Abstract Preview

Here is the abstract you requested from the Automotive_2007 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Evaluation of Wire Bond Systems for Manufacturability
Keywords: wire bonding, inlay , plating
As automotive electronics evolve, interconnects between logic processor units and remote sensor/actuator components play a critical role in assuring reliability and low manufacturing cost of major control systems. These interconnects are typically aluminum wires attached by ultrasonic wire bonding. Several types of substrates are used to mount the logic microprocessors, and facilitate wire bonding attachment operations. This paper evaluates three different substrates/coatings for optimal wire bonding characteristics. The substrates/coatings are aluminum inlay, electroplated nickel phosphorous and electroplated soft gold over sulfamate nickel. Evaluations were performed including pull testing, shear testing and resulting bond “footprint” characterizations for each of the substrates. Additionally, other process parameters were varied by design of experiments (DOE) to establish discrete process manufacturing lobes that consistently and repeatedly produce cost effective, functional wire bond welds.
Lichun Leigh Chen, Manager, Engineering Development
Technical Materials Inc.
Lincoln, RI

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic