KESTER

About IMAPS

IMAPS Mission Statement
IMAPS leads the Microelectronics Packaging, Interconnect
and Assembly Community, providing means of
communicating, educating and interacting at all levels.
 

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 3,000 members in the United States and more than 3,000 international members around the world.

Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS hosts a variety of technical workshops and conferences and professional development courses that enable these professionals to enhance their careers. In addition, the Microelectronics Foundation provides annual grants to students involved in electronic packaging disciplines.

In 1996, the original Society, ISHM, merged with the International Electronic and Packaging Society (IEPS) to become IMAPS (International Microelectronics And Packaging Society), the leading international microelectronics and electronic packaging organization. With this immense growth, IMAPS conducts 30 meetings each year that offer a full spectrum of educational and marketing opportunities to the microelectronics and packaging professional. IMAPS symposia, conferences, and workshops feature preeminent presentations of the ongoing work in the industry worldwide. Exhibitions and trade shows highlight the latest product and service applications of the current technology. IMAPS meeting attendees are able to meet and exchange ideas and information with the best and brightest professionals in the international microelectronics and packaging industry.

 

CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems