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Small Outline Packaging of Pressure Sensors for TPMS
Keywords: QFN, TPMS, MEMS
This presentation outlines a low cost packaging solution using an open cavity QFN in conjunction with an integrated silicon capacitive sensor for Tire Pressure Monitoring Systems (TPMS). The open cavity QFN design allows for the pressure die to be attached and wire bonded after the package has been molded. For environmental protection, a lid that incorporates a hydrophobic filter is attached to the package. This QFN pressure sensor assembly uses a standard JEDEC outline leadframe, which can be attached to FR4 or other board material by standard reflow processes for ease of system integration.
Robert Hunter, Senior MEMS Engineer
Moorpark, CA

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