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Industry Initiatives
IMAPS is leading the following industry technical and business initiatives.
Global Business Council's Roadmap Initiative
The GBC intends to play a greater role in working
with the National Technical
Committee (NTC) to scout for and address
topics valuable to you, the key benefactors of our programs. We
believe that we can communicate the challenges that face the various
industry
segments we serve, and that we can turn them into action items
to be addressed by the IMAPS technical community.
One
way to do this is through the well-proven roadmap process. Excellent
roadmaps already
exist with methods in place to update
them on a
regular basis. We looked at the International Technology Roadmap
for Semiconductors
(ITRS) and International Electronics Manufacturing Initiative
(iNEMI) roadmaps which both have chapters on semiconductor assembly
and packaging.
The GBC intends to take the
ITRS and iNEMI roadmaps output on semiconductor assembly and packaging
and communicate it throughout the IMAPS community
and the NTC, so that we can drive our actions toward developing the capabilities
needed to meet the roadmap challenges. We will focus on the gaps identified
in the roadmaps that are barriers to the success of the market segments
identified in the roadmaps (Automotive, Medical, Aerospace & Defense,
Communications, Computer, and Consumer). In the coming months, as our
plans take shape, you will hear more from us about this initiative.
View Complete Roadmap - PDF | PPT
LTCC Standards Initiative
IMAPS has organized an LTCC Special Interest Group comprised of the professionals and companies that have a vital interest in this technology. This initiative is designed to produce a set of unified standards that define the LTCC product and process through out the supply chain. These standards can then form the basis for clear communication and specification of materials and products between users.
Mission:
To provide an impartial forum for all levels of the LTCC supply chain in order to meet and deliberate under non-competitive circumstances without anti-trust implications in order to advance the use of standards to the industry.
LTCC Standards Initiative Website:
We have developed an on-line, invitation-only workgroup via a dedicated IMAPS LTCC Sharepoint Website. From this site, you will be able to: stay connected with the members of this special interest group; learn about future meetings and events for this initiative; and participate in the development of LTCC standards.
For more information on how to get involved with this initiative, contact Michael O'Donoghue, IMAPS Executive Director, at modonoghue@imaps.org.
3D Consortium
The 3D Packaging Workshop of the Device Packaging 2007 Conference featured an evening Panel Session on “Roadmap of 3D Integration and Packaging”, on
Wednesday, March 21st, 4:00 pm - 6:00 pm, followed by a reception sponsored by the EMC-3D Consortium. Consortium members presented on their Process and equipment development in support of the Consortium technology roadmap. Future intiatives by this Consortium will be held withe Device Packaging 2008 and IMAPS events.
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