader: Carl Zweben, Advanced Thermal Materials Consultant

Course Description:
Advanced thermal materials can help solve two of the most critical packaging problems: thermal management and delamination/fracture of Copper/Low-k (Cu/Low-k) ICs.  The key causes of the latter are thermal stresses arising from differences in coefficient of thermal expansion (CTE) of the IC and substrate.  Use of lead-free solders, which have higher processing temperatures, increases thermal stresses, intensifying the problem.  In response to these critical needs, there have been revolutionary advances in thermal management and packaging materials in the last few years.  There are now over 15 low-CTE, low-density materials with thermal conductivities ranging between that of copper (400 W/m-K) and 1700 W/m-K, and many others with lower conductivities.  Some are low cost.  Others have the potential to be low cost in high-volume.  Carbon fiber-reinforced epoxy constraining layers can tailor substrate and PCB CTE to match that of silicon, potentially eliminating the need for underfill.  They also can increase thermal conductivity significantly, allowing heat removal from the bottom, as well as the top of a chip.  Advanced materials also will be increasingly important for 3D packages as heat loads increase.  Low-CTE solders under development will provide additional advantages. 

Current production systems include servers, laptops, cellular telephone base stations, hybrid electric vehicles, traction motor controls, aerospace power systems, phased array antennas, and a variety of optoelectronic products, such as telecommunication equipment and plasma displays.  Components include substrates, PCBs, PCB cold plates/heat spreaders, heat sinks, thermal interface materials (TIMs), microelectronic packages, RF packages, power modules, thermoelectric cooler modules, and laser diode and LED packages.  For example, IBM has used diamond particle-reinforced silicon carbide server heat spreaders that have a thermal conductivity of over 600 W/m-K.

Advanced material payoffs include:

  • increased reliability
  • reduced thermal stresses and warpage
  • potential elimination of underfill
  • simplified thermal design
  • reduction/elimination of fans, heat pipes, liquid cooling and refrigeration
  • reduced weight and size
  • reduce cooling power requirements
  • increased battery life
  • increased stiffness and strength
  • enablement of hard solders by minimizing CTE mismatches 
  • increased manufacturing yield
  • reduced system cost
This course covers the large and increasing number of advanced thermal management and packaging materials, providing an in-depth discussion of properties, manufacturing processes, applications, cost, lessons learned, typical development programs, and future directions, including carbon nanotubes.  Traditional materials are discussed for reference.  Participants are invited to bring their thermal management problems for discussion.

Who Should Attend?
Engineers, scientists and managers involved in microelectronic, optoelectronic and MEMS/MOEMS packaging design, production and R&D; packaging material suppliers.

Dr. Zweben, now an independent consultant, directed development and application of advanced thermal management and packaging materials for over 30 years.  He was formerly Advanced Technology Manager and Division Fellow at GE Astro Space, where he directed the Composites Center of Excellence, and was the first to use Al/SiC.  Other affiliations have included Du Pont, Jet Propulsion Laboratory and the Georgia Institute of Technology NSF Packaging Research Center.  Dr. Zweben was the first, and one of only two winners of both the GE One-in-a-Thousand and Engineer-of-the-Year awards. He is a Life Fellow of ASME, a Fellow of ASM and SAMPE, an Associate Fellow of AIAA, and has been a Distinguished Lecturer for AIAA and ASME.  He has published and lectured widely on advanced thermal management and packaging materials.

Break: 10:00 am – 10:20 am


Afternoon Professional Development Courses
1:00 pm – 5:00 pm

Reliability Methodologies for Fiber Optic Components (PDC4)
Course Leader: David Maack, JDS Uniphase

Course Description:
The quantification of reliability for fiber optic components is a broad, complex and difficult issue primarily driven by three factors. The first is the myriad of different technologies, processes and materials used to make an endless variety of active and passive products. The second is the rapid product evolution coupled with short product life cycles. The third is that many of these components exhibit extremely high reliability making quantification very difficult. This course  outlines the mathematics, methodologies, procedures and tricks of the trade to set up, run and determine the reliability of fiber optic components. It is not meant to be a listing of how to make specific devices reliable or even address all the modes of failure in the various products, as this is beyond the scope of a ½ day course. Some of the specific topics included are: 1. Reliability mathematics focused on fiber optic components with EXCEL® spreadsheets showing formulas. 2. A real world approach to qualification and reliability testing with case studies and exercises. 3. Lists of pertinent components, industry specifications, standards, mathematical models and available software programs. 4. Guidelines in how to set up and maintain an adequate qualification and reliability program with many practical hints and tips.  4.  Worked examples showing how to take a device through the testing, data gathering, data analysis, and failure calculations to develop a failure rate vs. time curve at operating conditions.

Benefits and Learning Objectives
This course should enable you to:
  • Set-up a reliability and qualification lab using many 'tricks of the trade.'
  • Establish appropriate reliability tests and gather meaningful data.
  • Determine the proper statistical distribution for a set of failure data.
  • Calculate the reliability of a device using accelerated testing data with several case studies for guidance.
  • Find information on standards, components, reliability software and other reference materials.
  • Read reliability reports and determine their adequacy.
  • Find computer software to do complex reliability mathematics.
Who Should Attend?
This course is intended for a general audience with no particular background except an interest in the reliability of fiber optic components. It is meant to impart valuable information at all levels of education.

David Maack has over 15 years direct engineering and management experience in qualification and reliability programs for passive and active fiber optic components.  In addition, he is one of the authors for the new Telcordia GR-468 qualification standard for active components and the past chairman for the IEC TC-86B, Working Group 5, “Reliability Standards for Passive Fiber Optic Components”. He has authored numerous papers, has multiple patents, and is a frequent speaker.  His 30-year career in fiber optics includes engineering, manufacturing and management positions in firms producing a wide variety of passive and active fiber optic components. He has B.S. degrees in Physics and Nuclear Science along with an MBA.

Fundamentals of Packaging of MEMS and Related Microsystems and Nanomanufacturing (PDC5)
Course Leader: Ajay P. Malshe, University of Arkansas

Course Description:
Fabrication and application specific packaging of micro electromechanical systems (MEMS) is a subject of immense interest. Their application specific packaging with other components is challenging and unlike IC packaging, has a different set of demands from releasing, dicing-to-interconnection at chip-scale and manufacturing at wafer-level. This globally taught course will address silicon and non-silicon micro fabrication processes and related design details, and packaging of silicon and non-silicon MEMS and related microsystems. The course will use a range of novel applications to advocate the use of various fabrication and packaging processes. The course will also introduce a new area on the horizon “nano packaging - manufacturing.” In the broader scope of the subject, for the 21st century packaging community, infusion of signals (electrical, optical, chemical, mechanical, etc.), domains (hermetic, vacuum, fluidic, optical, etc.) and scales (nano-to-micro-macro) are of significant importance for designing and developing next generation engineered micro and nano products as well as for adding value / functions to the existing products. Particularly, key words, namely MEMS, micro systems and nano technologies have captured attention of technology leaders. MEMS and related micro systems are typically divided into two application areas: sensors and actuators. These are applied for a range of applications such as automotive, biomedical, optical, RF, etc.  Examples of systems, devices and related application specific packages are accelerometers, gyros, DMDTM, lab-on-a-chip, SMART drugs, etc. Further, with the major investment and key advancements in nanotechnology, nano integrated MEMS and related micro devices and packages are of major importance to the next generation engineered electronic systems.

Course Notes:
(1) Chapter “Packaging of MEMS and MOEMS: Challenges and A Case Study” by Drs. Malshe and O’Conner, (2) copies of the transparencies on MEMS and Nanomanufacturing, and (3) publication-“NSF-EC Workshop on Nanomanufacturing and Processing: A Summary Report,” Malshe et al., SPIE International Symposium on Smart Materials, Nano-, and Micro-Smart Systems, Melbourne, Australia, December 2002.

Specific Topics Covered:

  • Introduction to MEMS and Related Microsystems
  • Fundamentals of silicon and other related micro fabrication techniques
  • Introduction to M4 in comparison to MEMS
  • Nontraditional micro fabrication processes, such as femtosecond laser and micro EDM processing
  • Introduction to applications of MEMS and related microsystems and application specific packaging
  • System-on-a-chip vs. system-in-a-package: challenges and trade-offs for MEMS packaging
  • IC packaging vs. MEMS packaging: differences and similarities
  • Packaging and assembly of MEMS and related micro devices: role of die release, handling, dicing, attachment, interconnections, outgassing, encapsulation, wafer-level packaging, etc., for application specific MEMS and related microsystem packaging
  • Wafer-level and chip scale packaging of MEMS and related microsystems
  • Implementation of MEMS to RF, fluidics, sensors, and related applications
  • Manufacturing of related products and markets
  • Future directions: Nanomanufacturing and Integration
  • Q & A Session
Who Should Attend?
The course is meant for industry and academic leaders and investors in science and engineering with interest in MEMS and related micro and nano systems. Highly recommended for R&D scientists, engineers and managers involved in sensors, actuators, instrumentation and systems related to micro and nano systems technology. Graduate students with special interest in the above areas will also find it useful.

Ajay P. Malshe (Ph.D., 1992) is the 21st Century Endowed Chair Professor of Materials, Manufacturing Processes and Integrated Systems at the Department of Mechanical Engineering and adjunct-faculty of Electrical Engineering as well as Microelectronics and Photonics Program. He is Director of the Materials and Manufacturing Research Laboratories (MMRL; a cluster of 5 laboratories). Malshe has multidisciplinary research programs in the field of MEMS and microelectronics packaging and integration, nanomanufacturing and surface engineering for advanced machining. He has authored over one hundred twenty-five peer reviewed publications, four book chapters, and holds seven patents. His landmark scientific and engineering contributions are nano-particle composite coatings particularly cubic boron nitride - titanium nitride composite coating (cBN-TiN), electric discharge machining (electric pen lithography-EPL), wafer level chip scale packaging of MEMS and related microsystems, nano stamping of quantum structures, nano-mechanical machining system-on-a-chip, chemo-mechanical as well as laser polishing of diamond films, femtosecond laser for chemically clean nano and micro machining of difficult-to-machine materials. He has received sixteen awards for research, education and service achievements (1996-2006). The most recent prestigious recognitions, Frost & Sullivan 2005 Technology Excellence Award and 2006 Top 25 Micro and Nano Innovations from R&D Magazine and Micro/Nano Newsletter are due to his team’s invention contribution in the area of nanocomposite coating. He is a Fellow of Institute of Physics, London, UK and is listed in Lexington’s Who’s Who. He has graduated over twenty-five graduate students (PhD/MS), trained numerous post-doctoral fellows, and provided research experience to several undergraduate and high school students. He has an extensive track record of global collaborations with academic institutions and companies. Prof. Malshe is the Chief Technology Officer (CTO) of the two companies he has co-founded in the fields of nanomanufacturing (NanoMech LLC; www.nanomech.biz) and high-density Microsystems packaging (OmniPak LLC) in the state of Arkansas. He is a member of professional societies such as ASEE, ASME, IEEE, IMAPS, MRS and SME and has arranged and chaired sessions and symposia in the areas of his expertise.

Drop Test Simulation and It’s Application to IC Package Design for Handheld Consumer Electronics (PDC6)
Course Leader: Kinzy Jones, Jr., Motorola

Course Description:
This course is intended to provide the student with a broad overview of the state of the art in the prediction and elimination of IC package solder joint failures in handheld products subjected to drop impact events.

To this end the basics of explicit finite element modeling techniques will be introduced to give the student the appropriate background for more detailed discussions of how these techniques can be applied to improve package reliability in drop. 

The drop reliability of handheld products is related to the solder joint strengths of the packages and the forces and deformations that are imparted to them as a result of the overall system design.  Improving drop reliability requires understanding these forces and deformations and how they can be mitigated with appropriate system design techniques such that they do not exceed the strength of the solder joints.

The student is introduced to test techniques for determining solder joint strength and behavior during impact events.  These data are then used to develop component level solder joint models.  These models furnish the basis for simplified solder joint models that can be used in system level drop simulations.  A process for using these models to predict the risk of solder joint failure in product level drop simulations is described, and the issues inherent in this methodology are discussed. 

Finally, several methods for improving package and product level drop performance are presented.

Having completed this course, the student should have the background necessary to understand solder joint strength tests, solder joint failure modes, and the fundamentals of finite element modeling to predict solder joint failure in drop.

Who Should Attend?
This introductory course will benefit anyone who is involved in package design, pcb layout, or electrical design of handheld products.  It will provide a framework for better communication with mechanical design teams and form a basis for establishing a multi-disciplinary approach for improving the drop reliability of handheld products.

Dr. Jones is a Distinguished Member of the Technical Staff in Motorola’s Mobile Devices.  He obtained his Ph.D. from the University of California at Berkeley in Material Science and Engineering in 1999. His interests are in mechanics, spanning the entire range from fluid to structural.  His current focus is on improving the understanding of the mechanical reliability of electronic packages through mathematical modeling.  Past areas of research including thermodynamic and kinetic modeling of Pb-free solders focused on intermetallic growth, developing novel micro heat transfer devices such as chip scale heat pipes and development of LTCC MCMs with increased mechanical reliability.  He has published over 30 papers in journals and technical meetings. He is also a Motorola Six Sigma Black belt.




Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

<% rsCategory.Close() Set rsCategory = Nothing %>