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Advanced Technology Workshop and Tabletop Exhibits on
Packaging the Next Generation of Nano Devices

June 14-15, 2012
College of Nanoscale Science and Engineering (CNSE)
NanoFab South Rotunda and Auditorium
257 Fuller Road
Albany, New York 12203 USA

Tabletop Exhibits
Tabletops are now SOLD OUT

General Chair:
Benson Chan
Endicott Interconnect

Technical Chair:
Bruce Chamberlin
IBM Corporation
Technical Chair:
Ray Fillion
Fillion Consulting

Tabletops are now SOLD OUT

The International Microelectronics And Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held June 14th and June 15th, in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

The workshop will feature techincal sessions, dedicated exhibit hall times, and various networking opportunities.


Thursday, June 14 - 3:00pm - 7:00pm (Reception in the Exhibit Area)
Friday, June 15 - 10:00am - 2:00pm
(Break and Lunch in the Exhibit Area)


Exhibit Set-Up:
Thursday, June 14 - 12:00 - 3:00pm (must be done setting up before opening)

Friday, June 15 - 2:00 pm


Tabletop space is offered at:

Early Fee
Through 5/25/12
Advance/Onsite Fee
After 5/25/12
Tabletop Exhibit (Member)
Tabletop Exhibit (Non-Member)
Premier Sponsorship (Includes Tabletop)

What's Included?

Tabletop space will include 6 foot table, and 2 chairs. Basic electrical will be included if located near wall jacks. Dedicated electrical needs or other questions should be directed to the hotel.

1 booth personnel badge is included as complimentary with each tabletop. Additional booth badges will be available for a fee to cover meals. Full session badges are at an additional cost and must be registered separately.

Exhibiting Companies:

The following companies will be on display at the sold-out exhibition at this workshop:

Advance Circuit Technology
Avid Associates, Inc.
Besi North America, Inc.
Endicott Interconnect Technologies, Inc.
Hesse & Knipps, Inc.
Oneida Research Services, Inc.
SST International
Utz Technologies, Inc.

Exhibit Questions?:

IMAPS Staff, Brian Schieman, 202-548-8715 or


Hotel Reservations:

There is no contracted "Host Hotel" for this Workshop.
Here are some hotel options in the area that you can book rooms directly with:

Desmond Hotel & Conference Center - Hotel Website
660 Albany Shaker Road
Albany, NY

1228 Western Avenue
Albany, NY

Fairfield Inn Albany SUNY - Hotel Website
1383 Washington Avenue
Albany, NY

Hilton Garden Inn Albany Medical Center - Hotel Website
62 New Scotland Avenue Suite 1
Albany, NY

Travelodge Inn And Suites Albany - Hotel Website
42 Wolf Road
Albany, NY



© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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