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Advanced Technology Workshop and Tabletop Exhibits on
Packaging the Next Generation of Nano Devices

April 30-May 1, 2013
College of Nanoscale Science and Engineering (CNSE)
NanoFab South Rotunda and Auditorium
257 Fuller Road
Albany, New York 12203 USA

Tabletop Exhibits
Tabletops Have SOLD OUT

General Chair:
Ray Fillion
Fillion Consulting
fillion.consulting@gmail.com

Technical Chair:
John Torok
IBM Corporation
jtorok@us.ibm.com
Technical Chair:
Jing Zhang
IBM Corporation
jingzhan@us.ibm.com

In collaboration with:

CNSE - University of Albany

Binghamton University

Register Tabletop On-line (SOLD OUT)
Nano Home | Exhibiting Companies
Hours | Cost | Hotel Info


 

The International Microelectronics Assembly and Packaging Society (IMAPS) is organizing an Advanced Technology Workshop and Tabletop Exhibition on “Packaging the Next Generation of Nano Devices” to be held April 30 and May 1 in Albany, New York.

Overview: With each new generation of high density devices, the packaging community faces ever more difficult challenges. Diverse technologies such as: 3D, 2.5D, silicon carrier, MEMs, Hybrid electro-opto packages, etc require different packaging technologies, different materials, different processing, testing etc. All these variables are the focus of this conference which will be held in the heart of New York State's premier silicon device fabrication center. We hope that you will come and join us to see the progress of the industry and see where it is headed.

The workshop will feature techincal sessions, dedicated exhibit hall times, and various networking opportunities.

Hours

Tuesday, April 30 - 3:00pm - 7:00pm (Reception in the Exhibit Area)
Wednesday, May - 10:00am - 3:30pm
(Break and Lunch in the Exhibit Area)

Set-up/Dismantle

Exhibit Set-Up:
Tuesday, April 30 - 11:00am - 3:00pm (must be done setting up before 3:30pm Break)

Dismantle:
Wednesday, May 1 - 3:30 pm

Cost

Tabletop space is offered at:

Type
Early Fee
Through 4/20/13
Advance/Onsite Fee
After 4/20/13
Tabletop Exhibit (Member)
$275
$300
Tabletop Exhibit (Non-Member)
$300
$325
Premier Sponsorship (Includes Tabletop)
$1000
$1000

Register On-line

What's Included?

Tabletop space will include 6 foot table, and 2 chairs. Basic electrical will be included if located near wall jacks. Dedicated electrical needs or other questions should be directed to the facility.

1 booth personnel badge is included as complimentary with each tabletop. Additional booth badges will be available for a fee to cover meals. Full session badges are at an additional cost and must be registered separately.

Exhibiting Companies:

The following companies will be on display at the sold-out exhibition at this workshop:


AI Technology, Inc.
DS&A, LLC
Endicott Interconnect Technologies, Inc.
Finetech, Inc.

GM Systems, LLC
Hesse Mechatronics, Inc.

IPG Photonics
LFG Micro

LINTEC OF AMERICA
Lyons & Associates
Newport Corporation
Oneida Research Services, Inc.
Proton Onsite

Utz Technologies, Inc.
YINCAE Advanced Materials, LLC.

Exhibit Questions?:

IMAPS Staff, Brian Schieman, 202-548-8715 or bschieman@imaps.org

 


Hotel Reservations:

There is no contracted "Host Hotel" for this Workshop.
Here are some hotel options in the area that you can book rooms directly with:

Desmond Hotel & Conference Center - Hotel Website
660 Albany Shaker Road
Albany, NY

BEST WESTERN SOVEREIGN - www.sovereignhotels.com
1228 Western Avenue
Albany, NY

Fairfield Inn Albany SUNY - Hotel Website
1383 Washington Avenue
Albany, NY

Hilton Garden Inn Albany Medical Center - Hotel Website
62 New Scotland Avenue Suite 1
Albany, NY

Travelodge Inn And Suites Albany - Hotel Website
42 Wolf Road
Albany, NY

 

 


© Copyright 2010 IMAPS - All Rights Reserved
IMAPS-International Microelectronics And Packaging Society and The Microelectronics Foundation
611 2nd Street, N.E., Washington, D.C. 20002
Phone: 202-548-4001

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