Honeywell

IMAPS Advanced SiP

2019 Conference and Exhibition on
ADVANCED SYSTEM IN PACKAGE (SiP) TECHNOLOGY
Program | Registration | Exhibition | Sponsorship

Monterey Marriott
350 Calle Principal | Monterey, California - USA
June 25-27, 2019

 


REGISTRATION NOW OPEN!

The top global event for Advanced System-in-Package technologies!
Combining the 3D ASIP and IMAPS SiP events into an exciting, comprehensive program:
One event covering SiP technology developments, solutions and business trends.

www.advancedsip.org

REGISTER ONLINE | REGISTRATION INFO | HOTEL & GROUND TRANSPORT | WINE & DINE TICKETS
SPEAKER DETAILS | EXHIBITION | SPONSORSHIPS



 

Thank you to our PREMIER Sponsors:

Premier Sponsor: Amkor Technology

Thank you to our PRESENTING Sponsors:

Presenting Sponsor - JCET Group   2 Available

Thank you to our EVENT Sponsors:

Several Available

Official Media Sponsor:

Supporting Media Sponsor:


 

General Chair:
Nozad Karim
VP, Amkor Technology

Technical Chairs:
Rozalia Beica, DOW Chemical

Mark Scannell, CEA
Rich Rice, ASE

Session Leaders::
Eelco Bergman, ASE
Eric Beyne, IMEC
Caprice Gray, Draper
Urmi Ray
Jan Vardaman, TechSearch
Markus Wimplinger, EVG
Farhang Yazdani, BroadPak
Fang Yu, Qualcomm

IMAPS has established the Advanced System-in-Package conference to focus exclusively on innovative SiP technology developments, solutions and business trends. Advanced SiP 2019 will be a high-end event that combines the IMAPS System-in Package Conference and the 3D ASIP Conference (recognized as the premier conference on 2.5/3D ICs, focused on commercialization and infrastructure). Advanced SiP 2019 will offer cutting-edge presentations from scientists, technologists and business leaders across the globe in cellular, IoT, automotive, computing and networking market segments.

"Advanced SiP technology" is an umbrella term to cover a variety of SiP subsets, such as laminate/glass/ ceramic/silicon/leadframe based SiP, Fanout SiP, Heterogeneous integration, 2.5D/3D SiP and modules. Advanced SiP 2019 covers two major segments: microelectronic system design and system integration in a package.

The current trend is to integrate a full system or subsystem in an extremely miniaturized, smaller volume package structure with high functioning system performance, mechanical reliability, thermal management and high yield manufacturability.

Featuring two and a half days of technical sessions, panel discussions, exhibits and local networking activities, Advanced SiP 2019 will provide dynamic learning and technology updates on SiP trends and new engineering innovations from the industry’s global SiP leaders.

 


TUESDAY, JUNE 25, 2019 


Registration: 7:00am - 7:00pm
Breakfast in Foyer: 7:00am - 8:00am

Tabletop Exhibition in the Foyer: 9:30am - 5:45pm
Refreshment Breaks will be held in the Exhibit Area (Foyer)


TUESDAY MORNING
SESSION

TA1:
KEYNOTES AND MARKETING & TECHNOLOGY TRENDS
Chair: Rozalia Beica, Global Director, DuPont

8:00am-8:45am

Welcome & Conference Chair Opening + System in Package Solutions for 5G Technology Needs
General Chair: Nozad Karim, VP, Amkor Technology

8:45am-9:30am

Trends in SiP for Mobile Devices and IoT: Driving the Volumes
Jan Vardaman, CEO, TechSearch International

9:30am-10:30am

Break in the Exhibits

10:30am-11:15am

SiP Trends in Automotive
Romain Fraux, CEO, SystemPlus

11:15am-12:00pm

TITLE TBD
Hamid Azimi, VP, Intel Corporation

 

Lunch Break: 12:00pm - 1:30pm

 

TUESDAY AFTERNOON
SESSION

TP1:
SYSTEM INTEGRATION & SiP CHALLENGES FOR CELLPHONE, IoT, CONSUMER, AUTOMOTIVE,
COMPUTING AND NETWORKING PRODUCTS

Chair: Farhang Yazdani, BroadPak

1:30pm-2:00pm

Future 2.5/3D Technologies in AI Era
Mitsumasa Koyanagi, Tohoku University

2:00pm- 2:30pm

SiP Solutions mobile/IoT/HPC
Jean Trewhella, Director, GLOBALFOUNDRIES

2:30pm- 3:30pm

Break in the Exhibits

3:30pm-4:00pm

Material Challenges and Solutions for Advanced System-in-Package
Mike Tsai, North America Technical Customer Service Engineering Manager, Henkel Corporation

4:00pm-4:30pm

Advance in Material for SiP Solutions
Rick Hemond, CMO, DuPont

4:30pm-5:00pm

Advance in Substrate for SiP Solutions
Hannes Voraberger, Head of R&D, AT&S

5:00pm- 5:45pm

Networking Break in the Exhibits

Followed by START-UP SESSION

START-UP SESSION
5:45pm - 7:15pm
Session Chairs: Rozalia Beica & Farhang Yazdani

Tentative Agenda:

  • Opening comments – short introduction of the session and how it will take place, who are the companies participating and the jury panel
  • Start-up pitches
  • Jury deliberation
  • Announcement & award ceremony of the winning team

Presentation topics: 

  • problem/need/opportunity
  • solution
  • market
  • business model
  • marketing strategy
  • competitive landscape
  • customer access in the market
  • traction to date
  • financials
  • team (relevant skills & experience mix, motivation)
  • funding to date and amount of investment you are seeking

Criteria that jury will use for rating the presentations: 

  • Innovative: product/service, business model, and/or route to market
  • Scalable: international commercial potential & scalable business model
  • Team: relevant skills & experience mix
  • Market: clear & large market opportunity
  • Status: must have full time dedicated team and product/service in the market with early traction (customers and/or users)

The jury panel will be comprised of representative of investor community and executives from the industry. Jury Panel: TBD

 


WEDNESDAY, JUNE 26, 2019 

Registration: 7:00am - 5:00pm
Breakfast in Foyer: 7:00am - 8:00am

Tabletop Exhibition in the Foyer: 9:30am - 3:45pm
Refreshment Breaks will be held in the Exhibit Area (Foyer)

 

WEDNESDAY EARLY MORNING
SESSIONS

WA1:
SiP PRODUCTS & APPLICATIONS
Chair: Rich Rice, Senior VP, ASE

WA2:
ASSEMBLY & MANUFACTURING
Chair: Markus Wimplinger, EVG

8:00am-8:30am

Title TBD
David Lu, Vice President, New Technology, Vivo 

Bonding Technology for High Density 3D IC Manufacturing
Thomas Uhrmann, Director, EVG

8:30am-9:00am

Electromagnetic Interference (EMI) Challenges for 5G Mobile Devices
Sam Karikalan, Senior R&D Manager, Broadcom

Soldering Materials Challenges for Heterogeneous Integration & Assembly 
Sze Lim, Regional Product Manager, Indium Corporation

9:00am-9:30am

Dynamic Design and Design-in Reusability -- a Long Overdue Value Proposition for SiPs
Erik Welsh, Octavo

Die-to-Wafer Hybrid Bonding Developments done on a High Speed Flip-Chip Bonder
Pascal Metzger, CEO, SET Corporation

9:30am-10:30am

Break in the Exhibits

WEDNESDAY LATE MORNING
SESSIONS

WA3:
SiP MANUFACTURING & PROCESS TECHNOLOGY
Chair: Rich Rice, Senior VP, ASE

WA4:
DESIGN
Chair: Mark Scannell, CEA

10:30am-11:00am

Heterogeneous Integration SiP for Smart Device
Vincent Liao, Director, ASE

Packaging Solutions for AI/HPC and 5G Megatrend
Farhang Yazdani, President & CEO, BroadPak Corporation

11:00am-11:30am

Packaging Challenges & Solutions in the Age of 5G
Michael Liu, Director, JCET Group

Title TBD
Speaker TBD

11:30am-12:00pm

Cost Effective Solutions for System Integration
Dongkai Shangguan, Flex

Title TBD
Speaker TBD

 

Lunch Break in Exhibits: 12:00pm - 1:15pm

 

WEDNESDAY EARLY AFTERNOON
SESSIONS

WP1:
SiP ENABLING MATERIALS & TOOLS
Chair: Eelco Bergman, ASE

WP2:
RESEARCH & DEVELOPMENT
Chair: Eric Beyne, IMEC

1:15pm-1:45pm

Advanced Low Loss Materials for the 5G SiP Era
Toshihisa Nonaka, Technical Director, Packaging Solution Center, Hitachi Chemical Co., Ltd.

System-Technology Co-optimization (STCO) Enabling 3D Heterogeneous Integration Technologies
Eric Beyne, IMEC Fellow, Program Director 3D System Integration, IMEC

1:45pm - 2:15pm

Title TBD
Jeb Flemming, 3D Glass Solutions

Monolithic 3D Integration: New Systems Enabled by New Nanotechnologies
Max Shulaker, MIT

2:15pm - 2:45pm

Inline Process Control and Inspection: Enabling the Next Generation of Advanced SiP Manufacturing
David Adler, CEO and President, SVXR

Embedding Technologies for Heterogeneous System Integration
Tanja Braun, Karl-Friedrich Becker, Andreas Ostmann, Rolf Aschenbrenner, Martin Schneider-Ramelow, Klaus-Dieter Lang, Fraunhofer IZM

2:45pm - 3:45pm

Break in the Exhibits

Exhibition ends (tabletop tear-down) at conclusion of break

WEDNESDAY LATE AFTERNOON
SESSIONS

WP3:
SiP DESIGN, SIMULATION & TEST SOLUTIONS
Chair: Eelco Bergman, ASE

WP4:
APPLICATION
Chair: Fang Yu, Qualcomm

3:45pm-4:15pm

SiP Layout and Analysis Design Tool/Flow Considerations for Mobile Applications
John Park, Product Management Director, Cadence Design Systems

Innovative Fine Pitch Architectures Dedicated to Image Sensors: from Hybrid Bonding to 3D Sequential Integration
Jean Michailos, 3D Integration Senior Program Manager, STMicroelectronics

4:15pm-4:45pm

Keysight’s ASIC Packaging, Design Methodologies, and Test Solutions for SiP & HI
Jesse Rebeck, ASIC Design & Packaging Manager, Keysight Technologies, Inc.

Heterogeneous Integration, 2.5D TSV and Beyond
Rick Reed, Amkor Technology

4:45pm-5:15pm

System Level Test Considerations for SiP
Anil Bhalla, Director of Marketing and Business Development, Advantest Test Solutions (ATS)

High Density Hybrid Bonding for W2W and D2W Stacking, and its Applications
Sitaram Arkalgud, Xperi

 

 


 

Sip at SiP -- An exclusive wine and dine experience

Bus Departs at 5:30pm

IMAPS Advanced SiP Sponsorships & Exhibit Opportunities

$125 per person (ticket) -- limited to first 50 participants
Join Advanced SiP 2019 conference colleagues for a special evening experience at the Folktale Winery & Vineyards in Carmel, California. Guests will enjoy a private tour of the winery, a barrel tasting, and dinner with Folktale wines on the patio of the intimate vineyard house.

 

REGISTER ONLINE -- Select Wine Ticket(s) under "Sessions"

 

 


THURSDAY, JUNE 27, 2019 

Registration: 7:00am - 11:00am
Breakfast in Foyer: 7:00am - 8:00am

NO EXHIBITS THURSDAY

 

THURSDAY MORNING
SESSION

THA1:
SiP PACKAGING RESEARCH
Chair: Caprice Gray, Draper

8:00am-8:30am

Integrating 2D and 3D Additive Technologies for Wireless and Microwave Systems
Craig Armiento and Alkim Akyurtlu, University of Massachusetts, Lowell

8:30am-9:00am

Challenging the Limits in Heterogeneous Microsystems Packaging
Mitchell Meinhold, The Charles Stark Draper Laboratory, Inc.

9:00am-9:30am

An Innovative Model for Highly Successful Large-scale Industry-Academic Collaborations
Rao Tummala, Distinguished and Endowed Chair Professor Emeritus, Georgia Institute of Technology

9:30am-10:00am

Title TBD
Speaker TBD

10:00am-10:30am

Break in the Foyer

THURSDAY MORNING
PANEL SESSION

PANEL SESSION ON:
SiP CHALLENGES AND SOLUTIONS

Chairs: Urmi Ray; Jan Vardaman, TechSearch International

10:30am-12:00pm

This panel session will address the increasingly complex problems of design and simulation tools for heterogeneous systems, especially for packages including advanced CMOS (e.g., 7 or 5nm), III-V (SiGe etc) as well as conventional analog nodes. The panelists will also address testing (ATE, System test) for packages including optical and high speed SERDES, HBM memory

Panelists:
Dave Adler, SVXR
Vincent Liao, ASE
Humair Mandavia, Zuken
John Park, Cadence
Steve Strauss, Amkor

*More Panelists Soon*

CLOSING REMARKS

 

REGISTER ONLINE

wine

 


 

Sponsorship and Exhibition Opportunities

IMAPS Advanced SiP Sponsorships & Exhibit Opportunities

Limited event sponsorship opportunities are available and won’t last long. Contact Brian Schieman at bschieman@imaps.org to secure your organization’s sponsorship for SiP 2019 before they are filled. View the Exhibitor/Sponsor Prospectus for all the package options, pricing, and more.

A TABLETOP EXHIBITION will be held in conjunction with the technical program on June 25th and 26th. This event will be limited to 22 tabletops.

Exhibiting Companies:

 

REGISTER ONLINE

 

 

 


Speaker Dates/Information:

  • Program Notification: January 2019
  • Early Registration Deadline: May 24, 2019
  • Speaker 2-3 sentence biography due not later than: June 1, 2019
  • Powerpoint/Presentation file for DOWNLOAD due not later than: June 27, 2019
  • Powerpoint/Presentation file used during session:
    • Speaker's responsibility to bring to session on USB
    • Recommended to have back-up on personal laptop/usb/cloud or email to bschieman@imaps.org prior to event
  • Technical Presentation Time: 30 minutes (25 to present; 5 for Q&A)
  • Keynote Presentation Time: 45 minutes (40 to present; 5 for Q&A)

Presentation Format/Template:
IMAPS does not require you to use a conference powerpoint template.
You are able to use your regular company/preferred powerpoint templates.
Please include the IMAPS show name and dates on your template and/or an IMAPS logo.

Dress Code:
There is no official "dress code" for IMAPS Conferences. We ask you to be BUSINESS CASUAL or whatever more you prefer. We do not recommend casual attire.

Session rooms will be equipped with:
Screen, projector, podium, IMAPS laptop (with Microsoft Windows and recent OFFICE suite), microphone, and slide remote/laser pointer.

All session presentations are 25 minutes followed by 5 minutes for Questions
You are required to load your powerpoint/presentation onto the session laptop yourself using your USB drive.
Speak with your session chair if you need assistance.

About the Session:
Sessions begin with Session Chairs making general announcements. Session Chairs will then introduce speakers by reading BIOs. Speaker will present for 25 minutes, followed by 5 minutes for questions. Session Chairs will thank the speakers. This process is repeated for each speaker in the session. Many sessions will take refreshment breaks (see program).

Photography is not permitted in the session rooms.

Silence all mobile phones during session attendance.

 


Registration Information: (Early Registration Deadline: May 24, 2019) - REGISTER ONLINE

Member, Non-member, Speaker/Chair, Student and Chapter Officer registration fees include: access to all technical sessions, meals, refreshment breaks, and one (1) DOWNLOAD of presentations; download will contain the presentations as submitted by the presenter. Download will be available after the event. Also includes a one-year IMAPS individual membership or membership renewal at no additional charge which does not apply to corporate or affiliate memberships. All prices below are subject to change.

Type
Early Fee
Through 5/24/2019
Advance/Onsite Fee
After 5/24/2019
IMAPS Member
$950
$1,050
Non-Member
$1,050
$1,150
Speaker
$650
$750
Session Chair
$650
$750
Student
$300
$400
Chapter Officer
$650
$750
Tabletop Exhibit
(includes: 1 six-foot tabletop and chairs, 1 booth personnel registration with meals included, attendee lists, recognition in program and on website) -- Exhibit/Sponsor Prospectus for details and other sponsor options
$950 IMAPS members
$1050 nonmember
$1050 IMAPS members
$1150 nonmember
Premier Event Sponsorship
(includes: 2 tabletop exhibit spaces, 4 attendee registrations, print advertisement in programs, flyer/giveaway distributed to all attendees, promotional product giveaway, logo/advertisement on event webpages) -- Exhibit/Sponsor Prospectus for details and other sponsor options
$10,000
$10,000
Presenting Sponsorship
(includes: 1 tabletop exhibit, 2 attendee registration, print advertisement in programs, flyer/giveaway distributed to all attendees, logo/advertisement on event webpages) -- Exhibit/Sponsor Prospectus for details and other sponsor options
$7,500
$7,500
Sip at SiP - Wine & Dine
($125/person - additional fee to your registration fee above)
Join Advanced SiP 2019 conference colleagues for a special evening experience at the Folktale Winery & Vineyards in Carmel, California. Guests will enjoy a private tour of the winery, a barrel tasting, and dinner with Folktale wines on the patio of the intimate vineyard house.
$125/ticket
$125/ticket



Hotel Information: (Hotel Deadline: May 24, 2019)

The Monterey Marriott is host to the conference program and the official conference housing block.
The Marriott is located in the heart of historic downtown Monterey and is one of the premier hotels near famous Cannery Row.

Monterey Marriott Hotel
350 Calle Principal
Monterey, California 93940 USA

Hotel Cutoff: May 24, 2019

Single/Double Room Fee: $261 + taxes/fees

Online Hotel Reservations

Phone Reservations: 1-831-649-4234 - Mention IMAPS When Booking

Ground Transportation:

For arrivals into Monterey Regional Airport (MRY) (Recommended):

MRY services 40 daily arrivals and departures on United Airlines and American Airlines carriers. This regional airport is approximately a 10 minute taxi or rideshare (Uber/Lyft) from the Monterey Marriott. To reduce your ground transportation time, arrival into MRY is highly recommended.

  • RECOMMENDED: Taxis and rideshare services (Uber and Lyft) operate from the Monterey airport.
  • Car rental services are available at MRY from several providers. Please note that valet parking is $25 per night at the Monterey Marriott. Public parking is available nearby for $7 per night.
  • The Monterey Salinas Transit (MST) provides bus service to/from the airport. For current route list, system maps, fares and travel tips visit mst.org.
  • The hotel does NOT provide shuttle service.

For arrivals into San Jose Mineta Airport (SJC) or San Francisco International Airport (SFO):

San Jose Mineta Airport (SJC) is approximately 70 miles from the Monterey Marriott, and the San Francisco International Airport (SFO) is approximately 100 miles.

  • RECOMMENDED: The Monterey AirBus services both SJC and SFO with nearly hourly shuttle transportation. Tickets are available online and the best pricing is available with advance ticket purchases. To learn more about schedules, drop-off and pick-up locations, or purchase your ticket, visit www.MontereyAirbus.com.
  • Car rental services are available at each of these airports. Please note that valet parking is $25 per night at the Monterey Marriott. Public parking is available nearby for $7 per night.
  • Taxis and rideshare services such as Uber or Lyft are available at each of these airports, though fares will be very high. Anticipate 1.5-2hrs of travel time each way via car or rideshare.

Monterey

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic