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Field	Abstract	Abstract Text
Abstract No:	07auto018	Kyocera has developed a new alumina multi-layer ceramic substrate called ¡§Power Control Substrate¡¨. With this new technology, both power and control circuits can be combined into one substrate, which will provide a unique substrate solution for automotive power control applications. Typically, power control units are made of two separate substrates. The first substrate is the control, or logic, circuit and the second substrate is power circuit. In many instances, the control substrate is a printed circuit board and the power substrate is a copper-bonded ceramic substrate. With the Kyocera Power Control Substrate, these two separate substrates can be integrated into one ceramic substrate, with the resulting footprint smaller than the two substrates it replaces. To achieve high power handling capability, the Power Control Substrate has a thick conductor called a ¡§Trough¡¨. The trough is composed of tungsten and copper, and it has the same thickness as one ceramic layer, which can range from 0.15mm to 0.20mm thick. To prevent cracking at the ceramic/metal interface, the CTE of the Trough has been matched to the CTE of the ceramic by creating an composite conductor comprising of 55 vol% tungsten and 45 vol% copper. The Trough can be placed either internally, or on the surface of the substrate, and at 0.20mm thick, the Trough can have conductivity as low as 0.25 mƒÇ/sq. Furthermore, with a thermal conductivity as high as 150 W/mK, the Trough provides an effective means of thermal dissipation for power devices. This paper will demonstrate the reliability of the power control substrate after component assembly. The substrate will be exposed to temperature cycling ranging from ¡V40 to 125C, and we will confirm that the Trough will experience no resistance variation, nor lack of adhesion between the metal and the ceramic.
Event:	Automotive_2007
Paper Title:	A New Alumina Multi-Layer Substrate for Power Control Unit
Author:	Masamitsu Onitani
Author's Company:	Kyocera Corporation
Job Title:	Research and Development
Phone:	+81-995-45-5200
City:	Kirishima, Kagoshim 899-4312
State:
Country	Japan
Email:	masamitsu.onitani.gt@kyocera.jp
Keywords:	power circuit thick conductor CTE

Field	Abstract	Abstract Text
Abstract No:	07auto031	The Automotive market for Integrated Power Modules (IPMs) is growing steadily with new and developing applications being driven by the need for greater fuel efficiency, reduced emissions, improved safety and comfort features for the driver and the emergence of the hybrid vehicle market. This growth is being accompanied by a demand for higher integration, increased performance, zero defects and greater power densities. Typical metallised substrate technologies such as Insulated Metal (IMS) and Direct Bonded Copper (DBC) substrates are employed as carriers for the power components such as IGBTs and MOSFETs. These high power devices must be mounted to a heatsink which is generally located on the base of the module. Printable Thick Film technology, realised on Alumina (Aluminium Oxide Ceramic) substrates enables the lower power, signal-level control circuitry to be mounted on a separate substrate positioned above the high-power substrate thus optimising the level of integration whilst minimising the footprint of the module for maximum power density. Thick Film packaging technology is widely used in harsh environments where extremes of power / thermal dissipation and humidity are to be found. The technology has been a main stay of the Automotive Industry for many years in applications demanding of safety and reliability, such as ECUs, ABS and more recently, in Electronic Stability Control (ESC) programs. Thick Film offers considerable flexibility of design and manufacture being easily adapted to both small batch and high volume requirements. It is ideally suited to providing high reliability control circuitry in power module applications where ambient temperatures may range from -55degC to +150degC and where conventional PCB assemblies fall short in meeting stringent performance criteria. This paper describes the flexibility and benefits offered by Thick Film Ceramic Substrate technology for power module applications such as Electric/Electronic Power Steering, Integrated Starter Alternators, Hybrid electric Powertrain controllers and other power management requirements.
Event:	Automotive_2007
Paper Title:	The Use of Thick Film Hybrid Circuits in Automotive Power Modules
Author:	Ken Henderson
Author's Company:	C-MAC MicroTechnology
Job Title:	General Manager - Automotive
Phone:	+44 1493 743125
City:	Dollar, Scotland FK14 7EB
State:
Country	UK
Email:	kenhenderson@cmac.com
Keywords:	thick film ceramic hirel

Field	Abstract	Abstract Text
Abstract No:	07auto025	Packaging technology is a key component for modern micromachined sensor devices. It contributes significantly not only to the total product costs, but also to the functionality of MEMS components. In addition, footprint becomes more and more critical as the number of sensors in cars continuously increases. Following the general trend of reducing the size of the MEMS devices to a minimum, the impact of package on the electrical performance of those sensors increases drastically, e.g. due to coupling of mechanical package stress to the MEMS chip. Based on these facts it is pretty clear that MEMS sensor package is a key component and a real differentiator on the market for many applications. A thorough understanding of the influence of material set and detailled package design on the electrical performance and lifetime is a prerequisite to guarantee high precision and high quality sensor products. In this contribution, we will present some key results based on investigations on very small leadless packages like QFN or land grid arrays (LGA) for inertial and pressure sensors.
Event:	Automotive_2007
Paper Title:	Small Leadless Packages for Sensors in Automotive Applications
Author:	Dr. Martin Holzmann
Author's Company:	Robert Bosch GmbH
Job Title:	Section Manager Sensor Development
Phone:	+49-7121-35-39744
City:	Reutlingen, Baden-Württenberg 72762
State:
Country	Germany
Email:	martin.holzmann@de.bosch.com
Keywords:	Sensor Packaging Stress Coupling Reliability

Field	Abstract	Abstract Text
Abstract No:	07auto006	Thermal resistant property of siloxane-modified epoxy compositions designed for long-term and high temperature storage was investigated. For light emitting diodes (LEDs) applications, the encapsulants must be transparent and thermal stable. The optical property of conventional epoxy base encapsulants, such as Diglycidyl ether of bisphenol A epoxy, would be dramatically degraded under high temperature working environment. In this study, we developed two siloxane-modified epoxy compositions to improve the thermal stability of conventional epoxy encapsulant. One was siloxane epoxy containing composition, and the other was cyclic aliphatic siloxane dianhydride cured compostion. We selected triglycidyl ether terminated Phenylmethylsiloxnae-co- dimethylsiloxne (GT-1000), which was compatible with the diglycidyl ether of bisphenol A epoxy (Epon-828), to partial replaced the epoxy resin and was cured by liquid anhydride (MHHPA). We also synthesized 5, 5’-(1, 1, 3, 3-tetramethyl disiloxane-1, 3-dilyl)-bis-norborane-2, 3-dicarboxylic anhydride (A1) as MHHPA co-curing agent to cure Epon-828. The thermal resistance was studied by the difference of yellow index (ΔYI) after heat treatment. In 110 deg.C storage experiment, when GT-1000 was added 0.2 equivalent, theΔYIs were 1.51 and 4.01 after 1000 h and 2000 h, which was less than the composition without GT-1000 (Epon-828/MHHPA, ΔYI = 6.74) after 1000 h. When GT-1000 was added from 0.2 to 0.5 by equivalent, the ΔYI decreased from 4.01 to 2.15 after 2000 h. In cyclic-aliphatic siloxane dianhydride co-curing compositions, when the contents of A1 were 0.05 and 0.1 equivalent, the ΔYIs were 2.28 and 0.72 after 1000 h, respectively. Compared with Epon-828/MHHPA composition, the addition of GT-1000 and A1 were effective for thermal resistance. Moreover, the ΔYI of Epon-828/MHHPA with 0.2 equivalent of GT-1000 was 0.07 and that of Epon-828/MHHPA was 1.49 after IR-reflow at 260 deg.C for 10 second. The results revealed the siloxane-modified epoxy compositions had excellent thermal resistant property for high performance LED applications.
Event:	Automotive_2007
Paper Title:	The Study of Thermal Resistant Enhancement of Siloxane-Modified LED Transparent Encapsulants
Author:	Chia-Wen Hsu
Author's Company:	Industrial Technology Research Institute
Job Title:
Phone:	+886-3-5915235
City:	Hsinchu, Taiwan 310
State:
Country	ROC
Email:	musinghsu@itri.org.tw
Keywords:	thermal resistance LED encapsulant siloxane-modified epoxy

Field	Abstract	Abstract Text
Abstract No:	07auto010	Due to their intrinsic reliability in harsh conditions, LTCC Circuits have found their way into electronic circuitry for automotive applications. These are very dense multi layer LTCC circuits with function such as power train management. Since the reliable lifetime of a car will continue to increase, a material supplier needs to keep pace with ever more stringent demands on performance. All materials in an LTCC system including the LTCC tape, conductors for inner and top layer, resistors and overglazes for protection have to be matched together to fulfil the requested reliability. Resistors with a superior stability play a key role in an LTCC-system. The specification for resistors for automotive application requires a resistor drift of less than +/- 1% after various lifetime tests such as 1000 cycles of thermal shocks. The presentation shows the steps of development for high reliably LTCC-compatible resistor pastes and a detailed description of the various performance test methods. Further to the presentation of the physical data, pictures made by scanning microscopy give understanding as to the behaviour of laser trimmed resistors on LTCC. At the end of this challenging and time consuming development Heraeus demonstrates a complete LTCC-Material System which meets the customer’s specification and which is in the meantime fully established on the market. To meet future automotive applications, a roadmap of future products in pipeline is discussed.
Event:	Automotive_2007
Paper Title:	The Challenge of High Reliable Resistors for LTCC Circuits
Author:	Christina Modes
Author's Company:	W.C. Heraeus GmbH
Job Title:	Business Unit Manager Europe BU Thick Film
Phone:	+49 6181 354932
City:	Hanau D-63450
State:
Country	Germany
Email:	christina.modes@heraeus.com
Keywords:	Resistors LTCC Reliability

Field	Abstract	Abstract Text
Abstract No:	07auto003	Ceramic circuits made by hybrid and LTCC technology are often used for automotive applications. Highly integrated multilayer build-ups require a high level of compatibility and refiring stability of conductors, resistors and the dielectric. LTCC circuits lack the stabilizing core of alumina, therefore materials additionally need to show uniform sintering to provide mechanical stability and repeatable geometry. State of the art test procedures need to reflect on an increased mileage between service intervals, as well as elevated working temperatures. This increased reliability must be compatible with ever increasing integration density and cost sensitive large volume production processes. New multi-functional test patterns have been designed in close cooperation with automotive customers. Performance in printing on large panel geometries as well as via and line resolution are tested in the same time as the compatibility of materials. Large ground planes and corresponding top electrodes address designers actual and future expectations in break down voltage or insulation resistance at a 2 layer build-up of the dielectric. Critical active and passive components, attached by lead free solders or conductive adhesives are used for population and their reliability can be tested over a wide range of environmental conditions. The inclusion of various diameters of Au and Al bond wires then offer a detailed picture of thick film materials as a system. Test loops under harsh conditions like –40/+150°C shock cycling, long term storage at 150°C or hot fuel tests at 90°C mirror realistic situations during a vehicle’s life time. Data from these new test procedures is directly usable for all functional groups of a automotive electronics manufacturer from design to production and enables for shortened time of development and an earlier start of production.
Event:	Automotive_2007
Paper Title:	State-of-the-Art Test Procedures for Hybrid and LTCC Multilayers
Author:	Stefan Flick
Author's Company:	W.C. Heraeus GmbH
Job Title:	Manager Technical Service Europe
Phone:	+49 6181 35 4935
City:	Hanau D 61350
State:
Country	Germany
Email:	stefan.flick@heraeus.com
Keywords:	test pattern LTCC hybrid

Field	Abstract	Abstract Text
Abstract No:	07auto030	Advanced metal matrix composites developed by combining superior properties of selected particulate materials, chopped fibers and aluminum yield significant performance advantages over competing electronic material systems in automotive electronic applications. Metal matrix composites such as SiC-reinforced aluminum, graphite reinforced aluminum and diamond reinforced aluminum are among these engineered materials. Reduced weight, high thermal conductivity, high stiffness, tailored coefficient of thermal expansion, tight dimensional control, reliability in harsh environments, lower cost are the desired characteristics for many automotive applications. Engineering methods used for tailoring the properties to meet desired design requirements and to reach tight dimensional control will be outlined in this paper. This paper also describes fabrication methods how to develop these engineered metal matrix composites including perform manufacturing, pressure infiltration casting and secondary operations such as plating, coating anodizing etc. Pressure infiltration casting process is a net shape casting process not only to produce electronic housings with demanding thermal performance requirements expected from electronic material systems such as IGBT modules, but also large heat spreaders as thin as 0.010” thick used in weight sensitive electronic applications. Net shape casting process is valuable for its ability to create more complicated part geometries such as pockets, O-ring channels, embedded channels, pedestals, raised bosses etc. In-situ joining of different materials with these engineered composites is another core capability of pressure infiltration casting. Methods used to in-situ join ceramics or other metals such as titanium steel and aluminum to these engineered composites will be described in this paper.
Event:	Automotive_2007
Paper Title:	Engineered Metal Matrix Composites and Fabrication Methods for Automotive Applications
Author:	Dr. Birol Sonuparlak
Author's Company:	Rogers Corporation
Job Title:	Technical Manager
Phone:	303-618-5514
City:	Chandler
State:	AZ
Country	USA
Email:	birol.sonuparlak@rogerscorporation.com
Keywords:	Engineered Metal Matrix Composites Particulate Reinforced Aluminum Joining MMC to metals and ceramics

Field	Abstract	Abstract Text
Abstract No:	07auto004	This presentation outlines a low cost packaging solution using an open cavity QFN in conjunction with an integrated silicon capacitive sensor for Tire Pressure Monitoring Systems (TPMS). The open cavity QFN design allows for the pressure die to be attached and wire bonded after the package has been molded. For environmental protection, a lid that incorporates a hydrophobic filter is attached to the package. This QFN pressure sensor assembly uses a standard JEDEC outline leadframe, which can be attached to FR4 or other board material by standard reflow processes for ease of system integration.
Event:	Automotive_2007
Paper Title:	Small Outline Packaging of Pressure Sensors for TPMS
Author:	Robert Hunter
Author's Company:	Kavlico
Job Title:	Senior MEMS Engineer
Phone:	805-523-2000
City:	Moorpark
State:	CA
Country	USA
Email:	rhunter@kavlico.com
Keywords:	QFN TPMS MEMS

Field	Abstract	Abstract Text
Abstract No:	07auto029	The use of solid state image sensors to build inexpensive digital cameras for automotive applications has been gaining momentum in the last two years. Applications include detecting movement of nearby pedestrians, adjusting deployment of airbags to the exact location and physical characteristics of all passengers in the car, and enabling “hands-free” parking. Incorporating image sensors in automotive applications elevates the reliability requirements for the camera module when compared to the consumer market. The camera module is required to perform in harsh environmental conditions without any degradation in the performance of the image sensor. The ramifications of failure in automotive applications are much more significant than in conventional camera applications. In order to comply with these harsh requirements, the image sensor must be packaged in a way that will protect it from humidity and temperature changes while keeping the optical performance intact. One of the more common packaging technologies used today in automotive applications is the ceramic leadless chip carrier (CLCC). This has been popular because the ceramic package protects the sensor from harsh environmental conditions. However, using this technology significantly increases the overall dimensions of the camera module without providing any cost benefits to the manufacturer. The author will present a new wafer-level chip-size packaging technology compatible with automotive requirements. With this technology, the image sensor is protected from contamination using a cover glass from the initial stage of processing. The electrical contacts are then routed to the back side of the silicon to solder bumps, thus making it suitable for standard surface mount technology (SMT) assembly. Being a true chip-size technology, the packaged die is the same size as the original die. The thickness of the packaged die is significantly reduced in this technology, as well, with the final thickness being approximately half the thickness of the original silicon. This in turn allows the distance between the image sensor and the assembly board to be shorter, thus reducing the overall camera module size further. In addition, as all packaging processes are performed at the wafer level, this approach enables cost benefits from the economies of scale of wafer-level processing. The reduction in package size in both the lateral and vertical directions, the high reliability, and the economies of scale of wafer-level processing make this technology an excellent option for image sensors in automotive applications.
Event:	Automotive_2007
Paper Title:	Wafer Level Chip Size Packaging Technology Enables Miniaturization of Automotive Electronics
Author:	Giles Humpston
Author's Company:	Tessera Inc.
Job Title:	Director R&D
Phone:	011.972.54.56.88.085
City:	San Jose
State:	CA
Country	USA
Email:	ghumpston@tessera.com
Keywords:	Miniaturization Automotive Electronics Wafer-Level Chip-Size Packaging

Field	Abstract	Abstract Text
Abstract No:	07auto016	Electrically and thermally conductive adhesives have been used in automotive electronics for many years. Hybrid applications of Electronic control units are often assembled using electrically conductive adhesives (ECA) for component attached to the ceramic board which is then attached to a heat sink with a thermally conductive adhesive. The major limitation of ECA has been instability on common electronic metals such as copper and tin and therefore requires the use of expensive noble metal finished components. The on-going demand for size reduction and cost pressure on automotive electronics drives the development of new high performance adhesive materials for these applications. Enabling the use of tin finished components provides the opportunity for substantial cost savings. Improved thermal interface materials enable size reduction and increased performance of heat generating components. The unstable contact resistance of ECA on copper and tin is due to electrochemical corrosion of these metals under elevated temperature and humidity conditions. The moisture allows for the completion of the galvanic cell, which then causes the anode or lower electrochemical potential metal (copper, tin or lead) to corrode. The oxide formed during this process is non-conductive and creates a dielectric layer between the adhesive and metal. Based on the above fundamental understandings, Emerson & Cuming has developed new formulas which exhibit exceptional electrical and mechanical stability on previously unstable metals. Thermal interface materials are typically polymeric matrices loaded with high conductive particulates. In contrast to the electrical conductivity, the concentration dependence of thermal conductivity shows no jump in the percolation threshold region. Understanding the factors influencing the packing density and the heat transport, Emerson & Cuming has developed a number of materials exhibiting high thermal conductivity. The presentation will introduce the newest technologies and advanced performance capabilities of electrically conductive adhesives and thermally conductive adhesives for automotive electronics.
Event:	Automotive_2007
Paper Title:	Electrically and Thermally Conductive Adhesives for Automotive Electronics
Author:	Gunther Dreezen
Author's Company:	Emerson & Cuming
Job Title:	Market Manager, Automotive
Phone:	904-541-0568
City:	Orange Park
State:	FL
Country	USA
Email:	scott.harry@nstarch.com
Keywords:	electrically conductive adhesives thermally conductive adhesives thermal interface materials

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