Here is the abstract you requested from the Automotive_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Direct Copper Bonded Substrates with ZrO2 Doped Alumina Ceramics for Use in Automotive Power Modules|
|Keywords: direct bond copper, automotive power modules, substrate|
|Power modules for use in hybrid electrical vehicles concepts pose special requirements to the power module manufacturers. They operate at lower voltages than standard modules, usually 600V, but have high demands in regard to material reliability and thermal resistance. Decreasing the thermal resistance of the ceramic by use of thinner and stronger ceramics for the isolation substrates is one of the possible solutions. Direct copper bonded substrates offer a significantly lower thermal resistance and have already become the standard carrier for high power, high voltage inverters and solid state relays in the industrial market. The use of advanced alumina based ceramics, especially those based on Zr doped alumina, positively influences reliability and offers attractive design options and geometries usually not available for alumina based DCB substrates. Thin Zr doped alumina DCB substrates (0.25mm/0.32mm) pose economically and technologically viable solutions to the HEV challenge. Material data and performance simulations of different substrate variations and configurations are being presented as well as an outlook into the roadmap for active cooling.|
|Alexander Roth, Product Manager
Electrovac Curamik GmbH