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Announcement and Call for Abstracts
Advanced Technology Workshop on
Wafer Level Packaging / Embedded Packaging
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This workshop is being held as a part of the Device Packaging Conference

Abstract Deadline:  November 30, 2007

Technical Chair: Beth Keser Freescale Semiconductor Tempe, AZ 85284 Phone: 480-413-8022 Beth.Keser(AT)freescale.com	Technical Chair: Lou Nicholls Amkor Technology, Inc. Chandler, AZ 85248 Phone: 480-821-5000 lnich(AT)amkor.com
Wafer Level Packaging/Embedded Packaging Organizing Committee: Robert Hubbard, Lambda Technologies, Inc.; bhubbard(AT)microcure.com Michael Toepper, Fraunhofer IZM; toepper(AT)izm.fhg.de Thorsten Teutsch, PacTech; teutsch(AT)pactech-usa.com   Christo Bojkov, MAXIM-DallasSemi; Christo.Bojkov(AT)dalsemi.com Hong Yang, Applied Micro Circuits Corporation; hyang(AT)amcc.com Chunho Kim, Intel Corporation; chunho.kim(AT)intel.com

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Hotel Information | Speaker Information | Exhibit Information | Reserve Booth(s)

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Wafer Level Packaging / Embedded Packaging Workshop Focus:
The objective of the Wafer Level Packaging / Embedded Packaging Workshop is to have a unique forum that brings together scientists, engineers, manufacturing, academia, and business people from around the world who have been working in the area of Wafer Level packages and the emerging Embedded Chip, Chips First, and Chips Last packaging technologies. This workshop has been specifically organized to allow for the presentation and debate of some of the latest and hottest technologies out there related to these new packaging technologies. Abstracts are being requested on the following topics:

• Wafer level packaging
• Wafer bumping materials and processes
• Chips first packaging
• Embedded chip packaging
• Chips last packaging
• Assembly processes and assembly issues
• WLP and embedded chip materials & processes
• Reliability
• Thermo-mechanical modeling
• End use applications (i.e., OEM products)

Those wishing to present in the Wafer Level Packaging/Embedded Packaging sector of the Device Packaging Conference must submit a 200-300 word abstract electronically no later than November 30, 2007, using the on-line submittal form at: www.imaps.org/abstracts.htm. Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.

Device Packaging Exhibit and Technology Show:
IMAPS will hold a concurrent exhibition for vendors and suppliers who support the many aspects of Wafer Level Packaging/Embedded Packaging. This venue features an ideal atmosphere to showcase your products and services to key decision-making professionals in the industry. Full 8' by 10' exhibit spaces will be available. To reserve booth space please fill out the on-line submittal form before February 12, 2008 or contact Ann Bell by email at abell@imaps.org or by phone at 202-548-8717.

Device Packaging Professional Development Courses (PDCs):
For those wishing to broaden their knowledge of device packaging, a selection of half-day courses will be offered on Monday, March 17th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course to Jackki Morris-Joyner by email at jmorris@imaps.org no later than November 30, 2007.

Interested in Exhibits? Contact Ann Bell - abell@imaps.org
Interested in becoming a Speaker/Chair? Contact Jackki Morris-Joyner - jmorris@imaps.org
Interested in helping organize the 2008 Conference? Contact Brian Schieman - bschieman@imaps.org

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HOUSING
Hotel Reservation Deadline - February 12, 2008
Housing accommodations must be made directly to:

Radisson Fort McDowell Resort & Casino
10438 North Fort McDowell Road
Scottsdale/Fountain Hills, AZ 85264
$209/night
Rooms on hold March 15 – 20, 2008

For reservations, call (480) 789-5300 or (800) 333-3333 and mention IMAPS – Device Packaging Conference

Hotel availability and rates will not be guaranteed after February 12, 2008.

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Speaker Dates/Information:

• Abstracts due: November 30, 2007
• Extended Abstract or Abstract Book Materials due: February 8, 2008
• Hotel Reservation Deadline: February 12, 2008
• Powerpoint/Presentation file for CD-Rom due not later than: March 20, 2008 (Last day of Conference)
• Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)
• Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)