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Topical Workshop and Tabletop Exhibit on
Military, Aerospace, Space and Homeland Security (MASH):
Packaging Issues and Applications
The Conference Center at the Maritime Institute
692 Maritime Boulevard
Linthicum Heights, MD 21090
April 29 - 30, 2008
Co-located with the ATW on Advanced Substrates – April 30th & May 1st
www.imaps.org/substrates
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Exhibits
April 29-30, 2008 |
Workshop & Events
April 29-May 1, 2008 |
General Chair:
Tom Green
TJ Green Associates LLC
Phone: 610-625-2158
Email: tgreen1@ptd.net |
Technical Chair:
Norman Helmold
NASA Goddard Space Flight Center
Phone: 301-286-8177
Email: norman.c.helmold@nasa.gov |
Exhibiting Companies
Here are the companies
that have already reserved exhibit space:
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Advanced Cooling Technologies
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AI Technology, Inc.
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AOS Thermal Compounds
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CPS Technologies
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Custom Analytical Services
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Dyconex, Inc.
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ESL ElectroScience
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GPD Global, Inc.
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Hesse & Knipps
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Kyocera America, Inc.
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L. Gordon Packaging
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Linden Photonics, Inc.
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Metro Circuits, division of PJC Technologies, Inc.
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Oneida Research Services, Inc.
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Quantum Leap Packaging
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Remtec, Inc.
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Sonoscan, Inc,.
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sp3 Diamond Technologies, Inc.
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StratEdge Corporation
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Teledyne Microelectronics
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Thin Film Technology, Inc.
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Twilight Technology, Inc.
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West-Bond, Inc.
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IMAPS-International Microelectronics And Packaging Society
and The Microelectronics Foundation
Everything in electronics between the chip and the system!
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001 | Fax: 202-548-6115 |
E-mail: imaps@imaps.org |
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